CHIPQUIK® SMD4300 Series, Solder

Results:
19
Manufacturer
Series
Mesh Type
Composition
Form
Melting Point
Storage/Refrigeration Temperature
Process
Shelf Life
Wire Gauge
Flux Type
Type
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Results remaining19
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CHIPQUIK® SMD4300
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartWire GaugeDiameterTypeCompositionMelting PointFlux TypeMesh TypeProcessFormStorage/Refrigeration TemperatureSeries
SMD4300AX10
SOLDER PASTE WATER SOL 10CC
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean, Water Soluble
3
Leaded
Syringe, 1.23 oz (35g), 10cc
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300SNL250T3
SOLDER PASTE SAC305 250G T3
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
3
Lead Free
Jar, 8.8 oz (250g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300AX250T5
SOLDER PASTE SN63/PB37 250G T5
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean, Water Soluble
5
Leaded
Jar, 8.8 oz (250g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300LTLFP250T4
SOLDER PASTE SN42/BI57.6/AG0.4
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
280°F (138°C)
No-Clean, Water Soluble
-
Lead Free
Jar, 8.8 oz (250g)
32°F ~ 77°F (0°C ~ 25°C)
CHIPQUIK® SMD4300
SMD4300AX250T3
SOLDER PASTE SN63/PB37 250G
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean, Water Soluble
3
Leaded
Jar, 8.8 oz (250g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300SNL10T5
SLD PASTE LF WATER SOL T5 10CC
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
5
Lead Free
Syringe, 1.23 oz (35g), 10cc
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300SNL10T4
SLDR PST WATR SOL SAC305 T4 10CC
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
4
Lead Free
Syringe, 1.23 oz (35g), 10cc
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300AX10T5
SOLDER PASTE WATER SOL T5 10CC
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean, Water Soluble
5
Leaded
Syringe, 1.23 oz (35g), 10cc
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300AX10T4
SLDR PST WATR SOL 63/37 T4 10CC
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean, Water Soluble
4
Leaded
Syringe, 1.23 oz (35g), 10cc
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300SNL10
SOLDER PASTE WATER SOL LF 10CC
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
3
Lead Free
Syringe, 1.23 oz (35g), 10cc
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300AX250T4
SLDR PST WATR SOL 63/37 T4 250G
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean, Water Soluble
4
Leaded
Jar, 8.8 oz (250g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300SNL500T5C
SOLDER PASTE SAC305 T5 500G
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
5
Lead Free
Cartridge, 17.64 oz (500g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300AX500T5C
SOLDER PASTE 63/37 T5 500G
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean, Water Soluble
5
Leaded
Cartridge, 17.64 oz (500g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300SNL500T4C
SOLDER PASTE SAC305 T4 500G
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
4
Lead Free
Cartridge, 17.64 oz (500g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300SNL500T3C
SOLDER PASTE SAC305 T3 500G
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
3
Lead Free
Cartridge, 17.64 oz (500g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300AX500T4C
SOLDER PASTE 63/37 T4 500G
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean, Water Soluble
4
Leaded
Cartridge, 17.64 oz (500g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300AX500T3C
SOLDER PASTE 63/37 T3 500G
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean, Water Soluble
3
Leaded
Cartridge, 17.64 oz (500g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300SNL250T5
SOLDER PASTE SAC305 250G T5
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
5
Lead Free
Jar, 8.8 oz (250g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300
SMD4300SNL250T4
SLDR PST WATR SOL SAC305 T4 250G
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
4
Lead Free
Jar, 8.8 oz (250g)
37°F ~ 46°F (3°C ~ 8°C)
CHIPQUIK® SMD4300

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.