Correct-A-Chip® 653000 Series, Socket Adapters

Results:
10
Manufacturer
Series
Number of Pins
Contact Finish - Post
Contact Finish - Mating
Housing Material
Termination
Mounting Type
Convert To (Adapter End)
Pitch - Post
Board Material
Pitch - Mating
Convert From (Adapter End)
Results remaining10
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Correct-A-Chip® 653000
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
28-653000-11-RC
SOCKET ADAPTER PLCC TO 28DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
32-653000-11-RC
SOCKET ADAPTER PLCC TO 32DIP 0.6
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
44-653000-11-RC
SOCKET ADAPTER PLCC TO 44DIP 0.6
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
44
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
68-653000-11-RC
SOCKET ADAPTER PLCC TO 68DIP 0.6
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
68
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
44-653000-10
SOCKET ADAPTER PLCC TO 44DIP 0.6
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
44
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
68-653000-10
SOCKET ADAPTER PLCC TO 68DIP 0.6
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
68
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
84-653000-10
SOCKET ADAPTER PLCC TO 84DIP 0.6
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
84
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
84-653000-11-RC
SOCKET ADAPTER PLCC TO 84DIP 0.6
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
84
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
28-653000-10
SOCKET ADAPTER PLCC TO 28DIP 0.6
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
32-653000-10
SOCKET ADAPTER PLCC TO 32DIP 0.6
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 653000
PLCC
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass

Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance. Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs. For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability. Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design. By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.