LOCTITE® GC 10 Series, Solder

Results:
6
Manufacturer
Series
Form
Composition
Storage/Refrigeration Temperature
Process
Wire Gauge
Flux Type
Type
Shelf Life Start
Mesh Type
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Melting Point
Diameter
Results remaining6
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LOCTITE® GC 10
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartWire GaugeDiameterMesh TypeSeriesTypeCompositionMelting PointFlux TypeProcessFormStorage/Refrigeration Temperature
2003721
LOCTITE GC 10 SAC305T4 885 53U
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Quantity
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PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
-
LOCTITE® GC 10
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
Lead Free
Cartridge, 21.16 oz (600g)
41°F ~ 77°F (5°C ~ 25°C)
1993881
LOCTITE GC 10 SAC305T4 885 52U
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
-
LOCTITE® GC 10
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
Lead Free
Jar, 17.64 oz (500g)
41°F ~ 77°F (5°C ~ 25°C)
2023641
LOCTITE GC 10 SAC305T3 885 53U
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
-
LOCTITE® GC 10
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
Lead Free
Cartridge, 21.16 oz (600g)
41°F ~ 77°F (5°C ~ 25°C)
2064239
LOCTITE GC 10 SAC305T3 885V 2U P
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
-
LOCTITE® GC 10
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
Lead Free
Cartridge, 29.98 oz (850g)
41°F ~ 77°F (5°C ~ 25°C)
2064242
LOCTITE GC 10 SAC305T4 885V 2U P
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
-
LOCTITE® GC 10
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
Lead Free
Cartridge, 29.98 oz (850g)
41°F ~ 77°F (5°C ~ 25°C)
2023628
LOCTITE GC 10 SAC305T3 885 52U
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
12 Months
Date of Manufacture
-
-
-
LOCTITE® GC 10
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
Lead Free
Jar, 17.64 oz (500g)
41°F ~ 77°F (5°C ~ 25°C)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.