CHIPQUIK® Series, Solder

Results:
58
Manufacturer
Series
Form
Composition
Melting Point
Diameter
Shelf Life
Type
Storage/Refrigeration Temperature
Process
Flux Type
Mesh Type
Shelf Life Start
Wire Gauge
Results remaining58
Applied Filters:
CHIPQUIK®
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesShelf LifeShelf Life StartStorage/Refrigeration TemperatureWire GaugeMesh TypeTypeCompositionDiameterMelting PointFlux TypeProcessForm
NC2SW.015 2OZ
SOLDER WIRE 60/40 TIN/LEAD (SN60
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Wire Solder
Sn60Pb40 (60/40)
0.015" (0.38mm)
361°F ~ 370°F (183°C ~ 188°C)
No-Clean
Leaded
Spool, 2 oz (56.70g)
NCSWLF.015 0.2OZ
LF SOLDER WIRE MINI POCKET PACK
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
Tube, 0.2 oz (5.66g)
NC2SWLF.015 1OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.015" (0.38mm)
441°F (227°C)
No-Clean
-
Spool, 1 oz (28.35g)
NC2SWLF.015 2OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.015" (0.38mm)
441°F (227°C)
No-Clean
-
Spool, 2 oz (56.70g)
NCSWLF.015 1OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
Spool, 1 oz (28.35g)
NC2SWLF.015 4OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.015" (0.38mm)
441°F (227°C)
No-Clean
-
Spool, 4 oz (113.40g)
NCSWLF.015 2OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
Spool, 2 oz (56.70g)
NC2SWLF.015 8OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.015" (0.38mm)
441°F (227°C)
No-Clean
-
Spool, 8 oz (226.80g)
NCSWLF.015 4OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
Spool, 4 oz (113.40g)
NC2SW.015 1LB
SOLDER WIRE 60/40 TIN/LEAD (SN60
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Wire Solder
Sn60Pb40 (60/40)
0.015" (0.38mm)
361°F ~ 370°F (183°C ~ 188°C)
No-Clean
Leaded
Spool, 1 lb (453.592g)
SMDSN60BI40
TIN/BISMUTH SOLDER WIRE (SN60/BI
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
60 Months
Date of Manufacture
-
-
-
Wire Solder
Sn60Bi40 (60/40)
0.031" (0.79mm)
280°F ~ 338°F (138°C ~ 170°C)
-
Lead Free
Spool
SMDSWLTLFP16
SOLDER WIRE SN42/BI57/AG1 LEAD-F
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
60 Months
Date of Manufacture
-
-
-
Wire Solder
Sn42Bi57Ag1 (42/57/1)
0.030" (0.76mm)
280°F ~ 338°F (138°C ~ 170°C)
-
Lead Free
Tube
GA100-10G
GALLIUM METAL 99.99% PURE 10G IN
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Solder Paste
Ga100
-
85.57°F (29.76°C)
-
-
Syringe, 0.35 oz (9.922g)
SMDIN66.3BI33.7
INDIUM/BISMUTH SOLDER WIRE (IN66
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
60 Months
Date of Manufacture
-
-
-
Wire Solder
In66.3Bi33.7 (66.3/33.7)
0.031" (0.79mm)
162°F (72°C)
-
Lead Free
Spool
SMDIN100-0.4MM
INDIUM SOLDER WIRE (IN100) 0.016
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
60 Months
Date of Manufacture
-
-
-
Wire Solder
In100 (100)
0.016" (0.40mm)
315°F (157°C)
No-Clean
Lead Free
Spool
CQB-AU100-20UM
GOLD BONDING WIRE (AU100) GOLD 2
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Wire Solder
Au100 (100)
0.001" (0.02mm)
1947°F (1064°C)
-
-
Spool
SMDSN90AU10-2FT
SOLDER WIRE (SN90/AU10) TIN/GOLD
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
60 Months
Date of Manufacture
-
-
-
Wire Solder
Sn90Au10 (90/10)
0.016" (0.40mm)
423°F (217°C)
-
Lead Free
Spool
SMDLTLFPT6
SOLDER PASTE NO CLEAN SN42/BI57.
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
-
-
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
-
280°F (138°C)
No-Clean
Lead Free
Syringe, 0.53 oz (15g), 5cc
SMDIN52SN48-1.69X5.71-R
INDIUM/TIN SOLDER RIBBON (IN52/S
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
-
Ribbon Solder
In52Sn48 (52/48)
-
244°F (118°C)
-
Lead Free
Spool
WS991LT500T4C
THERMALLY STABLE SOLDER PASTE WS
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
6 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
-
-
Solder Paste
Sn42Bi57.6Ag0.4 (42/57.6/0.4)
-
280°F (138°C)
Water Soluble
Lead Free
Cartridge, 17.64 oz (500g)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.