VPG Micro-Measurements

VPG Micro-Measurements

VPG Micro-Measurements is a leading company that specializes in high-precision strain gage sensors and systems. With a focus on innovation and quality, VPG Micro-Measurements offers a wide range of products to industries such as automotive, aerospace, medical, and industrial applications. The company provides advanced strain gage technologies that are designed to measure force, torque, displacement, stress, and pressure accurately. These cutting-edge technologies ensure high accuracy, reliability, and durability in even the most demanding environments. VPG Micro-Measurements is known for its ISO 9001 certified manufacturing facilities and rigorous quality control processes. The company also provides comprehensive support services, including custom sensor design, calibration, and application engineering, to meet the unique needs of each customer. With a proven track record of delivering innovative solutions, VPG Micro-Measurements continues to be a trusted partner for businesses worldwide in their quest for precise and reliable strain gage solutions.

Solder

Results:
5
Series
Composition
Form
Wire Gauge
Melting Point
Diameter
Storage/Refrigeration Temperature
Process
Flux Type
Type
Shelf Life Start
Shelf Life
Mesh Type
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VPG Micro-Measurements
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesShelf LifeShelf Life StartStorage/Refrigeration TemperatureMesh TypeTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessForm
MMF006619
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
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Wire Solder
Sn63Pb36.65Sb0.35 (63/36.65/0.35)
0.020" (0.51mm)
361°F (183°C)
Rosin Activated (RA)
24 AWG, 25 SWG
Leaded
Spool
MMF006622
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Sn63Pb37 (63/37)
0.040" (1.02mm)
361°F (183°C)
Rosin Activated (RA)
18 AWG, 19 SWG
Leaded
Spool, 1 lb (454 g)
MMF006620
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Sn63Pb36.65Sb0.35 (63/36.65/0.35)
0.020" (0.51mm)
361°F (183°C)
Rosin Activated (RA)
24 AWG, 25 SWG
Leaded
Spool, 1 lb (454 g)
MMF006630
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Quantity
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PCB Symbol, Footprint & 3D Model
-
9 Months
Date of Manufacture
41°F ~ 77°F (5°C ~ 25°C)
-
Solder Paste
Ag40Cu30Zn28Ni2 (40/30/28/2)
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1220 ~ 1435°F (660 ~ 780°C)
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-
Lead Free
Jar, 1 oz (28g)
MMF301501
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
Wire Solder
Sn95Sb5 (95/5)
0.020" (0.51mm)
450 ~ 460°F (232 ~ 238°C)
Rosin Activated (RA)
24 AWG, 25 SWG
Lead Free
Spool, 1 lb (454 g)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.