ECAP Series, RFI and EMI - Shielding and Absorbing Materials

RFI and EMI shielding materials play a crucial role in the protection of sensitive electronic devices and circuits by effectively managing and redirecting electronic noise. These materials are specifically designed to absorb, reflect, or conduct electromagnetic interference (EMI) and radio-frequency interference (RFI) away from or around the sensitive components. A range of shielding material options are available for this purpose. Aluminum, copper, tin, epoxy and ferrite powders, gold fabric, nickel, nitrile, and various forms of polyester are commonly utilized. Each material possesses unique properties that contribute to its effectiveness in shielding against EMI and RFI. These shielding materials are typically available in various forms such as adhesive and non-adhesive sheets, rolls, tapes, and die-cut shapes. This diverse range of formats allows for flexibility in application, enabling the materials to be easily integrated into different electronic systems and configurations. Adhesive sheets and tapes offer a convenient and secure method of attaching the shielding material to the desired surfaces or components. They provide a reliable bond while ensuring that the shielding effectiveness is maintained. Non-adhesive sheets, rolls, and die-cut shapes provide alternative options for shielding applications. They can be used in situations where adhesives are not suitable or necessary, allowing for customized shielding solutions based on specific design requirements. Overall, RFI and EMI shielding materials are essential in safeguarding sensitive devices and circuits from electronic noise. By utilizing materials such as aluminum, copper, tin, epoxy and ferrite powders, gold fabric, nickel, nitrile, and polyester, and with their availability in different formats, including adhesive and non-adhesive sheets, rolls, tapes, and die-cut shapes, these shielding materials provide effective protection against unwanted electromagnetic interference.