LEX System

LEX System

LEX Computech, a prominent industrial computer manufacturer based in Taiwan, specializes in delivering embedded solutions. Their offerings encompass industrial motherboards, fanless embedded systems, rugged panel PCs, network appliances, machine vision and automation controllers, AI Edge Computing, and IoT-related solutions. Notably listed on TPEx GISA (stock code: 7562), LEX Computech excels in project management, in-house manufacturing, and after-sales service, ensuring the provision of robust embedded solutions and a diverse array of application-oriented OEM/ODM services.

Single Board Computers (SBCs)

Results:
25
Series
USB
Size / Dimension
Operating Temperature
Core Processor
Video Outputs
Speed
Storage Interface
Expansion Site/Bus
RAM Capacity/Installed
Form Factor
RS-232 (422, 485)
Power (Watts)
Number of Cores
Watchdog Timer
Digital I/O Lines
Cooling Type
Analog Input:Output
Ethernet
Results remaining25
Applied Filters:
LEX System
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesOperating TemperaturePower (Watts)Cooling TypeEthernetRS-232 (422, 485)Digital I/O LinesAnalog Input:OutputWatchdog TimerSpeedCore ProcessorNumber of CoresSize / DimensionForm FactorExpansion Site/BusRAM Capacity/InstalledStorage InterfaceVideo OutputsUSB
2I640DW-J12
2.5" SBC W/CPU HEATSINK
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-20°C ~ 70°C
-
Heat Sink
-
2
4
-
Yes
2.6GHz
Intel Celeron J6412
4
4.331" x 3.858" (110.00mm x 98.00mm)
Mini-ITX
M.2, Nano SIM
32GB/0GB
M.2
HDMI, eDP
USB 2.0 (3), USB 3.0 (2)
SKY2 2I640DW-E13
COMPACT DIN-RAIL EMBEDDDED SYSTE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 60°C
-
Heat Sink
-
2
4
-
Yes
2.7GHz
Intel ATOM x6413E
4
5.551" x 4.378" (141.00mm x 111.20mm)
-
M.2, Nano SIM
32GB/0GB
2.5" SSD, M.2
HDMI
USB 2.0 (3), USB 3.0 (2)
2I640HW-E13
2.5" SBC W/CPU HEATSINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-20°C ~ 70°C
-
Heat Sink
-
4
4
-
Yes
2.7GHz
Intel ATOM x6413E
4
4.016" x 3.465" (102.00mm x 88.00mm)
Mini-ITX
M.2, Mini PCIe, Nano SIM
8GB/8GB
M.2, SATA
HDMI, eDP, LVDS
USB 2.0 (5), USB 3.0 (1)
SKY2 2I640CW-E13
COMPACT DIN-RAIL EMBEDDDED SYSTE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 60°C
-
Heat Sink
-
4
4
-
Yes
2.7GHz
Intel ATOM x6413E
4
5.551" x 4.378" (141.00mm x 111.20mm)
-
M.2, Mini PCIe, Nano SIM
8GB/8GB
2.5" SSD/HDD, M.2, SATA
HDMI
USB 2.0 (4), USB 3.0 (2)
2I110AW-EI3
2.5" SBC W/CPU HEATSINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 70°C
-
Heat Sink
-
2
4
-
Yes
2.2GHz
Intel Core i3-1115GRE
2
4.252" x 4.016" (108.00mm x 108.00mm)
Mini-ITX
M.2, Nano SIM
32GB/0GB
M.2, SATA
HDMI
USB 2.0 (4), USB 3.0 (2)
2I110D-EI7
2.5" SBC W/CPU HEATSINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 70°C
-
Heat Sink
-
2
4
-
Yes
1.8GHz
Intel Core i7-1185GRE
4
4.252" x 4.016" (108.00mm x 108.00mm)
Mini-ITX
M.2, Nano SIM
32GB/0GB
M.2, SATA
HDMI, eDP
USB 2.0 (6), USB 3.0 (3)
SKY2 2I640DW-J12
COMPACT DIN-RAIL EMBEDDDED SYSTE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0°C ~ 60°C
-
Heat Sink
-
2
4
-
Yes
2.6GHz
Intel Celeron J6412
4
5.551" x 4.378" (141.00mm x 111.20mm)
-
M.2, Nano SIM
32GB/0GB
2.5" SSD, M.2
HDMI
USB 2.0 (3), USB 3.0 (2)
TERA 2I640DW-E13
COMPACT EMBEDDDED SYSTEM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-20°C ~ 60°C
30W
Heat Sink
-
2
4
-
Yes
2.7GHz
Intel ATOM x6413E
4
5.709" x 4.031" (145.00mm x 102.40mm)
-
M.2, Nano SIM
32GB/0GB
2.5" SSD, M.2
HDMI
USB 2.0 (2), USB 3.0 (2)
SKY2 2I640CW-J12
COMPACT DIN-RAIL EMBEDDDED SYSTE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0°C ~ 60°C
-
Heat Sink
-
4
4
-
Yes
2.6GHz
Intel Celeron J6412
4
5.551" x 4.378" (141.00mm x 111.20mm)
-
M.2, Mini PCIe, Nano SIM
8GB/8GB
2.5" SSD/HDD, M.2, SATA
HDMI
USB 2.0 (4), USB 3.0 (2)
TERA 2I640CW-E13
COMPACT EMBEDDDED SYSTEM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-20°C ~ 60°C
30W
Heat Sink
-
4
4
-
Yes
2.7GHz
Intel ATOM x6413E
4
5.709" x 4.031" (145.00mm x 102.40mm)
-
M.2, Mini PCIe, Nano SIM
8GB/8GB
2.5" SSD/HDD, M.2, SATA
HDMI
USB 2.0 (2), USB 3.0 (2)
2I110D-EI3
2.5" SBC W/CPU HEATSINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 70°C
-
Heat Sink
-
2
4
-
Yes
2.2GHz
Intel Core i3-1115GRE
2
4.252" x 4.016" (108.00mm x 108.00mm)
Mini-ITX
M.2, Nano SIM
32GB/0GB
M.2, SATA
HDMI, eDP
USB 2.0 (6), USB 3.0 (3)
SKY2 2I110AW-EI3
COMPACT DIN-RAIL EMBEDDDED SYSTE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-20°C ~ 60°C
-
Heat Sink
-
2
4
-
Yes
2.2GHz
Intel Core i3-1115GRE
2
5.551" x 4.378" (141.00mm x 111.20mm)
-
M.2, Nano SIM
32GB/0GB
2.5" SSD/HDD, M.2, SATA
HDMI
USB 2.0 (2), USB 3.0 (2)
2I110AW-EI7
2.5" SBC W/CPU HEATSINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 70°C
-
Heat Sink
-
2
4
-
Yes
1.8GHz
Intel Core i7-1185GRE
4
4.252" x 4.016" (108.00mm x 108.00mm)
Mini-ITX
M.2, Nano SIM
32GB/0GB
M.2, SATA
HDMI
USB 2.0 (4), USB 3.0 (2)
3I110HW-EI7
3.5" SBC W/CPU HEATSINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 70°C
-
Heat Sink
-
4
4
-
Yes
1.8GHz
Intel Core i7-1185GRE
4
5.748" x 4.528" (146.00mm x 115.00mm)
3.5"
M.2, Mini PCIe, SIM
64GB/0GB
M.2, SATA
HDMI, eDP, LVDS, VGA
USB 2.0 (6)
TERA 2I640DW-J12
COMPACT EMBEDDDED SYSTEM
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0°C ~ 60°C
30W
Heat Sink
-
2
4
-
Yes
2.6GHz
Intel Celeron J6412
4
5.709" x 4.031" (145.00mm x 102.40mm)
-
M.2, Nano SIM
32GB/0GB
2.5" SSD, M.2
HDMI
USB 2.0 (2), USB 3.0 (2)
SKY2-2I640DW-E13
Fanless DIN-rail Embedded CHASSI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-40°C ~ 60°C
-
Heat Sink
-
2
4
-
Yes
2.7GHz
Intel ATOM x6413E
4
5.551" x 4.378" (141.00mm x 111.20mm)
-
M.2, Nano SIM
32GB/0GB
2.5" SSD, M.2
HDMI
USB 2.0 (3), USB 3.0 (2)
2I640CW-E13
2.5" SBC W/CPU HEATSINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-20°C ~ 70°C
-
Heat Sink
-
4
4
-
Yes
2.7GHz
Intel ATOM x6413E
4
4.016" x 3.465" (102.00mm x 88.00mm)
Mini-ITX
M.2, Mini PCIe, Nano SIM
8GB/8GB
M.2, SATA
HDMI, eDP
USB 2.0 (5), USB 3.0 (2)
SKY2 2I110D-EI3
COMPACT DIN-RAIL EMBEDDDED SYSTE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-20°C ~ 60°C
-
Heat Sink
-
2
4
-
Yes
2.2GHz
Intel Core i3-1115GRE
2
5.551" x 4.378" (141.00mm x 111.20mm)
-
M.2, Nano SIM
32GB/0GB
2.5" SSD/HDD, M.2, SATA
HDMI
USB 2.0 (2), USB 3.0 (3)
2I640DW-E13
2.5" SBC W/CPU HEATSINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-20°C ~ 70°C
-
Heat Sink
-
2
4
-
Yes
2.7GHz
Intel ATOM x6413E
4
4.331" x 3.858" (110.00mm x 98.00mm)
Mini-ITX
M.2, Nano SIM
32GB/0GB
M.2
HDMI, eDP
USB 2.0 (3), USB 3.0 (2)
2I640CW-J12
2.5" SBC W/CPU HEATSINK
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-20°C ~ 70°C
-
Heat Sink
-
4
4
-
Yes
2.6GHz
Intel Celeron J6412
4
4.016" x 3.465" (102.00mm x 88.00mm)
Mini-ITX
M.2, Mini PCIe, Nano SIM
8GB/8GB
M.2, SATA
HDMI, eDP
USB 2.0 (5), USB 3.0 (2)

About  Single Board Computers (SBCs)

Single Board Computers (SBCs) are compact electronic devices that contain all the necessary components of a computer on a single board. These devices typically include a microprocessor, memory, input/output interfaces, and expansion sites. The microprocessor is the core component of the SBC, responsible for performing numerical and logical processing tasks. The speed, number of cores, power consumption, and cooling type are important characteristics of the microprocessor, as they determine the overall performance and efficiency of the SBC. SBCs can be equipped with a variety of different microprocessors, including those produced by companies such as Advantech, AMD (including their core, G-series, Geode, and GX lines), ARMADA, ARM Cortex, Atom, Celeron, ColdFire, Core 2, Intel (including their Atom, Celeron, Core, LGA, Quark, Apollo, and Pentium lines), Pentium, Rabbit, RK3288, Rochchip, TI Sitara, ULV Celeron, VIA Eden, Vortex, and Z180. In addition to the microprocessor, SBCs also contain memory, which is used to store data and software instructions. The amount and type of memory present on an SBC can impact its performance and compatibility with different software applications. Input/output interfaces allow the SBC to communicate with other devices and peripherals, such as displays, keyboards, and sensors. Expansion sites provide the ability to add additional functionality or customize the SBC to specific application requirements. Overall, SBCs offer a compact and versatile solution for incorporating computing power into a wide range of devices and equipment. By selecting the appropriate microprocessor, memory, and expansion options, developers can create customized SBC solutions tailored to their unique needs.