4860 Series, Solder

Results:
8
Manufacturer
Series
Form
Storage/Refrigeration Temperature
Wire Gauge
Diameter
Shelf Life
Type
Mesh Type
Shelf Life Start
Composition
Process
Flux Type
Melting Point
Results remaining8
Applied Filters:
4860
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ImageProduct DetailPriceAvailabilityECAD ModelShelf Life StartShelf LifeMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
4860-18G
SOLDER NO-CLEAN 63/37 POCKET PK
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
60 Months
-
4860
Wire Solder
Sn63Pb37 (63/37)
0.032" (0.81mm)
361°F (183°C)
No-Clean
20 AWG, 21 SWG
Leaded
Tube, 0.63 oz (18g)
50°F ~ 86°F (10°C ~ 30°C)
4866-227G
SOLDER 63/37 NOCLEAN .04DIA .5LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
4860
Wire Solder
Sn63Pb37 (63/37)
0.040" (1.02mm)
361°F (183°C)
No-Clean
18 AWG, 19 SWG
Leaded
Spool, 8 oz (227g), 1/2 lb
-
4860P-500G
LEADED SOLDER PASTE, SN63/PB37,
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
24 Months
3
4860
Solder Paste
Sn63Pb37 (63/37)
-
361°F (183°C)
No-Clean
-
Leaded
Jar, 17.64 oz (500g)
35°F ~ 50°F (2°C ~ 10°C)
4860P-35G
LEADED NO CLEAN SOLDER PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
24 Months
3
4860
Solder Paste
Sn63Pb37 (63/37)
-
361°F (183°C)
No-Clean
-
Leaded
Syringe, 1.23 oz (35g), 10cc
39°F ~ 50°F (4°C ~ 10°C)
4865-227G
SOLDER NO-CLEAN 63/37 1/2 LB
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
60 Months
-
4860
Wire Solder
Sn63Pb37 (63/37)
0.032" (0.81mm)
361°F (183°C)
No-Clean
20 AWG, 21 SWG
Leaded
Spool, 8 oz (227g), 1/2 lb
50°F ~ 86°F (10°C ~ 30°C)
4865-454G
SOLDER NO-CLEAN 63/37 1 LB
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
60 Months
-
4860
Wire Solder
Sn63Pb37 (63/37)
0.032" (0.81mm)
361°F (183°C)
No-Clean
20 AWG, 21 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 86°F (10°C ~ 30°C)
4867-227G
SOLDER 63/37 NOCLEAN .05DIA .5LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
4860
Wire Solder
Sn63Pb37 (63/37)
0.050" (1.27mm)
361°F (183°C)
No-Clean
16 AWG, 18 SWG
Leaded
Spool, 8 oz (227g), 1/2 lb
-
4860P-250G
LEADED NO CLEAN SOLDER PASTE
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Quantity
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PCB Symbol, Footprint & 3D Model
Date of Manufacture
24 Months
3
4860
Solder Paste
Sn63Pb37 (63/37)
-
361°F (183°C)
No-Clean
-
Leaded
Jar, 8.8 oz (250g)
39°F ~ 50°F (4°C ~ 10°C)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.