ULTRAPURE® Series, Solder

Results:
18
Manufacturer
Series
Composition
Melting Point
Form
Storage/Refrigeration Temperature
Process
Wire Gauge
Flux Type
Type
Mesh Type
Shelf Life Start
Shelf Life
Diameter
Results remaining18
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ULTRAPURE®
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureWire GaugeDiameterMesh TypeSeriesTypeCompositionMelting PointFlux TypeProcessForm
44-7080-0000
SOLDER BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn95Sb5 (95/5)
450 ~ 464°F (232 ~ 240°C)
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Lead Free
Bar, 1.66 lbs (750g)
44-6040-0050
SOLDER BAR UP 60/40 1.66LB HAL F
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Quantity
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PCB Symbol, Footprint & 3D Model
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50°F ~ 104°F (10°C ~ 40°C)
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ULTRAPURE®
Bar Solder
Sn60Pb40 (60/40)
361 ~ 374°F (183 ~ 190°C)
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Leaded
Bar, 1.66 lbs (750g)
44-7040-0000
SOLDER BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn96.5Ag3.5 (96.5/3.5)
430°F (221°C)
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Lead Free
Bar, 1.66 lbs (750g)
44-7071-0000
SOLDER BAR E-BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn95.5Ag3.9Cu0.6 (95.5/3.9/0.6)
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Lead Free
Bar, 1.66 lbs (750g)
77-6337-0030
SOLDER BAR 63/37 ULD FLO 10LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn63Pb37 (63/37)
361°F (183°C)
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Leaded
Bar, 10 lbs (4.54kg)
77-6337-0050
SOLDR BAR UP 63/37 FLO-BAR 10LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn63Pb37 (63/37)
361°F (183°C)
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Leaded
Bar, 10 lbs (4.54kg)
77-6337-1930
SOLDER BAR 63/37 ULD FLO BAR 8.5
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn63Pb37 (63/37)
361°F (183°C)
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Leaded
Bar, 8.5 lbs (3.86kg)
77-7031-1900
SOLDER BAR FLO-BAR 5LB 22.5" L
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn97Cu2Sb0.8Ag0.2 (97/2/0.8/0.2)
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Lead Free
Bar, 7.4 lbs (3.36kg)
77-7033-0000
SOLDER BAR 5LB TRIANGULAR
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn97Ag3 (97/3)
430 ~ 435°F (221 ~ 224°C)
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Lead Free
Bar, 5 lbs (2.27kg)
7770680000
SOLDER BAR FLO-BAR 5LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
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Lead Free
Bar, 5 lbs (2.27kg)
77-9574-0050
SOLDER BAR FLO-BAR 5LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn99.3Cu0.7 (99.3/0.7)
441°F (227°C)
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Lead Free
Bar, 5 lbs (2.27kg)
44-6337-0050
SOLDR BAR ULTRAPURE 63/37 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn63Pb37 (63/37)
361°F (183°C)
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Leaded
Bar, 1.66 lbs (750g)
44-9574-0050
SOLDER BAR UP BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn99.3Cu0.7 (99.3/0.7)
441°F (227°C)
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Lead Free
Bar, 1.66 lbs (750g)
44-7050-0000
SOLDER BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn96.3Ag3.7 (96.3/3.7)
430 ~ 444°F (221 ~ 223°C)
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Lead Free
Bar, 1.66 lbs (750g)
44-7033-0000
SOLDER BAR BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
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ULTRAPURE®
Bar Solder
Sn97Ag3 (97/3)
430 ~ 435°F (221 ~ 224°C)
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Lead Free
Bar, 1.66 lbs (750g)
44-7000-0000
SOLDER BAR BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn99 (99)
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Lead Free
Bar, 1.66 lbs (750g)
44-7068-0000
SOLDER BAR 1.66LB SN96.5AG3CU0.5
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
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Lead Free
Bar, 1.66 lbs (750g)
44-7070-0000
SOLDER BAR 1.66LB
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Quantity
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PCB Symbol, Footprint & 3D Model
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ULTRAPURE®
Bar Solder
Sn95Ag5 (95/5)
430 ~ 473°F (221 ~ 245°C)
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Lead Free
Bar, 1.66 lbs (750g)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.