Textool™ Series, Socket Adapters

Results:
50
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Series
Number of Pins
Convert To (Adapter End)
Convert From (Adapter End)
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Pitch - Post
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Contact Finish - Mating
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Results remaining50
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Textool™
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
242-1281-19-0602J
RECEPTACLE DIP SOCKET 42POS .6"
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Quantity
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PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
242-1281-29-0602J
RECEPTACLE DIP SOCKET 42POS .6"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
242-1293-29-0602J
RECEPTACLE DIP SOCKET 42POS .6"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
42
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
248-1282-09-0602J
RECEPTACLE DIP SOCKET 48POS .6"
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
48
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
248-1282-19-0602J
RECEPTACLE DIP SOCKET 48POS .6"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
48
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
264-1300-09-0602J
RECEPTACLE DIP SOCKET 64POS .8"
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.8" (20.32mm) Row Spacing
DIP, 0.8" (20.32mm) Row Spacing
64
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
248-1282-39-0602J
RECEPTACLE DIP SOCKET 48POS .6"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
48
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
264-1300-29-0602J
RECEPTACLE DIP SOCKET 64POS .8"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.8" (20.32mm) Row Spacing
DIP, 0.8" (20.32mm) Row Spacing
64
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
290-1294-09-0602J
RECEPTACLE DIP SOCKET 90POS .9"
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.9" (22.86mm) Row Spacing
DIP, 0.9" (22.86mm) Row Spacing
90
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-
290-1294-29-0602J
RECEPTACLE DIP SOCKET 90POS .9"
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Textool™
DIP, 0.9" (22.86mm) Row Spacing
DIP, 0.9" (22.86mm) Row Spacing
90
0.070" (1.78mm)
Gold
Through Hole
Solder
0.070" (1.78mm)
Gold
Polysulfone (PSU), Glass Filled
-

About  Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance. Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs. For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability. Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design. By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.