C511™ Series, Solder

Results:
14
Manufacturer
Series
Wire Gauge
Diameter
Composition
Form
Melting Point
Storage/Refrigeration Temperature
Process
Flux Type
Type
Mesh Type
Shelf Life Start
Shelf Life
Results remaining14
Applied Filters:
C511™
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
605500
96SC C511 5C 0.56MM 0.25KG
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Quantity
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PCB Symbol, Footprint & 3D Model
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-
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C511™
Wire Solder
Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
0.022" (0.56mm)
423°F (217°C)
No-Clean
23 AWG, 24 SWG
Lead Free
Spool, 5.51 lbs (2.5kg)
59°F ~ 86°F (15°C ~ 30°C)
727190
99C C511 3C 0.56MM 0.5KG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
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C511™
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.022" (0.56mm)
440 ~ 464°F (227 ~ 240°C)
No-Clean
23 AWG, 24 SWG
Lead Free
Spool, 1 lb (454 g)
-
1042100
60/40C511 3C 1.63MM AF 2.5KG AM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
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C511™
Wire Solder
Sn60Pb40 (60/40)
0.064" (1.63mm)
361 ~ 374°F (183 ~ 190°C)
No-Clean
14 AWG, 16 SWG
Leaded
Spool, 5.51 lbs (2.5kg)
-
386838
60/40 C511 5C 1.22MM 0.5KG.048"
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Quantity
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PCB Symbol, Footprint & 3D Model
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C511™
Wire Solder
Sn60Pb40 (60/40)
0.048" (1.22mm)
361 ~ 374°F (183 ~ 190°C)
No-Clean
16 AWG, 18 SWG
Leaded
Spool, 1 lb (454 g)
-
692857
96SC C511 5C 0.81MM 0.5KG AM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C511™
Wire Solder
Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
0.032" (0.81mm)
423°F (217°C)
No-Clean
20 AWG, 21 SWG
Lead Free
Spool, 1 lb (454 g)
59°F ~ 86°F (15°C ~ 30°C)
716856
99C C511 3C 1.63MM 1KG AM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C511™
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.064" (1.63mm)
440 ~ 464°F (227 ~ 240°C)
No-Clean
14 AWG, 16 SWG
Lead Free
Spool, 2.20 lbs (1kg)
-
732999
97SC C511 3C 1.22MM 0.5KG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C511™
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.048" (1.22mm)
423°F (217°C)
No-Clean
16 AWG, 18 SWG
Lead Free
Spool, 1 lb (454 g)
-
733001
97SC C511 2% .022DIA 22AWG 24SWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C511™
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.022" (0.56mm)
423°F (217°C)
No-Clean
23 AWG, 24 SWG
Lead Free
Spool, 8.8 oz (250g)
-
412183
96SC C511 3C 1.02MM 0.5KG .040"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C511™
Wire Solder
Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
0.040" (1.02mm)
423°F (217°C)
No-Clean
18 AWG, 19 SWG
Lead Free
Spool, 1 lb (454 g)
59°F ~ 86°F (15°C ~ 30°C)
796037
97SC C511 2% .015DIA 27AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C511™
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423°F (217°C)
Rosin Mildly Activated (RMA)
27 AWG, 28 SWG
Lead Free
Spool, 8.8 oz (250g)
-
865940
99C C511 3C 0.81MM 0.5KG AM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C511™
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.032" (0.81mm)
440 ~ 464°F (227 ~ 240°C)
No-Clean
20 AWG, 21 SWG
Lead Free
Spool, 1 lb (454 g)
-
733002
97SC C511 2% .032DIA 20AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C511™
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.032" (0.81mm)
423°F (217°C)
No-Clean
20 AWG, 21 SWG
Lead Free
Spool, 1 lb (454 g)
-
732998
97SC C511 2% .064DIA 14AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C511™
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.064" (1.63mm)
423°F (217°C)
No-Clean
14 AWG, 16 SWG
Lead Free
Spool, 1 lb (454 g)
-
733010
96SC C511 3C 0.81MM 0.5KG .032"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
C511™
Wire Solder
Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
0.032" (0.81mm)
423°F (217°C)
No-Clean
20 AWG, 21 SWG
Lead Free
Spool, 1 lb (454 g)
-

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.