245 Series, Solder

Results:
119
Manufacturer
Series
Composition
Melting Point
Wire Gauge
Diameter
Form
Storage/Refrigeration Temperature
Process
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Flux Type
Type
Mesh Type
Results remaining119
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245
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartMesh TypeSeriesTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
92-7068-8800
SOLDER FLUX-CORED/245 .031" 500G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.031" (0.79mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
20 AWG, 22 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
92-7068-8840
SOLDER FLUX-CORED/245 .0240" 500
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.040" (1.02mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
18 AWG, 19 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
92-7068-8842
SOLDER FLUX-CORED/245 .062" 500G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.062" (1.57mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
14 AWG, 16 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
92-7068-8843
SOLDER FLUX-CORED/245 .031" 500G
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.031" (0.79mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
20 AWG, 22 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
92-7068-8845
SOLDER FLUX-CORED/245 .015" 500G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
423 ~ 424°F (217 ~ 218°C)
No-Clean
27 AWG, 28 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
92-7150-8800
SOLDER FLUX-CORED/245 .031" 500G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.031" (0.79mm)
354°F (179°C)
No-Clean
20 AWG, 22 SWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
26-6337-8817
SOLDER FLUX-CORED/245 63/37.062"
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn63Pb37 (63/37)
0.062" (1.57mm)
361°F (183°C)
No-Clean
14 AWG, 16 SWG
Leaded
Spool, 5 lbs (2.27kg)
50°F ~ 104°F (10°C ~ 40°C)
29-7150-8808
SOLDER FLUX-CORED/245 .020 3LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.020" (0.51mm)
354°F (179°C)
No-Clean
24 AWG, 25 SWG
Leaded
Spool, 3 lbs (1.36kg)
50°F ~ 104°F (10°C ~ 40°C)
24-6040-8800
SOLDER FLUX-CORED/245 .031" 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn60Pb40 (60/40)
0.031" (0.79mm)
361 ~ 374°F (183 ~ 190°C)
No-Clean
20 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-6040-8815
SOLDER FLUX-CORED/245 .050" 1LB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn60Pb40 (60/40)
0.050" (1.27mm)
361 ~ 374°F (183 ~ 190°C)
No-Clean
16 AWG, 18 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-6040-8817
SOLDER FLUX-CORED/245 .062" 1LB
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn60Pb40 (60/40)
0.062" (1.57mm)
361 ~ 374°F (183 ~ 190°C)
No-Clean
14 AWG, 16 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-6337-8803
SOLDER FLUX-CORED/245 63/37 .062
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn63Pb37 (63/37)
0.062" (1.57mm)
361°F (183°C)
No-Clean
14 AWG, 16 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-6337-8816
SOLDER FLUX-CORED/245 63/37 .050
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn63Pb37 (63/37)
0.050" (1.27mm)
361°F (183°C)
No-Clean
16 AWG, 18 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-6337-8811
SOLDER FLUX-CORED/245 63/37 .030
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn63Pb37 (63/37)
0.030" (0.76mm)
361°F (183°C)
No-Clean
21 AWG, 22 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
24-6337-8843
SOLDER FLUX-CORED/245 63/37 .015
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn63Pb37 (63/37)
0.015" (0.38mm)
361°F (183°C)
No-Clean
27 AWG, 28 SWG
Leaded
Spool, 1 lb (454 g)
50°F ~ 104°F (10°C ~ 40°C)
91-7059-8825
SOLDER FLUX-CORED/245 .025" 500G
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
0.025" (0.64mm)
423°F (217°C)
No-Clean
22 AWG, 23 SWG
Lead Free
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
92-6040-8800
SOLDER FLUX-CORED/245 .031" 500G
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn60Pb40 (60/40)
0.031" (0.79mm)
361 ~ 374°F (183 ~ 190°C)
No-Clean
20 AWG, 22 SWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
92-6337-8803
SOLDER FLUX-CORED/245 63/37. .06
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn63Pb37 (63/37)
0.062" (1.57mm)
361°F (183°C)
No-Clean
14 AWG, 16 SWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
92-6337-8802
SOLDER FLUX-CORED/245 63/37.031"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn63Pb37 (63/37)
0.031" (0.79mm)
361°F (183°C)
No-Clean
20 AWG, 22 SWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)
92-6337-8813
SOLDER FLUX-CORED/245 63/37 .024
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
-
245
Wire Solder
Sn63Pb37 (63/37)
0.040" (1.02mm)
361°F (183°C)
No-Clean
18 AWG, 19 SWG
Leaded
Spool, 17.64 oz (500g)
50°F ~ 104°F (10°C ~ 40°C)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.