WS200™ Series, Solder

Results:
5
Manufacturer
Series
Form
Storage/Refrigeration Temperature
Composition
Mesh Type
Melting Point
Process
Wire Gauge
Flux Type
Type
Shelf Life Start
Shelf Life
Diameter
Results remaining5
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WS200™
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartWire GaugeDiameterMesh TypeSeriesTypeCompositionMelting PointFlux TypeProcessFormStorage/Refrigeration Temperature
550014
63/37 WS200 SOLDER PASTE 75GM
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
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WS200™
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
Water Soluble
Leaded
Syringe, 2.65 oz (75g)
35°F ~ 50°F (2°C ~ 10°C)
1354296
63S4 WS200 ACP PASTE 600G SEMCO
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
3
WS200™
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
Water Soluble
Leaded
Cartridge, 21.16 oz (600g)
32°F ~ 50°F (0°C ~ 10°C)
1354298
63S4 WS200 ACP 500G JAR
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
3
WS200™
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
Water Soluble
Leaded
Jar, 17.64 oz (500g)
32°F ~ 50°F (0°C ~ 10°C)
544784
WS200 RWF 30G SYRINGE
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
3
WS200™
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
Water Soluble
Leaded
-
32°F ~ 50°F (0°C ~ 10°C)
1354222
LOCTITE WS 200 SN62T3V 700G SEMC
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
-
WS200™
Solder Paste
Sn62Pb36Ag2 (62/36/2)
354°F (179°C)
Water Soluble
Leaded
Cartridge, 24.69 oz (700g)
-

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.