282 Series, Solder

Results:
8
Manufacturer
Series
Wire Gauge
Diameter
Composition
Melting Point
Process
Storage/Refrigeration Temperature
Form
Flux Type
Type
Mesh Type
Shelf Life Start
Shelf Life
Results remaining8
Applied Filters:
282
Select
ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartStorage/Refrigeration TemperatureMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessForm
24-6337-7402
SOLDER FLUX-CORED/282 63/37 .031
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
282
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
Rosin Mildly Activated (RMA)
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
24-6337-7403
SOLDER FLUX-CORED/282 63/37 .062
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
282
Wire Solder
Sn63Pb37 (63/37)
0.062" (1.57mm)
361°F (183°C)
Rosin Mildly Activated (RMA)
14 AWG, 16 SWG
Leaded
Spool, 1 lb (454 g)
24-7050-7420
SOLDER FLUX-CORED/282 .025" 1LB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
282
Wire Solder
Sn96.3Ag3.7 (96.3/3.7)
0.025" (0.64mm)
430 ~ 444°F (221 ~ 223°C)
Rosin Mildly Activated (RMA)
22 AWG, 23 SWG
Lead Free
Spool, 1 lb (454 g)
24-7080-7410
SOLDER FLUX-CORED/282 .031" 1LB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
282
Wire Solder
Sn95Sb5 (95/5)
0.031" (0.79mm)
450 ~ 464°F (232 ~ 240°C)
Rosin Mildly Activated (RMA)
20 AWG, 22 SWG
Lead Free
Spool, 1 lb (454 g)
24-6337-7420
SOLDER FLUX-CORED/282 63/37.025"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
282
Wire Solder
Sn63Pb37 (63/37)
0.025" (0.64mm)
361°F (183°C)
Rosin Mildly Activated (RMA)
22 AWG, 23 SWG
Leaded
Spool, 1 lb (454 g)
24-6337-7400
SOLDER FLUX-CORED/282 63/37.020"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
282
Wire Solder
Sn63Pb37 (63/37)
0.020" (0.51mm)
361°F (183°C)
Rosin Mildly Activated (RMA)
24 AWG, 25 SWG
Leaded
Spool, 1 lb (454 g)
24-6337-7415
SOLDER FLUX-CORED/282 63/37 .015
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
282
Wire Solder
Sn63Pb37 (63/37)
0.015" (0.38mm)
361°F (183°C)
Rosin Mildly Activated (RMA)
27 AWG, 28 SWG
Leaded
Spool, 1 lb (454 g)
24-7050-7402
SOLDER FLUX-CORED/282 .031" 1LB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
-
282
Wire Solder
Sn96.3Ag3.7 (96.3/3.7)
0.031" (0.79mm)
430 ~ 444°F (221 ~ 223°C)
Rosin Mildly Activated (RMA)
20 AWG, 22 SWG
Lead Free
Spool, 1 lb (454 g)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.