Correct-A-Chip® 1107254 Series, Socket Adapters

Results:
10
Manufacturer
Series
Number of Pins
Contact Finish - Mating
Pitch - Post
Board Material
Housing Material
Contact Finish - Post
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Convert From (Adapter End)
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Correct-A-Chip® 1107254
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
1107254-28
SOCKET ADAPTER DIP TO 28DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-08
SOCKET ADAPTER DIP TO 8DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
8
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-14
SOCKET ADAPTER DIP TO 14DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
14
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-20
SOCKET ADAPTER DIP TO 20DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
20
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-24
SOCKET ADAPTER DIP TO 24DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-16
SOCKET ADAPTER DIP TO 16DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
16
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-32
SOCKET ADAPTER DIP TO 32DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
32
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-40
SOCKET ADAPTER DIP TO 40DIP 0.3
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Quantity
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-18
SOCKET ADAPTER DIP TO 18DIP 0.3
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
18
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1107254-36
SOCKET ADAPTER DIP TO 36DIP 0.3
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1107254
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
36
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-

About  Socket Adapters

Sockets play a critical role in enabling the repeated insertion, removal, substitution, and replacement of Integrated Circuits (ICs) and transistors within electronic circuits. They provide a versatile interface that facilitates the seamless integration of various package types, ensuring flexibility and adaptability in electronic system design and maintenance. Socket adapters are valuable accessories that expand the compatibility and interchangeability of ICs and transistors by allowing the use of components designed for one package type to be utilized in place of another package type. This capability enhances the versatility of electronic systems and simplifies the process of upgrading or modifying existing circuit designs. For instance, socket adapters can enable the adaptation of an eight-pin Dual In-line Package (DIP) to a Joint Electron Device Engineering Council (JEDEC) socket package, providing a bridge between different package standards and facilitating component interchangeability. Moreover, socket adapters support the conversion of popular surface mount and through-hole package types, such as Ball Grid Array (BGA), Plastic Leaded Chip Carrier (PLCC), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), and Shrink Small Outline Integrated Circuit (SOWIC), to DIP and JEDEC formats. This broad compatibility ensures that a wide range of ICs and transistors can be integrated into electronic circuits, regardless of their original package design. By offering the ability to seamlessly adapt between different package types, socket adapters empower designers and engineers to optimize component selection and utilization, thereby enhancing the flexibility and longevity of electronic systems. This adaptability contributes to efficient system maintenance, upgrades, and compatibility across diverse electronic applications.