EP256HA Series, Solder

Results:
7
Manufacturer
Series
Form
Composition
Mesh Type
Melting Point
Storage/Refrigeration Temperature
Process
Wire Gauge
Flux Type
Type
Shelf Life Start
Shelf Life
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Results remaining7
Applied Filters:
EP256HA
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureWire GaugeDiameterMesh TypeSeriesTypeCompositionMelting PointFlux TypeProcessForm
70-0203-0311
SOLDER PASTE NO CLEAN 600GM
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Quantity
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PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
-
EP256HA
Solder Paste
Sn62Pb36Ag2 (62/36/2)
354°F (179°C)
No-Clean
Leaded
Cartridge, 21.16 oz (600g)
70-0202-0519
SOLDER PASTE NO CLEAN 750GM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
3
EP256HA
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
Leaded
Cartridge, 24.69 oz (700g)
70-0202-0510
SOLDER PASTE NO CLEAN 500GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
3
EP256HA
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
Leaded
Jar, 17.64 oz (500g)
70-0202-0511
SOLDER PASTE NO CLEAN 600GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
3
EP256HA
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
Leaded
Cartridge, 21.16 oz (600g)
70-0202-0611
SOLDER PASTE NO CLEAN 600GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
3
EP256HA
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
Leaded
Cartridge, 21.16 oz (600g)
70-0202-0610
SOLDER PASTE NO CLEAN 500GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
3
EP256HA
Solder Paste
Sn63Pb37 (63/37)
361°F (183°C)
No-Clean
Leaded
Jar, 17.64 oz (500g)
70-0202-0311
SOLDER PASTE NO CLEAN 600GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
3
EP256HA
Solder Paste
Sn62Pb36Ag2 (62/36/2)
354°F (179°C)
No-Clean
Leaded
Cartridge, 21.16 oz (600g)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.