EM907 Series, Solder

Results:
6
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Series
Form
Mesh Type
Composition
Storage/Refrigeration Temperature
Process
Wire Gauge
Flux Type
Type
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Results remaining6
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EM907
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureWire GaugeDiameterSeriesTypeCompositionMelting PointFlux TypeMesh TypeProcessForm
70-0605-0922
SOLDER PASTE NO CLEAN 12000GM
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Quantity
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PCB Symbol, Footprint & 3D Model
4 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
EM907
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
No-Clean
3
Lead Free
Cartridge, 42.33 oz (1.2kg)
70-0605-0911
SOLDER PASTE NO CLEAN 600GM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
4 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
EM907
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
No-Clean
4
Lead Free
Cartridge, 21.16 oz (600g)
70-0605-0819
SOLDER PASTE NO CLEAN 750GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
4 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
EM907
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
No-Clean
3
Lead Free
Cartridge, 24.69 oz (700g)
70-0605-0810
SOLDER PASTE NO CLEAN 500GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
4 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
EM907
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
No-Clean
3
Lead Free
Jar, 17.64 oz (500g)
70-0605-0811
SOLDER PASTE NO CLEAN 600GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
4 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
EM907
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
No-Clean
3
Lead Free
Cartridge, 21.16 oz (600g)
70-0605-0910
SOLDER PASTE NO CLEAN 500GM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
4 Months
Date of Manufacture
32°F ~ 50°F (0°C ~ 10°C)
-
-
EM907
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
423 ~ 424°F (217 ~ 218°C)
No-Clean
4
Lead Free
Jar, 17.64 oz (500g)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.