AW Series, Solder

Results:
2
Manufacturer
Series
Composition
Form
Process
Wire Gauge
Melting Point
Diameter
Storage/Refrigeration Temperature
Flux Type
Type
Mesh Type
Shelf Life Start
Shelf Life
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AW
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ImageProduct DetailPriceAvailabilityECAD ModelShelf LifeShelf Life StartSeriesMesh TypeTypeCompositionDiameterMelting PointFlux TypeWire GaugeProcessFormStorage/Refrigeration Temperature
26-5050-9602
SOLDER FLUX WIRE/AW .093 5LB SPL
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
AW
-
Wire Solder
Sn50Pb50 (50/50)
0.093" (2.36mm)
361 ~ 420°F (183 ~ 216°C)
Acid Cored
11 AWG, 13 SWG
Leaded
Spool, 5 lbs (2.27kg)
50°F ~ 104°F (10°C ~ 40°C)
27-0001-9701
SOLDER FLUX WIRE/AW .062" 18LB S
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
AW
-
Wire Solder
Sn95Sb5 (95/5)
0.062" (1.57mm)
450 ~ 464°F (232 ~ 240°C)
Acid Cored
14 AWG, 16 SWG
Lead Free
Spool, 18 lbs (8.16kg)
50°F ~ 104°F (10°C ~ 40°C)

About  Solder

Solder refers to metal alloys that are specifically designed to join metal surfaces together. There are various types of solder available for different applications. These include bar solder, ribbon solder, solder paste, solder shot, solder sphere, and wire solder. The diameter of the solder can range from 0.006" (0.15mm) to 0.250" (6.35mm), catering to different soldering requirements. The melting point of solder varies depending on the specific alloy composition. It can range from 244°F (118°C) to 1983°F (1084°C). Solder is available in both lead-free and leaded options, providing choices for environmental considerations. In addition to the different solder types, there are various flux types used in conjunction with solder. Flux helps to remove oxidation and impurities, allowing the solder to properly bond with the metal surfaces. Flux types include acid cored, no-clean, rosin activated, rosin mildly activated, and water soluble. Each flux type has different characteristics and is suitable for specific soldering applications. By selecting the appropriate solder type, diameter, melting point, and flux type, technicians can ensure successful and reliable metal joining processes. It is important to consider the specific application requirements and environmental factors when choosing the appropriate solder and flux combination.