EnviroMark™ 828 Series, Solder

Results:
5
Manufacturer
Series
Form
Mesh Type
Composition
Storage/Refrigeration Temperature
Process
Wire Gauge
Flux Type
Type
Shelf Life Start
Shelf Life
Melting Point
Diameter
Results remaining5
Applied Filters:
EnviroMark™ 828
Select
ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureWire GaugeDiameterMesh TypeSeriesTypeCompositionMelting PointFlux TypeProcessForm
70-0403-0824
SOLDER PASTE WATER SOLUBLE 700GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
-
EnviroMark™ 828
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
Water Soluble
Lead Free
Cartridge, 24.69 oz (700g)
70-0403-0810
SOLDER PASTE WATER SOLUBLE 500GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
3
EnviroMark™ 828
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
Water Soluble
Lead Free
Jar, 17.64 oz (500g)
70-0403-0823
SOLDER PASTE WATER SOLUBLE 500GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
3
EnviroMark™ 828
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
Water Soluble
Lead Free
Cartridge, 17.64 oz (500g)
70-0403-0910
SOLDER PASTE WATER SOLUBLE 500GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
4
EnviroMark™ 828
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
Water Soluble
Lead Free
Jar, 17.64 oz (500g)
70-0403-0923
SOLDER PASTE WATER SOLUBLE 500GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
6 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
4
EnviroMark™ 828
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
Water Soluble
Lead Free
Cartridge, 17.64 oz (500g)

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.