C400 Series, Solder

Results:
20
Manufacturer
Series
Wire Gauge
Diameter
Composition
Process
Melting Point
Storage/Refrigeration Temperature
Form
Flux Type
Type
Mesh Type
Shelf Life Start
Shelf Life
Results remaining20
Applied Filters:
C400
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
397102
63/37 400 2% .048DIA 16AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
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C400
Wire Solder
Sn63Pb37 (63/37)
0.048" (1.22mm)
361°F (183°C)
No-Clean
16 AWG, 18 SWG
Leaded
Spool, 1 lb (454 g)
59°F ~ 86°F (15°C ~ 30°C)
673831
97SC 400 2% .048DIA 16AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.048" (1.22mm)
423°F (217°C)
No-Clean
16 AWG, 18 SWG
Lead Free
Spool, 1 lb (454 g)
59°F ~ 86°F (15°C ~ 30°C)
673829
97SC 400 2% .032DIA 20AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.032" (0.81mm)
423°F (217°C)
No-Clean
20 AWG, 21 SWG
Lead Free
Spool, 1 lb (454 g)
59°F ~ 86°F (15°C ~ 30°C)
673828
97SC 400 2% .022DIA 23AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.022" (0.56mm)
423°F (217°C)
No-Clean
23 AWG, 24 SWG
Lead Free
Spool, 8.8 oz (250g)
59°F ~ 86°F (15°C ~ 30°C)
386844
63/37 400 2% .015DIA 27AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn63Pb37 (63/37)
0.015" (0.38mm)
361°F (183°C)
No-Clean
27 AWG, 28 SWG
Leaded
Spool, 8.8 oz (250g)
59°F ~ 86°F (15°C ~ 30°C)
673832
97SC 400 2% .064DIA 14AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.064" (1.63mm)
423°F (217°C)
No-Clean
14 AWG, 16 SWG
Lead Free
Spool, 1 lb (454 g)
-
450314
63/37 400 2% .022DIA 23AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn63Pb37 (63/37)
0.022" (0.56mm)
361°F (183°C)
No-Clean
23 AWG, 24 SWG
Leaded
Spool, 1 lb (454 g)
-
386876
63/37 400 2% .024DIA 22AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn63Pb37 (63/37)
0.024" (0.61mm)
361°F (183°C)
No-Clean
22 AWG, 23 SWG
Leaded
Spool, 1 lb (454 g)
59°F ~ 86°F (15°C ~ 30°C)
392249
63/37 400 2% .064DIA 14AWG
Contact us
Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn63Pb37 (63/37)
0.064" (1.63mm)
361°F (183°C)
No-Clean
14 AWG, 16 SWG
Leaded
Spool, 1 lb (454 g)
59°F ~ 86°F (15°C ~ 30°C)
386927
63/37 400 2% .032DIA 20AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn63Pb37 (63/37)
0.032" (0.81mm)
361°F (183°C)
No-Clean
20 AWG, 21 SWG
Leaded
Spool, 1 lb (454 g)
-
395442
63/37 400 1% .064DIA 14AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn63Pb37 (63/37)
0.064" (1.63mm)
361°F (183°C)
No-Clean
14 AWG, 16 SWG
Leaded
Spool, 1 lb (454 g)
-
796065
97SC 400 2% 0.38 DIA
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423°F (217°C)
No-Clean
27 AWG, 28 SWG
Lead Free
Spool, 8.8 oz (250g)
-
818006
63/37 C400 5C 0.71MM 0.5KG AM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn63Pb37 (63/37)
0.028" (0.71mm)
361°F (183°C)
No-Clean
21 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
-
733024
96SC C400 3C 0.56MM 0.25KG.022"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
0.022" (0.56mm)
423°F (217°C)
No-Clean
23 AWG, 24 SWG
Lead Free
Spool, 8.8 oz (250g)
59°F ~ 86°F (15°C ~ 30°C)
386874
96S C400 3C 0.38MM 0.25KG AM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
-
0.015" (0.38mm)
-
No-Clean
27 AWG, 28 SWG
-
Spool, 8.8 oz (250g)
-
386863
96S C400 5C 0.56MM 0.5KG AM
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
-
0.022" (0.56mm)
-
No-Clean
23 AWG, 24 SWG
-
Spool, 1 lb (454 g)
-
386849
96SC C400 3C 0.81MM 0.5KG .032"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
-
0.032" (0.81mm)
-
No-Clean
20 AWG, 21 SWG
-
Spool, 1 lb (454 g)
-
386857
63/37 400 3% .032DIA 20AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn63Pb37 (63/37)
0.032" (0.81mm)
361°F (183°C)
No-Clean
20 AWG, 21 SWG
Leaded
Spool, 1 lb (454 g)
-
386826
63/37 400 1% .020DIA 22AWG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn63Pb37 (63/37)
0.024" (0.61mm)
361°F (183°C)
No-Clean
22 AWG, 23 SWG
Leaded
Spool, 1 lb (454 g)
-
386825
63/37 400 1% .032DIA 20AWG
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
C400
Wire Solder
Sn63Pb37 (63/37)
0.032" (0.81mm)
361°F (183°C)
No-Clean
20 AWG, 21 SWG
Leaded
Spool, 1 lb (454 g)
-

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.