268 Series, Solder

Results:
13
Manufacturer
Series
Wire Gauge
Diameter
Composition
Melting Point
Form
Process
Storage/Refrigeration Temperature
Flux Type
Type
Shelf Life Start
Mesh Type
Shelf Life
Results remaining13
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268
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
96-9574-9531
K100LD 3.3%/268 .031 500 G ROBO
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Quantity
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PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.031" (0.79mm)
441°F (227°C)
No-Clean
20 AWG, 22 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
96-9574-9520
K100LD 3.3%/268 .020 500 G ROBO
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Quantity
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PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.020" (0.51mm)
441°F (227°C)
No-Clean
24 AWG, 25 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
96-7069-9520
SN96.5AG3.0CU0.5 3.3%/268 .020 5
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Quantity
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PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.020" (0.51mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
24 AWG, 25 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
96-7069-9531
SN96.5AG3.0CU0.5 3.3%/268 .031 5
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Quantity
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PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.031" (0.79mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
20 AWG, 22 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
96-9574-9515
K100LD 3.3%/268 .015 500 G ROBO
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.015" (0.38mm)
441°F (227°C)
No-Clean
27 AWG, 28 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
96-7069-9525
SN96.5AG3.0CU0.5 3.3%/268 .025 5
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.025" (0.64mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
22 AWG, 23 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
96-7069-9515
SN96.5AG3.0CU0.5 3.3%/268 .015 5
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
27 AWG, 28 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
96-6337-9531
SN63PB37 3.3%/268 .031 500 G
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Quantity
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PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
No-Clean
20 AWG, 22 AWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
93-7069-9510
SN96.5AG3.0CU0.5 3.3%/268 .010
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Quantity
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PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.010" (0.25mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
30 AWG, 33 SWG
Lead Free
Spool, 4 oz (113.40g)
50°F ~ 104°F (10°C ~ 40°C)
96-6337-9515
SN63PB37 3.3%/268 .015 500 G
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn63Pb37 (63/37)
0.015" (0.38mm)
361°F (183°C)
No-Clean
26 AWG, 27 SWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
96-9574-9540
K100LD 3.3%/268 .040 500 G ROBO
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.040" (1.02mm)
441°F (227°C)
No-Clean
18 AWG, 19 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
96-9574-9525
K100LD 3.3%/268 .025 500 G ROBO
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.025" (0.64mm)
441°F (227°C)
No-Clean
22 AWG, 23 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
96-7069-9540
SN96.5AG3.0CU0.5 3.3%/268 .040 5
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
36 Months
Date of Manufacture
-
268
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.040" (1.02mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
18 AWG, 19 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.