SMD Series, Solder

Results:
46
Manufacturer
Series
Form
Melting Point
Composition
Diameter
Wire Gauge
Flux Type
Mesh Type
Type
Shelf Life
Storage/Refrigeration Temperature
Process
Shelf Life Start
Results remaining46
Applied Filters:
SMD
Select
ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureSeriesMesh TypeTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessForm
SMDSW.015 100G
SOLDER WIRE 63/37 TIN/LEAD NO-CL
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Wire Solder
Sn63Pb37 (63/37)
0.015" (0.38mm)
361°F (183°C)
No-Clean, Water Soluble
27 AWG, 28 SWG
Leaded
Spool, 3.53 oz (100g)
SMDSWLT.047 4OZ
SOLDER WIRE SN42/BI57/AG1 .047"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Wire Solder
Bi57Sn42Ag1 (57/42/1)
0.047" (1.19mm)
280°F (138°C)
-
-
Lead Free
Spool, 4 oz (113.40g)
SMDSWLT.047 8OZ
SOLDER WIRE SN42/BI57/AG1 .047"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Wire Solder
Bi57Sn42Ag1 (57/42/1)
0.047" (1.19mm)
280°F (138°C)
-
-
Lead Free
Spool, 8 oz (227g), 1/2 lb
SMDSWLF.008 50G
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.008" (0.20mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
32 AWG, 35 SWG
Lead Free
Spool, 1.76 oz (50g)
SMDBI100-S-16
SOLDER SHOT BI100 16OZ 454G
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Solder Shot
Bi100(100)
-
521°F (271°C)
-
-
Lead Free
Bag, 1 lb (454g)
SMDAL400C
ALUMINUM SOLDER PASTE WATER-SOLU
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
SMD
3
Solder Paste
Sn96.5Ag3.5 (96.5/3.5)
-
430°F (221°C)
Water Soluble
-
Lead Free
Cartridge, 14.11 oz (400g)
SMDIN100-S-16
SOLDER SHOT IN100 16OZ 454G
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Solder Shot
In100 (100)
-
315°F (157°C)
-
-
Lead Free
Bag, 1 lb (454g)
SMDIN52SN48-R
INDIUM SOLDER RIBBON (IN52/SN48)
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Ribbon Solder
In52Sn48 (52/48)
-
244°F (118°C)
-
-
Lead Free
Spool
SMD291SNLT6
SOLDER PASTE NO CLEAN LEAD-FREE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
SMD
6
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
422 ~ 428°F (217 ~ 220°C)
No-Clean
-
Lead Free
Syringe, 0.53 oz (15g), 5cc
SMDLTLFPT5
SOLDER PASTE NO CLEAN SN42/BI57.
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
SMD
5
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
-
281°F (138°C)
No-Clean
-
Lead Free
Syringe, 0.53 oz (15g), 5cc
SMDAL50
ALUMINUM SOLDER PASTE WATER-SOLU
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
SMD
3
Solder Paste
Sn96.5Ag3.5 (96.5/3.5)
-
430°F (221°C)
Water Soluble
-
Lead Free
Jar, 1.76 oz (50g)
SMDSWLT.047 2OZ
SOLDER WIRE SN42/BI57/AG1 .047"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Wire Solder
Bi57Sn42Ag1 (57/42/1)
0.047" (1.19mm)
280°F (138°C)
-
-
Lead Free
Spool, 2 oz (56.70g)
SMDIN52SN48
INDIUM SOLDER WIRE (IN52/SN48) 0
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Wire Solder
In52Sn48 (52/48)
0.031" (0.79mm)
244°F (118°C)
-
20 AWG, 21 SWG
Lead Free
Spool
SMDSWLF.015 2OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
-
Lead Free
Spool, 2 oz (56.70g)
SMDIN100
INDIUM SOLDER WIRE (IN100) 0.031
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Wire Solder
In100 (100)
0.031" (0.79mm)
315°F (157°C)
-
20 AWG, 21 SWG
Lead Free
Spool
SMDSWLT.040 10G
SN42/BI57/AG1 2.2 FLUX CORE SOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Wire Solder
Bi57Sn42Ag1 (57/42/1)
0.040" (1.02mm)
280°F (138°C)
No-Clean, Rosin Activated (RA)
18 AWG, 19 SWG
Lead Free
Spool, 0.35 oz (10g)
SMDSWLF.006 50G
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.006" (0.15mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean, Water Soluble
34 AWG, 38 SWG
Lead Free
Spool, 1.76 oz (50g)
SMDSWLT.040 200G
SN42/BI57/AG1 2.2 FLUX CORE SOLD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Wire Solder
Bi57Sn42Ag1 (57/42/1)
0.040" (1.02mm)
280°F (138°C)
No-Clean, Rosin Activated (RA)
18 AWG, 19 SWG
Lead Free
Spool, 7 oz (200g)
SMDSN100-S-1
SOLDER SHOT SN100 1OZ 28G
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Solder Shot
Sn100(100)
-
450°F (232°C)
-
-
Lead Free
Bag, 1 oz (28g)
SMDPB100-S-16
SOLDER SHOT PB100 16OZ 454G
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
SMD
-
Solder Shot
Pb100(100)
-
622°F (328°C)
-
-
Leaded
Bag, 1 lb (454g)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.