SMD3 Series, Solder

Results:
22
Manufacturer
Series
Form
Wire Gauge
Diameter
Flux Type
Composition
Process
Melting Point
Storage/Refrigeration Temperature
Type
Mesh Type
Shelf Life Start
Shelf Life
Results remaining22
Applied Filters:
SMD3
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureWire GaugeMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeProcessForm
SMD3SWLT.040 100G
SN42/BI58 2.2% FLUX CORE SOLDER
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Bi58Sn42 (58/42)
0.040" (1.02mm)
280°F (138°C)
No-Clean, Rosin Activated (RA)
Lead Free
Spool, 3.53 oz (100g)
SMD3SW.015 100G
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
27 AWG, 28 SWG
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.015" (0.38mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Spool, 3.53 oz (100g)
SMD3SW.031 4OZ
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.031" (0.79mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Spool, 4 oz (113.40g)
SMD3SWLT.040 10G
SN42/BI58 2.2% FLUX CORE SOLDER
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Bi58Sn42 (58/42)
0.040" (1.02mm)
280°F (138°C)
No-Clean, Rosin Activated (RA)
Lead Free
Spool, 0.35 oz (10g)
SMD3SW.031 1OZ
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.031" (0.79mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Spool, 1 oz (28.35g)
SMD3SW.020 1OZ
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.020" (0.51mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Spool, 1 oz (28.35g)
SMD3SW.031 2OZ
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.031" (0.79mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Spool, 2 oz (56.70g)
SMD3SW.020 1LB
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
24 AWG, 25 SWG
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.020" (0.51mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Spool, 1 lb (454 g)
SMD3SWLT.047 4OZ
SOLDER WIRE SN42/BI58 .047" 4OZ
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Bi58Sn42 (58/42)
0.047" (1.19mm)
280°F (138°C)
-
Lead Free
Spool, 4 oz (113.40g)
SMD3SWLT.047 8OZ
SOLDER WIRE SN42/BI58 .047" 8OZ
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Bi58Sn42 (58/42)
0.047" (1.19mm)
280°F (138°C)
-
Lead Free
Spool, 8 oz (227g), 1/2 lb
SMD3SWLT.040 200G
SN42/BI58 2.2% FLUX CORE SOLDER
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Bi58Sn42 (58/42)
0.040" (1.02mm)
280°F (138°C)
No-Clean, Rosin Activated (RA)
Lead Free
Spool, 7 oz (200g)
SMD3SW.031 8OZ
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
20 AWG, 22 SWG
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.031" (0.79mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Spool, 8 oz (227g), 1/2 lb
SMD3SW.020 8OZ
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
24 AWG, 25 SWG
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.020" (0.51mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Spool, 8 oz (227g), 1/2 lb
SMD3SW.020 4OZ
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.020" (0.51mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Spool, 4 oz (113.40g)
SMD3SW.020 2OZ
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.020" (0.51mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Spool, 2 oz (56.70g)
SMD3SW.031 .7OZ
SOLDER WIRE POCKET PACK 62/36/2
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
20 AWG, 21 SWG
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.031" (0.79mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Tube, 0.7 oz (19.85g)
SMD3SW.020 .4OZ
SOLDER WIRE POCKET PACK 62/36/2
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
24 AWG, 25 SWG
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.020" (0.51mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Tube, 0.4 oz (11.34g)
SMD3SW.031 1LB
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
20 AWG, 22 SWG
-
SMD3
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.031" (0.79mm)
354°F (179°C)
No-Clean, Water Soluble
Leaded
Spool, 1 lb (454 g)
SMD3SWLT.047 1OZ
SOLDER WIRE SN42/BI58 .047" 1OZ
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Bi58Sn42 (58/42)
0.047" (1.19mm)
280°F (138°C)
-
Lead Free
Spool, 1 oz (28.35g)
SMD3SWLT.040 20G
SN42/BI58 2.2% FLUX CORE SOLDER
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
-
SMD3
Wire Solder
Bi58Sn42 (58/42)
0.040" (1.02mm)
280°F (138°C)
No-Clean, Rosin Activated (RA)
Lead Free
Spool, 0.7 oz (20g)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.