NXP Semiconductors

NXP Semiconductors

NXP Semiconductors is a global leader in the semiconductor industry, providing high-performance mixed-signal and standard products for various applications. With a rich history dating back to 1953, NXP has established itself as a trusted provider of innovative solutions. Headquartered in the Netherlands, NXP operates in over 30 countries and employs approximately 30,000 people worldwide. Their mission is to create secure connections and infrastructure for a smarter world. NXP's product portfolio includes microcontrollers, secure identification solutions, automotive electronics, sensors, RF power amplifiers, connectivity solutions, and more. They actively collaborate with industry partners and research institutions to drive technological advancements and promote sustainability.

RF Transceiver ICs

Results:
411
Series
Current - Transmitting
Power - Output
Memory Size
Sensitivity
Current - Receiving
Supplier Device Package
Package / Case
Voltage - Supply
Operating Temperature
Serial Interfaces
GPIO
Protocol
Data Rate (Max)
RF Family/Standard
Modulation
Frequency
Mounting Type
Type
Grade
Qualification
Results remaining411
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NXP Semiconductors
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesMounting TypePower - OutputCurrent - TransmittingMemory SizeSensitivityFrequencyTypeRF Family/StandardProtocolModulationData Rate (Max)Serial InterfacesVoltage - SupplyCurrent - ReceivingOperating TemperaturePackage / CaseSupplier Device PackageGradeGPIOQualification
TEF8102EN/N1E
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
12dBm
-
-
-
76GHz ~ 81GHz
TxRx + MCU
-
-
-
40Mbps
SPI
1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
-
-40°C ~ 135°C (TJ)
155-WFBGA
155-WFBGA (7.5x7.5)
-
-
-
MC13201FCR2
IC RF TXRX 802.15.4 32VFQFN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
4dBm
30mA
-
-91dBm
2.4GHz
TxRx Only
802.15.4, General ISM > 1GHz
-
DSSS, O-QPSK
250kbps
SPI
2V ~ 3.4V
37mA
-40°C ~ 85°C
32-VFQFN Exposed Pad
32-HVQFN (5x5)
-
7
-
QN9030THN/001Z
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
11dBm
7.4mA ~ 20.3mA
-
-97dBm
2.4GHz
TxRx + MCU
Bluetooth
Bluetooth v5.0
-
2Mbps
I²C, SPI, PWM, UART
1.9V ~ 3.6V
4.3mA
-40°C ~ 125°C (TJ)
40-VFQFN Exposed Pad
40-HVQFN (6x6)
-
-
-
K32W061Y
K32W061 BLE/ZIGBEE SOC WITH NTAG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
11.2dBm
7.4mA ~ 20.3mA
640kB Flash, 152kB SRAM
-101.3dBm
2.4GHz
TxRx + MCU
802.15.4, Bluetooth
Bluetooth v5.0
-
2Mbps
I²C, SPI, PWM, UART
1.9V ~ 3.6V
4.3mA
-40°C ~ 125°C
40-VFQFN Exposed Pad
40-HVQFN (6x6)
-
22
-
K32W041Y
K32W041 BLE/ZIGBEE SOC
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
11.2dBm
7.4mA ~ 20.3mA
640kB Flash, 152kB SRAM
-101.3dBm
2.4GHz
TxRx + MCU
802.15.4, Bluetooth
Bluetooth v5.0, Thread, Zigbee®
-
2Mbps
I²C, SPI, PWM, UART
1.9V ~ 3.6V
4.3mA
-40°C ~ 125°C
40-VFQFN Exposed Pad
40-HVQFN (6x6)
-
22
-
JN5164/001,515
IC RF TXRX+MCU 802.15.4 40VFQFN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
2.5dBm
15.3mA
160kB Flash, 4kB EEPROM, 32kB RAM
-96dBm
2.4GHz
TxRx + MCU
802.15.4
ZigbeePRO®
O-QPSK
1Mbps
I²C, JTAG, SPI, UART
2V ~ 3.6V
17mA
-40°C ~ 125°C
40-VFQFN Exposed Pad
40-HVQFN (6x6)
-
20
-
MKW36Z512VFP4
KINETIS W 32-BIT MCU ARM CORTEX-
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Quantity
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PCB Symbol, Footprint & 3D Model
Kinetis KW36Z
Surface Mount, Wettable Flank
5dBm
5.7mA
265kB Flash, 64kB RAM
-99dBm
2.4GHz
TxRx + MCU
Bluetooth
Bluetooth v5.0
FSK, GFSK, MSK
1Mbps
I²C, SPI, UART
1.71V ~ 3.6V
6.3mA
-40°C ~ 105°C (TA)
40-VFQFN Exposed Pad
40-HVQFN (6x6)
-
-
-
JN5139/Z01,515
IC RF TXRX+MCU 802.15.4 56VFQFN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
3dBm
38mA
192kB ROM, 96kB RAM
-97dBm
2.4GHz
TxRx + MCU
802.15.4
Zigbee®
-
1Mbps
SPI, UART
2.2V ~ 3.6V
37mA
-40°C ~ 85°C
56-VFQFN
-
-
21
-
JN5139/Z01,518
IC RF TXRX+MCU 802.15.4 56VFQFN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
3dBm
38mA
192kB ROM, 96kB RAM
-97dBm
2.4GHz
TxRx + MCU
802.15.4
Zigbee®
-
1Mbps
SPI, UART
2.2V ~ 3.6V
37mA
-40°C ~ 85°C
56-VFQFN
-
21
JN5148/001,515
IC RF TXRX+MCU 802.15.4 56VFQFN
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
2.75dBm
15mA
128kB ROM, 128kB RAM
-96.5dBm
2.4GHz
TxRx + MCU
802.15.4
Zigbee®
O-QPSK
667kbps
I²C, JTAG, SPI, UART
2V ~ 3.6V
17.5mA
-40°C ~ 85°C
56-VFQFN
-
-
21
-
K32W061Z
K32W061 BLE/ZIGBEE SOC WITH NTAG
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
11.2dBm
7.4mA ~ 20.3mA
640kB Flash, 152kB SRAM
-101.3dBm
2.4GHz
TxRx + MCU
802.15.4, Bluetooth
Bluetooth v5.0
-
2Mbps
I²C, SPI, PWM, UART
1.9V ~ 3.6V
4.3mA
-40°C ~ 125°C
40-VFQFN Exposed Pad
40-HVQFN (6x6)
-
22
-
MKW35A512VFT4
KINETIS W MCU ARM CM0+
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Quantity
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PCB Symbol, Footprint & 3D Model
Kinetis KW35A
Surface Mount, Wettable Flank
5dBm
5.7mA
512kB Flash, 64kB RAM
-95dBm
2.4GHz
TxRx + MCU
Bluetooth
Bluetooth v5.0
FSK, GFSK, MSK
1Mbps
I²C, SPI, UART
1.71V ~ 3.6V
6.3mA
-40°C ~ 105°C (TA)
48-VFQFN Exposed Pad
48-HVQFN (7x7)
Automotive
-
AEC-Q100
MKW36A512VFP4R
KINETIS W 32-BIT MCU ARM CORTEX-
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Quantity
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PCB Symbol, Footprint & 3D Model
Kinetis KW36A
Surface Mount, Wettable Flank
5dBm
5.7mA
265kB Flash, 64kB RAM
-95dBm
2.4GHz
TxRx + MCU
Bluetooth
Bluetooth v5.0
FSK, GFSK, MSK
1Mbps
I²C, SPI, UART
1.71V ~ 3.6V
6.3mA
-40°C ~ 105°C (TA)
40-VFQFN Exposed Pad
40-HVQFN (6x6)
Automotive
-
AEC-Q100
MKW41Z512CAT4R
IC RF TXRX+MCU 802.15.4 75UFBGA
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Quantity
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PCB Symbol, Footprint & 3D Model
Kinetis KW41Z
Surface Mount
3.5dBm
6.08mA
512kB Flash, 128kB RAM
-100dBm
2.36GHz ~ 2.48GHz
TxRx + MCU
802.15.4, Bluetooth
Bluetooth v4.2
FSK, GFSK, MSK, O-QPSK
1Mbps
I²C, SPI, UART
1.71V ~ 3.6V
6.76mA
-40°C ~ 105°C (TA)
75-UFBGA, WLCSP
75-WLCSP (3.89x3.8)
-
-
-
MKW31Z512VHT4R
KINETIS KW31Z: BLE 4.2 WIRELESS
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Quantity
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PCB Symbol, Footprint & 3D Model
Kinetis KW31Z
Surface Mount
3.5dBm
6mA
512kB Flash, 128kB RAM
-95dBm
2.4GHz
TxRx + MCU
Bluetooth
Bluetooth v4.2
FSK, GFSK, MSK, O-QPSK
1Mbps
I²C, SPI, UART
1.71V ~ 3.6V
6.2mA
-40°C ~ 85°C (TA)
64-VFLGA
64-VFLGA (7x7)
-
-
-
QN9090HN/001Y
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
11dBm
7.4mA ~ 20.3mA
-
-97dBm
2.4GHz
TxRx + MCU
Bluetooth
Bluetooth v5.0
-
2Mbps
I²C, SPI, PWM, UART
1.9V ~ 3.6V
4.3mA
-40°C ~ 125°C (TJ)
40-VFQFN Exposed Pad
40-HVQFN (6x6)
-
-
-
NCK2912AHN/T0B/UY
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
QN9022/DY
QN9022 - ULTRA LOW POWER BLUETOO
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
4dBm
8.8mA
128kB Flash
-95dBm
2.4GHz
TxRx Only
Bluetooth
Bluetooth v4.0
-
-
I²C, SPI, UART
2.4V ~ 3.6V
9.2mA
-40°C ~ 85°C
40-VFQFN Exposed Pad
40-HVQFN (5x5)
-
31
-
MKW31Z256VHT4557
KINETIS KW31Z - BLE 4.2 WIRELES
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Quantity
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PCB Symbol, Footprint & 3D Model
Kinetis KW31Z
Surface Mount
4dBm
6mA
256kB Flash, 64kB RAM
-102dBm
2.4GHz
TxRx + MCU
Bluetooth
Bluetooth v4.2
FSK, GFSK, MSK, O-QPSK
-
ADC, GPIO, I²C, SPI, UART
1.71V ~ 3.6V
6.2mA
-40°C ~ 105°C (TA)
64-VFLGA
64-VFLGA (7x7)
-
-
-
MKW21D256VHA5R
IC RF TXRX+MCU 802.15.4 63VFLGA
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
8dBm
19mA
256kB Flash, 32kB SRAM
-102dBm
2.4GHz
TxRx + MCU
802.15.4
Zigbee®
DSSS, O-QPSK
250kbps
I²C, JTAG, SPI, UART
1.8V ~ 3.6V
15mA
-40°C ~ 105°C
63-VFLGA
63-MAPLGA (8x8)
-
2
-

About  RF Transceiver ICs

RF Transceiver ICs, or Radio Frequency Transceiver Integrated Circuits, are semiconductor devices that combine both a transmitter and a receiver within a single package. These ICs are specifically designed to efficiently operate within various RF families or standards, including AISG, Bluetooth, ISM, VHF, Wi-Fi, cellular networks, RADAR systems, 802.15.4 (Zigbee), and Z-Wave. The primary purpose of RF Transceiver ICs is to enable wireless communication by transmitting and receiving RF signals. By integrating both transmitter and receiver functions into a single chip, these ICs offer a compact and cost-effective solution for wireless communication applications. RF Transceiver ICs are further categorized based on the type of modulation used and the specific protocol versions they support. Modulation refers to the process of encoding information onto an RF carrier signal. Common modulation schemes include amplitude modulation (AM), frequency modulation (FM), and phase modulation (PM). The specific protocol versions indicate compatibility with different communication protocols and standards within each RF family. Some RF Transceiver ICs also incorporate a built-in microcontroller, which adds additional functionality and control capabilities. The integrated microcontroller allows for more advanced features, such as protocol handling, data processing, error correction, and system management. This integration simplifies the overall system design and reduces the need for external components. RF Transceiver ICs play a vital role in various wireless communication applications, enabling devices to transmit and receive data wirelessly over different RF frequencies and protocols. They are widely used in applications such as wireless connectivity, IoT (Internet of Things) devices, remote control systems, wireless sensor networks, and many other wireless communication systems. In summary, RF Transceiver ICs are semiconductor devices that integrate both transmitter and receiver functions into a single chip. They enable wireless communication within specific RF families or standards and are categorized based on modulation type and protocol versions. With the inclusion of a built-in microcontroller, these ICs offer enhanced functionality and control capabilities, making them essential components in wireless communication systems.