WLSC Series, Silicon Capacitors

Results:
16
Manufacturer
Series
Capacitance
Size / Dimension
Package / Case
Voltage - Breakdown
Height
Features
ESL (Equivalent Series Inductance)
Tolerance
ESR (Equivalent Series Resistance)
Operating Temperature
Applications
Results remaining16
Applied Filters:
WLSC
Select
ImageProduct DetailPriceAvailabilityECAD ModelToleranceCapacitanceOperating TemperatureESR (Equivalent Series Resistance)SeriesVoltage - BreakdownESL (Equivalent Series Inductance)ApplicationsFeaturesPackage / CaseHeightSize / Dimension
935146522310-W0T
CAP SILICON 100PF 15% 150V SMD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
±15%
100 pF
-55°C ~ 150°C
50 mOhms
WLSC
150 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
Nonstandard Chip
0.005" (0.12mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
935146832410-W0T
CAP SILICON 1000PF 15% 30V SMD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
±15%
1000 pF
-55°C ~ 150°C
50 mOhms
WLSC
30 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
Nonstandard Chip
0.005" (0.12mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
935146521410-T3T
CAP SILICON 1000PF 15% 150V 0202
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
±15%
1000 pF
-55°C ~ 150°C
50 mOhms
WLSC
150 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0202 (0505 Metric)
0.005" (0.12mm)
0.020" L x 0.020" W (0.50mm x 0.50mm)
935146528247-W0T
CAP SILICON 47PF 15% 150V 0201
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
±15%
47 pF
-55°C ~ 150°C
50 mOhms
WLSC
150 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0201 (0603 Metric)
0.005" (0.12mm)
0.020" L x 0.010" W (0.50mm x 0.25mm)
935146529315-W0T
CAP SILICON 150PF 15% 150V SMD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
±15%
150 pF
-55°C ~ 150°C
50 mOhms
WLSC
150 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
Nonstandard Chip
0.005" (0.12mm)
0.015" L x 0.015" W (0.38mm x 0.38mm)
935146521310-T3T
CAP SILICON 100PF 15% 150V 0202
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
±15%
100 pF
-55°C ~ 150°C
50 mOhms
WLSC
150 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0202 (0505 Metric)
0.005" (0.12mm)
0.020" L x 0.020" W (0.50mm x 0.50mm)
935146831510-T3T
CAP SILICON 10000PF 15% 30V 0202
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
±15%
10000 pF
-55°C ~ 150°C
50 mOhms
WLSC
30 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0202 (0505 Metric)
0.005" (0.12mm)
0.020" L x 0.020" W (0.50mm x 0.50mm)
935146632410-W0T
CAP SILICON 1000PF 15% 50V SMD
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
±15%
1000 pF
-55°C ~ 150°C
50 mOhms
WLSC
50 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
Nonstandard Chip
0.005" (0.12mm)
0.012" L x 0.012" W (0.29mm x 0.29mm)
935146632322-W0T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
220 pF
-55°C ~ 150°C
-
WLSC
50 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
Nonstandard Chip
0.005" (0.12mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
935246521437-T3T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
3700 pF
-55°C ~ 150°C
-
WLSC
150 V
-
High Stability, Vertical Silicon Cap, Wirebond
-
Nonstandard Chip
0.010" (0.25mm)
0.020" L x 0.049" W (0.50mm x 1.25mm)
935146050510-T3T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
10000 pF
-55°C ~ 150°C
-
WLSC
100 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
0303 (0808 Metric)
0.004" (0.10mm)
0.031" L x 0.031" W (0.80mm x 0.80mm)
935146837522-T3T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
0.022 µF
-55°C ~ 150°C
-
WLSC
30 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
0402 (1005 Metric)
0.005" (0.12mm)
0.039" L x 0.020" W (1.00mm x 0.50mm)
935146632327-W0T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
270 pF
-55°C ~ 150°C
-
WLSC
50 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
Nonstandard Chip
0.005" (0.12mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
935146632347-W0T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
470 pF
-55°C ~ 150°C
-
WLSC
50 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
Nonstandard Chip
0.005" (0.12mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
935246520427-T3T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
2700 pF
-55°C ~ 150°C
-
WLSC
150 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
Nonstandard Chip
0.004" (0.10mm)
0.020" L x 0.079" W (0.50mm x 2.00mm)
935246522447-T3T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
4700 pF
-55°C ~ 150°C
-
WLSC
150 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
Nonstandard Chip
0.010" (0.25mm)
0.020" L x 0.064" W (0.50mm x 1.63mm)

About  Silicon Capacitors

Silicon and thin-film capacitors are specialized devices that are manufactured using tools, methods, and materials commonly associated with semiconductor device production. This enables the production of capacitors with near-ideal characteristics and exceptional parameter stability. However, these capacitors have a limited range of available values and tend to be more expensive compared to ceramic-based capacitors, which are their primary competitors. The manufacturing process of silicon and thin-film capacitors allows for extreme precision and control over the production parameters. This results in capacitors that exhibit excellent stability in terms of capacitance, voltage ratings, and other electrical properties. They are designed to maintain their specified values over time and under varying conditions, making them ideal for applications that require precise and reliable performance. Despite their advantages, silicon and thin-film capacitors have a relatively narrow range of available capacitance values compared to ceramic-based capacitors. This limitation may restrict their use in certain applications that require a broader range of capacitance options. Furthermore, the cost of manufacturing silicon and thin-film capacitors is generally higher due to the specialized processes and materials involved. As a result, these capacitors are often considered more expensive compared to ceramic-based alternatives. In summary, silicon and thin-film capacitors are produced using semiconductor manufacturing techniques, allowing for the creation of capacitors with near-ideal characteristics and excellent parameter stability. While they have a limited range of capacitance values, they are well-suited for applications that demand precise and reliable performance. However, their higher cost compared to ceramic-based capacitors is an important consideration when selecting the appropriate capacitor for a given application.