CHIPQUIK® Series, Solder

Results:
58
Manufacturer
Series
Form
Composition
Melting Point
Diameter
Shelf Life
Type
Storage/Refrigeration Temperature
Process
Flux Type
Mesh Type
Shelf Life Start
Wire Gauge
Results remaining58
Applied Filters:
CHIPQUIK®
Select
ImageProduct DetailPriceAvailabilityECAD ModelSeriesShelf LifeShelf Life StartStorage/Refrigeration TemperatureWire GaugeMesh TypeTypeDiameterMelting PointFlux TypeProcessFormComposition
CQ-SS-SAC405-0.50MM-25000
SOLDER SPHERES SN95.5/AG4.0/CU0.
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
24 Months
Date of Manufacture
-
-
-
Solder Sphere
0.020" (0.51mm)
423°F (217°C)
-
Lead Free
Jar
Sn95.5Ag4Cu0.5 (95.5/4/0.5)
CQ-SS-SAC405-0.30MM-25000
SOLDER SPHERES SN95.5/AG4.0/CU0.
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
24 Months
Date of Manufacture
-
-
-
Solder Sphere
0.012" (0.31mm)
423°F (217°C)
-
Lead Free
Jar
Sn95.5Ag4Cu0.5 (95.5/4/0.5)
CQ-SS-SAC405-0.60MM-25000
SOLDER SPHERES SN95.5/AG4.0/CU0.
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
24 Months
Date of Manufacture
-
-
-
Solder Sphere
0.024" (0.61mm)
423°F (217°C)
-
Lead Free
Jar
Sn95.5Ag4Cu0.5 (95.5/4/0.5)
SMDLTLFP50T6
SOLDER PASTE IN JAR 50G (T6) SN4
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
-
-
Solder Paste
-
280°F (138°C)
No-Clean
Lead Free
Jar, 1.76 oz (50g)
Sn42Bi57.6Ag0.4 (42/57.6/0.4)
CQ-SS-6040-0.76MM
SOLDER SPHERES SN60/PB40 0.76MM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
24 Months
Date of Manufacture
-
-
-
Solder Sphere
-
361°F (183°C)
-
Leaded
Jar
Sn60Pb40 (60/40)
GA100-50G
GALLIUM METAL 99.99% PURE 50G IN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Solder Paste
-
85.57°F (29.76°C)
-
-
Syringe, 1.8 oz (51.029g)
Ga100
SMDLTB35T4
SOLDER PASTE SN60/BI40 T4 35G SY
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
6 Months
Date of Manufacture
-
-
-
Solder Paste
-
280°F ~ 338°F (138°C ~ 170°C)
No-Clean
-
Syringe, 1.23 oz (35g), 10cc
Sn60Bi40 (60/40)
RMA591LT10
RMA SOLDER PASTE SN42/BI57.6/AG0
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
6 Months
Date of Manufacture
-
-
-
Solder Paste
-
280°F (138°C)
No-Clean
-
Syringe, 1.23 oz (35g), 10cc
Sn42Bi57.6Ag0.4 (42/57.6/0.4)
SMD291AX10T6
SOLDER PASTE NO CLEAN SN63/PB37
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Solder Paste
-
361°F (183°C)
No-Clean
-
Syringe, 1.23 oz (35g), 10cc
Sn63Pb37 (63/37)
JET551AX10T5
JET PRINTING SOLDER PASTE SN63/P
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Solder Paste
-
361°F (183°C)
No-Clean
-
Syringe, 1.23 oz (35g), 10cc
Sn63Pb37 (63/37)
JET551LT10T5
JET PRINTING SOLDER PASTE SN42/B
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Solder Paste
-
280°F ~ 338°F (138°C ~ 170°C)
No-Clean
-
Syringe, 1.23 oz (35g), 10cc
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
JET551SNL10T5
JET PRINTING SOLDER PASTE SN96.5
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Solder Paste
-
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
Syringe, 1.23 oz (35g), 10cc
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
SMDLTB250T4
SOLDER PASTE SN60/BI40 T4 250G J
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
6 Months
Date of Manufacture
-
-
-
Solder Paste
-
280°F ~ 338°F (138°C ~ 170°C)
No-Clean
-
Jar, 8.8 oz (250g)
Sn60Bi40 (60/40)
RMA591LT250
RMA SOLDER PASTE SN42/BI57.6/AG0
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
6 Months
Date of Manufacture
-
-
-
Solder Paste
-
280°F (138°C)
No-Clean
-
Jar, 8.8 oz (250g)
Sn42Bi57.6Ag0.4 (42/57.6/0.4)
SMD291AX250T6
SOLDER PASTE IN JAR 250G (T6) SN
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Solder Paste
-
361°F (183°C)
No-Clean
Leaded
Jar, 8.8 oz (250g)
Sn63Pb37 (63/37)
JET551AX30T5
JET PRINTING SOLDER PASTE SN63/P
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Solder Paste
-
361°F (183°C)
No-Clean
Leaded
Syringe, 3.53 oz (100g)
Sn63Pb37 (63/37)
JET551SNL30T5
JET PRINTING SOLDER PASTE SN96.5
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Solder Paste
-
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
Syringe, 3.53 oz (100g)
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
JET551LT30T5
JET PRINTING SOLDER PASTE SN42/B
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Solder Paste
-
280°F (138°C)
No-Clean
-
Syringe, 3.53 oz (100g)
Sn42Bi57.6Ag0.4 (42/57.6/0.4)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.