4900 Series, Solder

Results:
7
Manufacturer
Series
Form
Storage/Refrigeration Temperature
Wire Gauge
Shelf Life
Composition
Flux Type
Type
Shelf Life Start
Melting Point
Diameter
Process
Mesh Type
Results remaining7
Applied Filters:
4900
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ImageProduct DetailPriceAvailabilityECAD ModelShelf Life StartSeriesShelf LifeMesh TypeTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
4900-454G
SOLDER LF SN96 21GAUGE 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
4900
60 Months
-
Wire Solder
Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4)
0.032" (0.81mm)
423 ~ 430°F (217 ~ 221°C)
No-Clean
20 AWG, 21 SWG
Lead Free
Spool, 1 lb (454 g)
50°F ~ 86°F (10°C ~ 30°C)
4900P-250G
LEADED NO CLEAN SOLDER PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
4900
24 Months
-
Solder Paste
SAC305
-
423 ~ 430°F (217 ~ 221°C)
No-Clean
-
Lead Free
Jar, 8.8 oz (250g)
39°F ~ 50°F (4°C ~ 10°C)
4900P-25G
LEAD FREE NO CLEAN SOLDER PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
4900
24 Months
-
Solder Paste
Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4)
-
423 ~ 430°F (217 ~ 221°C)
No-Clean
-
Lead Free
Syringe, 0.88 oz (25g)
39°F ~ 50°F (4°C ~ 10°C)
4900-18G
SAC305, Sn96.2Ag2.8Cu0.4 2PK
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
4900
60 Months
-
Wire Solder
Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4)
0.032" (0.81mm)
423°F (217°C)
No-Clean, Rosin Activated (RA)
21 AWG, 21 SWG
Lead Free
Tube, 0.74 oz (21g)
50°F ~ 86°F (10°C ~ 30°C)
4900-112G
SOLDER LF SN96 21GAUGE .25LBS
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
4900
60 Months
-
Wire Solder
Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4)
0.032" (0.81mm)
423 ~ 430°F (217 ~ 221°C)
No-Clean
20 AWG, 21 SWG
Lead Free
Spool, 4 oz (113.40g)
50°F ~ 86°F (10°C ~ 30°C)
4900-227G
SOLDER LF SN96 21GAUGE .5LBS
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
4900
60 Months
-
Wire Solder
Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4)
0.032" (0.81mm)
423 ~ 430°F (217 ~ 221°C)
No-Clean
20 AWG, 21 SWG
Lead Free
Spool, 8 oz (227g), 1/2 lb
50°F ~ 86°F (10°C ~ 30°C)
4900-35G
SOLDER LF SN96 21GAUGE 0.6OZ
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Quantity
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PCB Symbol, Footprint & 3D Model
-
4900
-
-
Wire Solder
Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4)
0.032" (0.81mm)
423 ~ 430°F (217 ~ 221°C)
No-Clean
20 AWG, 21 SWG
Lead Free
Tube, 0.60 oz (17g)
65°F ~ 80°F (18°C ~ 27°C)

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.