88 Series, Solder

Results:
7
Manufacturer
Series
Composition
Melting Point
Wire Gauge
Diameter
Form
Process
Storage/Refrigeration Temperature
Flux Type
Type
Mesh Type
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Shelf Life
Results remaining7
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88
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartSeriesMesh TypeTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
22-5050-8227
SOLDER FLUX-CORED/88 .062" 15LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
88
-
Wire Solder
Sn50Pb50 (50/50)
0.062" (1.57mm)
361 ~ 420°F (183 ~ 216°C)
Rosin Activated (RA)
14 AWG, 16 SWG
Leaded
Spool, 15 lbs (6.8kg)
50°F ~ 104°F (10°C ~ 40°C)
24-4060-8290
SOLDER FLUX-CORED/88 .020" 1LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
88
-
Wire Solder
Pb60Sn40 (60/40)
0.020" (0.51mm)
361 ~ 460°F (183 ~ 238°C)
Rosin Activated (RA)
24 AWG, 25 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-6337-8213
SOLDER FLUX-CORED/88 63/37 .031"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
88
-
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
Rosin Activated (RA)
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-6337-8267
SOLDER FLUX-CORED/88 63/37 .0240
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
88
-
Wire Solder
Sn63Pb37 (63/37)
0.040" (1.02mm)
361°F (183°C)
Rosin Activated (RA)
18 AWG, 19 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-7068-8213
SOLDER FLUX-CORED/88 .031" 1LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
88
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.031" (0.79mm)
423 ~ 424°F (217 ~ 218°C)
Rosin Activated (RA)
20 AWG, 22 SWG
Lead Free
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-9574-8213
SOLDER FLUX-CORED/88 .031" 1LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
88
-
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.031" (0.79mm)
441°F (227°C)
Rosin Activated (RA)
20 AWG, 22 SWG
Lead Free
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
26-6040-8227
SOLDER FLUX-CORED/88 .062" 5LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
88
-
Wire Solder
Sn60Pb40 (60/40)
0.062" (1.57mm)
361 ~ 374°F (183 ~ 190°C)
Rosin Activated (RA)
14 AWG, 16 SWG
Leaded
Spool, 5 lbs (2.27kg)
50°F ~ 104°F (10°C ~ 40°C)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.