CHIPQUIK® Series, Solder

Results:
58
Manufacturer
Series
Form
Composition
Melting Point
Diameter
Shelf Life
Type
Storage/Refrigeration Temperature
Process
Flux Type
Mesh Type
Shelf Life Start
Wire Gauge
Results remaining58
Applied Filters:
CHIPQUIK®
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesShelf LifeShelf Life StartStorage/Refrigeration TemperatureWire GaugeDiameterTypeCompositionMelting PointFlux TypeMesh TypeProcessForm
WS991AX500T4
SOLDER PASTE THERMALLY STABLE WS
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
6 Months
Date of Manufacture
-
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
Water Soluble
4
Leaded
Jar, 17.64 oz (500g)
WS991SNL500T4
SOLDER PASTE THERMALLY STABLE WS
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
6 Months
Date of Manufacture
-
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
Water Soluble
4
Lead Free
Jar, 17.64 oz (500g)
NCSWLF.015 1LB
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
0.015" (0.38mm)
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
-
Spool, 1 lb (453.592g)
TS991SNL35T4
THERMALLY STABLE SOLDER PASTE NC
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
4
-
Syringe, 1.23 oz (34.869g)
TS991SNL35T3
THERMALLY STABLE SOLDER PASTE NC
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Quantity
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PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
3
-
Syringe, 1.23 oz (34.869g)
WS991SNL35T4
THERMALLY STABLE SOLDER PASTE WS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
Water Soluble
4
-
Syringe, 1.23 oz (34.869g)
WS991AX35T4
THERMALLY STABLE SOLDER PASTE WS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
37°F ~ 77°F (3°C ~ 25°C)
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
Water Soluble
4
-
Syringe, 1.23 oz (34.869g)
NC2SW.015 8OZ
SOLDER WIRE 60/40 TIN/LEAD (SN60
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
0.015" (0.38mm)
Wire Solder
Sn60Pb40 (60/40)
361°F ~ 370°F (183°C ~ 188°C)
No-Clean
-
Leaded
Spool, 8 oz (226.80g)
NC2SW.015 4OZ
SOLDER WIRE 60/40 TIN/LEAD (SN60
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
0.015" (0.38mm)
Wire Solder
Sn60Pb40 (60/40)
361°F ~ 370°F (183°C ~ 188°C)
No-Clean
-
Leaded
Spool, 4 oz (113.40g)
TS991AX500T4
SOLDER PASTE THERMALLY STABLE NC
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
4
Leaded
Jar, 17.64 oz (500g)
NC2SWLF.015 4OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
0.015" (0.38mm)
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
441°F (227°C)
No-Clean
-
-
Spool, 4 oz (113.40g)
TS991SNL500T3
SOLDER PASTE THERMALLY STABLE NC
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
3
Lead Free
Jar, 17.64 oz (500g)
WS991LT500T4
SOLDER PASTE THERMALLY STABLE WS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
6 Months
Date of Manufacture
-
-
-
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
281°F (138°C)
Water Soluble
4
Lead Free
Jar, 17.64 oz (500g)
TS991SNL500T4
SOLDER PASTE THERMALLY STABLE NC
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
12 Months
Date of Manufacture
-
-
-
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
4
Lead Free
Jar, 17.64 oz (500g)
NC2SWLF.015 1LB
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
0.015" (0.38mm)
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
441°F (227°C)
No-Clean
-
-
Spool, 1 lb (453.592g)
NCSWLF.015 8OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
0.015" (0.38mm)
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
-
Spool, 8 oz (226.80g)
NC2SW.015 1LB
SOLDER WIRE 60/40 TIN/LEAD (SN60
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
0.015" (0.38mm)
Wire Solder
Sn60Pb40 (60/40)
361°F ~ 370°F (183°C ~ 188°C)
No-Clean
-
Leaded
Spool, 1 lb (453.592g)
NCSWLF.015 4OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
0.015" (0.38mm)
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
-
Spool, 4 oz (113.40g)
NC2SWLF.015 8OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
0.015" (0.38mm)
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
441°F (227°C)
No-Clean
-
-
Spool, 8 oz (226.80g)
NCSWLF.015 2OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
CHIPQUIK®
-
-
-
-
0.015" (0.38mm)
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
-
Spool, 2 oz (56.70g)

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.