J1MACD-6XP=M39016/23-026P
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
6VDC
115VAC, 28VDC - Max
48 mA
Non Latching
Sealed - Hermetically
-
3.5 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.28 VDC
2 ms
1MA, CII
J1MAPD-5XL = M39016/23-019L
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
5VDC
115VAC, 28VDC - Max
79.4 mA
Non Latching
Sealed - Hermetically
-
2.8 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.23 VDC
2 ms
1MA, CII
J1MAC-26XL = M39016/7-030L
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
-
26.5VDC
115VAC, 28VDC - Max
13.3 mA
Non Latching
Sealed - Hermetically
-
14.2 VDC
2 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
1.37 VDC
2 ms
1MA, CII
J1MAC-5XM = M39016/7-025M
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
-
5VDC
115VAC, 28VDC - Max
79.4 mA
Non Latching
Sealed - Hermetically
-
2.8 VDC
2 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.23 VDC
2 ms
1MA, CII
J1MAP-26XL = M39016/7-024L
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
-
26.5VDC
115VAC, 28VDC - Max
13.3 mA
Non Latching
Sealed - Hermetically
-
14.2 VDC
2 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
1.37 VDC
2 ms
1MA, CII
J1MAW-26XL = M39016/7-023L
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
-
26.5VDC
115VAC, 28VDC - Max
13.3 mA
Non Latching
Sealed - Hermetically
-
14.2 VDC
2 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
1.37 VDC
2 ms
1MA, CII
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
-
12VDC
115VAC, 28VDC - Max
24 mA
Non Latching
Sealed - Hermetically
-
7 VDC
2 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.63 VDC
2 ms
1MA, CII
J1MAPDD-26XM=M39016/24-024M
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
26.5VDC
115VAC, 28VDC - Max
13.3 mA
Non Latching
Sealed - Hermetically
-
15.4 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
1.37 VDC
2 ms
1MA, CII
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
-
5VDC
115VAC, 28VDC - Max
-
Non Latching
Sealed - Hermetically
-
2.8 VDC
2 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.23 VDC
2 ms
1MA, CII
J1MACD-26XP = M39016/23-030P
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
26.5VDC
115VAC, 28VDC - Max
13.3 mA
Non Latching
Sealed - Hermetically
-
14.2 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
1.37 VDC
2 ms
1MA, CII
J1MACD-12XLS = M39016/23-034L
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
12VDC
115VAC, 28VDC - Max
24 mA
Non Latching
Sealed - Hermetically
-
7 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.63 VDC
2 ms
1MA, CII
J1MACDD-5XPS = M39016/24-031P
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
5VDC
115VAC, 28VDC - Max
100 mA
Non Latching
Sealed - Hermetically
-
3.5 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.23 VDC
2 ms
1MA, CII
J1MAWDD-5XL=M39016/24-013L
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
5VDC
115VAC, 28VDC - Max
100 mA
Non Latching
Sealed - Hermetically
-
3.5 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.23 VDC
2 ms
1MA, CII
J1MACT-5XPS = M28776/5-031P
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
5VDC
115VAC, 28VDC - Max
79.4 mA
Non Latching
Sealed - Hermetically
-
3 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.24 VDC
2 ms
1MA, CII
J1MACT-5XP = M28776/5-025P
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
5VDC
115VAC, 28VDC - Max
79.4 mA
Non Latching
Sealed - Hermetically
-
3 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.24 VDC
2 ms
1MA, CII
J1MAWT-12XP=M28776/5-016P
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
12VDC
115VAC, 28VDC - Max
24 mA
Non Latching
Sealed - Hermetically
-
7.2 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.62 VDC
2 ms
1MA, CII
J1MACT-18XL=M28776/5-029L
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
18VDC
115VAC, 28VDC - Max
15.9 mA
Non Latching
Sealed - Hermetically
-
10.7 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.94 VDC
2 ms
1MA, CII
J1MACD-5XL=M39016/23-025L
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
Diode
5VDC
115VAC, 28VDC - Max
79.4 mA
Non Latching
Sealed - Hermetically
-
2.8 VDC
4 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.23 VDC
2 ms
1MA, CII
J1MAC-12XM = M39016/7-028M
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
-
12VDC
115VAC, 28VDC - Max
-
Non Latching
Sealed - Hermetically
-
7 VDC
2 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.63 VDC
2 ms
1MA, CII
J1MAC-18XM = M39016/7-029M
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PCB Symbol, Footprint & 3D Model
Through Hole
PC Pin
-65°C ~ 125°C
SPDT (1 Form C)
-
18VDC
115VAC, 28VDC - Max
-
Non Latching
Sealed - Hermetically
-
10.5 VDC
2 ms
Silver Palladium (AgPd), Gold (Au)
General Purpose
1 A
0.91 VDC
2 ms
1MA, CII