C502 Series, Solder

Results:
12
Manufacturer
Series
Wire Gauge
Diameter
Storage/Refrigeration Temperature
Composition
Form
Process
Melting Point
Flux Type
Type
Shelf Life Start
Mesh Type
Shelf Life
Results remaining12
Applied Filters:
C502
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessForm
397982
63/37 CRYSL 502 3% .015DIA 27AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
C502
Wire Solder
Sn63Pb37 (63/37)
0.015" (0.38mm)
361°F (183°C)
No-Clean
27 AWG, 28 SWG
Leaded
Spool, 8.8 oz (250g)
386848
96SC C502 5C 0.81MM 0.5KG AM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
59°F ~ 86°F (15°C ~ 30°C)
-
C502
Wire Solder
-
0.032" (0.81mm)
-
No-Clean
20 AWG, 21 SWG
-
Spool, 1 lb (454 g)
412185
96SC C502 5C 0.56MM 0.25KG.022"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
59°F ~ 86°F (15°C ~ 30°C)
-
C502
Wire Solder
-
0.022" (0.56mm)
-
No-Clean
23 AWG, 24 SWG
-
Spool, 8.8 oz (250g)
412188
96SC C502 5C 0.38MM 0.25KG.015"
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
C502
Wire Solder
-
0.015" (0.38mm)
-
No-Clean
27 AWG, 28 SWG
-
Spool, 8.8 oz (250g)
421562
SN62 C502 5C 1.02MM 0.5KG .040"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
59°F ~ 86°F (15°C ~ 30°C)
-
C502
Wire Solder
-
0.040" (1.02mm)
-
No-Clean
18 AWG, 19 SWG
-
Spool, 1 lb (454 g)
838498
97SC C502 3C 0.25MM 0.25KG AM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
-
C502
Wire Solder
-
0.025" (0.64mm)
361°F (183°C)
No-Clean
22 AWG, 23 SWG
-
Spool, 8.8 oz (250g)
840933
97SC C502 3C 0.56MM 0.25KG AM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
C502
Wire Solder
-
0.022" (0.56mm)
361°F (183°C)
No-Clean
23 AWG, 24 SWG
-
Spool, 8.8 oz (250g)
848874
97SC C502 3C 0.81MM 0.5KG AM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
C502
Wire Solder
-
0.032" (0.81mm)
361°F (183°C)
No-Clean
20 AWG, 21 SWG
-
Spool, 1 lb (454 g)
395451
63/37 CRYSL 502 3% .032DIA 20AWG
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
C502
Wire Solder
Sn63Pb37 (63/37)
0.032" (0.81mm)
361°F (183°C)
No-Clean
20 AWG, 21 SWG
Leaded
Spool, 1 lb (454 g)
386851
63/37 CRYSL 502 2% .022DIA 23AWG
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
C502
Wire Solder
Sn63Pb37 (63/37)
0.022" (0.56mm)
361°F (183°C)
No-Clean
23 AWG, 24 SWG
Leaded
Spool, 1 lb (454 g)
395465
63/37 CRYSL 502 3% .064DIA 14AWG
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
C502
Wire Solder
Sn63Pb37 (63/37)
0.064" (1.63mm)
361°F (183°C)
No-Clean
14 AWG, 16 SWG
Leaded
Spool, 1 lb (454 g)
386862
63/37 CRYSL 502 2% .032DIA 20AWG
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
C502
Wire Solder
Sn63Pb37 (63/37)
0.032" (0.81mm)
361°F (183°C)
No-Clean
20 AWG, 21 SWG
Leaded
Spool, 1 lb (454 g)

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.