ECOGREEN™ Series, RFI and EMI - Contacts, Fingerstock and Gaskets

Results:
25
Manufacturer
Series
Width
Height
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Shape
Operating Temperature
Type
Plating
Material
Attachment Method
Plating - Thickness
Results remaining25
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ECOGREEN™
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ImageProduct DetailPriceAvailabilityECAD ModelOperating TemperaturePlatingWidthShapeLengthSeriesTypeHeightMaterialPlating - ThicknessAttachment Method
4246PA51H01700
GK,NICU,PTAFG,PU,V0,REC .050X.09
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.090" (2.29mm)
Rectangle
17.000" (431.80mm)
ECOGREEN™
Fabric Over Foam
0.050" (1.27mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4283PA51H03800
GK,NICU,PTAFG,PU,V0,DSH .079X.15
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.157" (3.99mm)
D-Shape
38.000" (965.20mm)
ECOGREEN™
Fabric Over Foam
0.080" (2.03mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4912PA51H08400
GK,NICU,PTAFG,PU,V0,DSH .090X.15
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.150" (3.81mm)
D-Shape
7.00' (2.13m)
ECOGREEN™
Fabric Over Foam
0.090" (2.29mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4C13PA51H00400
GK,NICU,PTAFG,PU,V0,DSH .080X.19
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
-
-
4.000" (101.60mm)
ECOGREEN™
Fabric Over Foam
-
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4157PA51H00100
GK,NICU,PTAFG,PU,V0,REC .060X.28
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.787" (20.00mm)
Rectangle
1.000" (25.40mm)
ECOGREEN™
Fabric Over Foam
0.630" (16.00mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4788PB51H00100
GK,NICU,PTAFG,PU,V0,REC .125X.25
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.250" (6.35mm)
Rectangle
1.000" (25.40mm)
ECOGREEN™
Fabric Over Foam
0.125" (3.18mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4626AB51H09600
GK,NICU,PTAFG,PU,V0,REC .060X.60
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.608" (15.44mm)
Rectangle
8.00' (2.44m)
ECOGREEN™
Fabric Over Foam
0.630" (16.00mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4295PA51H09600
GK,NICU,PTAFG,PU,V0,DSH .170X.25
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.250" (6.35mm)
D-Shape
8.00' (2.44m)
ECOGREEN™
Fabric Over Foam
0.170" (4.32mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4117PA51H01700
GK,NICU,PTAFG,PU,V0,JSH .130X.13
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.130" (3.30mm)
J-Shape
17.000" (431.80mm)
ECOGREEN™
Fabric Over Foam
0.130" (3.30mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4R14AA51H01800
GK,NICU,PTAFG,PU,V0,RND .250X.25
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
-
-
18.000" (457.20mm)
ECOGREEN™
Fabric Over Foam
-
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4212PC51H01800
GK,NICU,PTAFG,PU,V0,SQ .195X.195
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.195" (4.95mm)
Square
18.000" (457.20mm)
ECOGREEN™
Fabric Over Foam
0.195" (4.95mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
8103010447
UFSF,BECU,NID,RL .125X.375
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Unplated
0.375" (9.53mm)
Round
-
ECOGREEN™
Gasket
0.125" (3.18mm)
Beryllium Copper
-
-
4D44AC51H01200
GK,NICU,PTAFG,PU,V0,REC .394X.27
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
-
-
12.000" (304.80mm)
ECOGREEN™
Fabric Over Foam
-
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4694PA51H01100
GK,NICU,PTAFG,PU,V0,REC .125X.50
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.500" (12.70mm)
Rectangle
11.000" (279.40mm)
ECOGREEN™
Fabric Over Foam
0.125" (3.18mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4359PA51H07500
GK,NICU,PTAFG,PU,V0,REC .080X.71
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.710" (18.03mm)
Rectangle
6.25' (1.91m)
ECOGREEN™
Fabric Over Foam
0.080" (2.03mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4228PA51H09600
GK,NICU,PTAFG,PU,V0,DSH .150X.15
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.150" (3.81mm)
D-Shape
8.00' (2.44m)
ECOGREEN™
Fabric Over Foam
0.150" (3.80mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4105PA51H09600
GK,NICU,PTAFG,PU,V0,DSH .375X.50
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.500" (12.70mm)
D-Shape
8.00' (2.44m)
ECOGREEN™
Fabric Over Foam
0.375" (9.53mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4245PA51H09600
GK,NICU,PTAFG,PU,V0,REC .040X.12
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.120" (3.05mm)
Rectangle
8.00' (2.44m)
ECOGREEN™
Fabric Over Foam
0.040" (1.02mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4584PA51H09600
GK,NICU,PTAFG,PU,V0,DSH .040X.15
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.150" (3.81mm)
D-Shape
8.00' (2.44m)
ECOGREEN™
Fabric Over Foam
0.040" (1.02mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive
4208PA51H09600
GK,NICU,PTAFG,PU,V0,REC .040X.39
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Quantity
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PCB Symbol, Footprint & 3D Model
-40°C ~ 70°C
-
0.395" (10.03mm)
Rectangle
8.00' (2.44m)
ECOGREEN™
Fabric Over Foam
0.040" (1.02mm)
Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
-
Adhesive

About  RFI and EMI - Contacts, Fingerstock and Gaskets

Fingerstock and gasket contacts are components utilized to mitigate electromagnetic interference (EMI), also known as radio-frequency interference (RFI) when it occurs within the radio frequency spectrum. EMI can negatively impact electrical circuits through electromagnetic induction, electrostatic coupling or conduction. These contacts are employed in situations where parts or doors of a chassis or enclosure are removable, rendering them vulnerable to EMI. To attach these contacts, various methods can be used, including adhesive, clips, hardware, solder, slotting or snap-in channels. The choice of attachment method is dependent on the specific requirements of the application and the materials involved. Fingerstock contacts consist of conductive metal strips that are shaped in a "U" or "V" shape, forming a spring-like structure when mounted onto a surface. These contacts allow for effective grounding and shielding against EMI by creating a conductive path between two surfaces while maintaining a low impedance connection. Gasket contacts, on the other hand, utilize conductive elastomer material or metal mesh that is installed between two surfaces. This material creates a tight seal that prevents EMI from passing through the gap between the two surfaces. Gasket contacts are commonly used in applications where environmental sealing is required, in addition to EMI protection. In summary, fingerstock and gasket contacts serve as critical components for limiting electromagnetic interference (EMI) in electrical circuits. With their different construction and attachment methods, they offer effective grounding and shielding capabilities that preserve signal integrity and ensure reliable system operation.