4944 Series, Solder

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2
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Series
Storage/Refrigeration Temperature
Form
Composition
Process
Wire Gauge
Flux Type
Type
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4944
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ImageProduct DetailPriceAvailabilityECAD ModelShelf Life StartStorage/Refrigeration TemperatureShelf LifeMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessForm
4944-112G
SOLDER LF SN100E RA FLUX
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
65°F ~ 80°F (18°C ~ 27°C)
60 Months
-
4944
Wire Solder
Sn99.5Cu0.5 (99.5/0.5)
0.032" (0.81mm)
442°F (228°C)
Rosin Activated (RA)
20 AWG, 21 SWG
Lead Free
Spool, 4 oz (113.40g)
4944-454G
SOLDER LF SN100E RA FLUX
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Date of Manufacture
50°F ~ 86°F (10°C ~ 30°C)
60 Months
-
4944
Wire Solder
Sn99.5Cu0.5 (99.5/0.5)
0.032" (0.81mm)
442°F (228°C)
Rosin Activated (RA)
20 AWG, 21 SWG
Lead Free
Spool, 1 lb (454 g)

Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.