WS300 Series, Solder

Results:
5
Manufacturer
Series
Form
Composition
Storage/Refrigeration Temperature
Process
Wire Gauge
Flux Type
Type
Shelf Life Start
Mesh Type
Shelf Life
Melting Point
Diameter
Results remaining5
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WS300
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartWire GaugeDiameterMesh TypeSeriesTypeCompositionMelting PointFlux TypeProcessFormStorage/Refrigeration Temperature
1354225
LOCTITE WS 300 97SCT3V 75G SYRIN
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
-
WS300
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
Water Soluble
Lead Free
Syringe, 2.65 oz (75g)
35.6°F ~ 46.4°F (2°C ~ 8°C)
1354250
LOCTITE WS 300 97SCT3V 500G SEMC
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
-
WS300
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
Water Soluble
Lead Free
Syringe, 2.65 oz (75g)
35.6°F ~ 46.4°F (2°C ~ 8°C)
1354291
LOCTITE WS 300 97SCT3V 500G JAR
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
-
WS300
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
Water Soluble
Lead Free
Jar, 17.64 oz (500g)
35.6°F ~ 46.4°F (2°C ~ 8°C)
1405650
LOCTITE WS 300 97SCDAP88V 500G J
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
-
WS300
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
Water Soluble
Lead Free
Jar, 17.64 oz (500g)
35.6°F ~ 46.4°F (2°C ~ 8°C)
1405673
LOCTITE WS 300 97SCDAP88V 500G S
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
-
WS300
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
Water Soluble
Lead Free
Cartridge, 17.64 oz (500g)
35.6°F ~ 46.4°F (2°C ~ 8°C)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.