LF318 Series, Solder

Results:
4
Manufacturer
Series
Form
Storage/Refrigeration Temperature
Composition
Process
Wire Gauge
Flux Type
Type
Shelf Life Start
Mesh Type
Shelf Life
Melting Point
Diameter
Results remaining4
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LF318
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureWire GaugeDiameterSeriesTypeCompositionMelting PointFlux TypeMesh TypeProcessForm
1728117
LOCTITE LF 318 97SCAGS885V 25G S
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
LF318
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
3
Lead Free
Syringe, 0.88 oz (25g)
721440
LOCTITE LF 318 97SCAGS885V 500G
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
-
LF318
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
3
Lead Free
Jar, 17.64 oz (500g)
721471
LOCTITE LF 318 97SCAGS885V 600G
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
LF318
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
3
Lead Free
Cartridge, 21.16 oz (600g)
721472
LOCTITE LF 318 97SCAGS885V 75G S
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
-
-
-
LF318
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423°F (217°C)
No-Clean
3
Lead Free
Syringe, 2.65 oz (75g)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.