Smooth Flow™ Series, Solder

Results:
42
Manufacturer
Series
Form
Melting Point
Composition
Process
Mesh Type
Shelf Life
Storage/Refrigeration Temperature
Wire Gauge
Flux Type
Type
Shelf Life Start
Diameter
Results remaining42
Applied Filters:
Smooth Flow™
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ImageProduct DetailPriceAvailabilityECAD ModelFormShelf LifeShelf Life StartWire GaugeDiameterSeriesTypeCompositionMelting PointFlux TypeMesh TypeProcessStorage/Refrigeration Temperature
NC191AX50T5
SMOOTH FLOW LEADED SOLDER PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
Jar, 1.76 oz (50g)
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
5
Leaded
37°F ~ 46°F (3°C ~ 8°C)
NC191AX15T5
SMOOTH FLOW LEADED SOLDER PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
Syringe, 0.53 oz (15g), 5cc
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
5
Leaded
37°F ~ 46°F (3°C ~ 8°C)
NC191LTA10
SMOOTH FLOW LOW TEMP SOLDER PAST
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Quantity
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PCB Symbol, Footprint & 3D Model
Syringe, 0.35 oz (10g), 3cc
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Bi57Sn42Ag1 (57/42/1)
279°F (137°C)
No-Clean
4
-
37°F ~ 46°F (3°C ~ 8°C)
NC191LT50
SMOOTH FLOW LOW TEMP SOLDER PAST
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Quantity
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PCB Symbol, Footprint & 3D Model
Jar, 1.76 oz (50g)
6 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
280°F (138°C)
No-Clean
4
Lead Free
37°F ~ 46°F (3°C ~ 8°C)
NC191SNL50
SMOOTH FLOW LEAD-FREE SOLDER PAS
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Quantity
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PCB Symbol, Footprint & 3D Model
Jar, 1.76 oz (50g)
6 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
422 ~ 428°F (217 ~ 220°C)
No-Clean
4
Lead Free
37°F ~ 46°F (3°C ~ 8°C)
NC191SNL15
SMOOTH FLOW LEAD-FREE SOLDER PAS
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Quantity
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PCB Symbol, Footprint & 3D Model
Syringe, 0.53 oz (15g), 5cc
6 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
422 ~ 428°F (217 ~ 220°C)
No-Clean
4
Lead Free
37°F ~ 46°F (3°C ~ 8°C)
NC191LTA15
SMOOTH FLOW LOW TEMP SOLDER PAST
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Quantity
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PCB Symbol, Footprint & 3D Model
Syringe, 0.53 oz (15g), 5cc
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Bi57Sn42Ag1 (57/42/1)
279°F (137°C)
No-Clean
4
-
37°F ~ 46°F (3°C ~ 8°C)
NC191LT10
SMOOTH FLOW LOW TEMP SOLDER PAST
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Quantity
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PCB Symbol, Footprint & 3D Model
Syringe, 0.35 oz (10g), 5cc
6 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
280°F (138°C)
No-Clean
4
Lead Free
37°F ~ 46°F (3°C ~ 8°C)
NC191AX250
SMOOTH FLOW LEADED SOLDER PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
Jar, 8.8 oz (250g)
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
4
Leaded
37°F ~ 46°F (3°C ~ 8°C)
NC191SNL50T5
SMOOTH FLOW LEAD-FREE SOLDER PAS
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Quantity
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PCB Symbol, Footprint & 3D Model
Jar, 1.76 oz (50g)
6 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
422 ~ 428°F (217 ~ 220°C)
No-Clean
5
Lead Free
37°F ~ 46°F (3°C ~ 8°C)
NC191LTA500C
SMOOTH FLOW LOW TEMP SOLDER PAST
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Quantity
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PCB Symbol, Footprint & 3D Model
Cartridge, 17.64 oz (500g)
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Bi57Sn42Ag1 (57/42/1)
279°F (137°C)
No-Clean
4
-
37°F ~ 46°F (3°C ~ 8°C)
NC191AX35T5
SMOOTH FLOW LEADED SOLDER PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
Syringe, 1.23 oz (35g), 10cc
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
5
Leaded
37°F ~ 46°F (3°C ~ 8°C)
NC191LTA250
SMOOTH FLOW LOW TEMP SOLDER PAST
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Jar, 8.8 oz (250g)
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Bi57Sn42Ag1 (57/42/1)
279°F (137°C)
No-Clean
4
-
37°F ~ 46°F (3°C ~ 8°C)
NC191LTA50T5
SMOOTH FLOW LOW TEMP SOLDER PAST
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Jar, 1.76 oz (50g)
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Bi57Sn42Ag1 (57/42/1)
279°F (137°C)
No-Clean
5
-
37°F ~ 46°F (3°C ~ 8°C)
NC191LTA35T5
SMOOTH FLOW LOW TEMP SOLDER PAST
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Syringe, 1.23 oz (35g), 10cc
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Bi57Sn42Ag1 (57/42/1)
279°F (137°C)
No-Clean
5
-
37°F ~ 46°F (3°C ~ 8°C)
NC191SNL250T5
SMOOTH FLOW LEAD-FREE SOLDER PAS
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Jar, 8.8 oz (250g)
6 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
422 ~ 428°F (217 ~ 220°C)
No-Clean
5
Lead Free
37°F ~ 46°F (3°C ~ 8°C)
NC191AX250T5
SMOOTH FLOW LEADED SOLDER PASTE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Jar, 8.8 oz (250g)
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
5
Leaded
37°F ~ 46°F (3°C ~ 8°C)
NC191LT250
SMOOTH FLOW LOW TEMP SOLDER PAST
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Jar, 8.8 oz (250g)
6 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
280°F (138°C)
No-Clean
4
Lead Free
37°F ~ 46°F (3°C ~ 8°C)
NC191LTA500T5C
SMOOTH FLOW LOW TEMP SOLDER PAST
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cartridge, 17.64 oz (500g)
12 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Bi57Sn42Ag1 (57/42/1)
279°F (137°C)
No-Clean
5
-
37°F ~ 46°F (3°C ~ 8°C)
NC191LT500T5C
SMOOTH FLOW LOW TEMP SOLDER PAST
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Cartridge, 17.64 oz (500g)
6 Months
Date of Manufacture
-
-
Smooth Flow™
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
280°F (138°C)
No-Clean
5
-
37°F ~ 46°F (3°C ~ 8°C)

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.