SLLIMM™ Series, Power Driver Modules

Results:
86
Manufacturer
Series
Current
Package / Case
Voltage - Isolation
Configuration
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Results remaining86
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SLLIMM™
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeVoltage - IsolationCurrentGradeVoltageSeriesTypeConfigurationPackage / CaseQualification
STGIB15CH60TS-LZ
SLLIMM 2ND SERIES IPM, 3-PHASE I
1+
$8.8732
5+
$8.3803
10+
$7.8873
Quantity
53,100 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1500Vrms
20 A
-
600 V
SLLIMM™
IGBT
3 Phase Inverter
26-PowerDIP Module (1.146", 29.10mm)
-
STGIPS10K60A
MOD IPM 600V 10A 25-SDIP
1+
$8.1127
5+
$7.6620
10+
$7.2113
Quantity
16,962 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
2500VDC
10 A
-
600 V
SLLIMM™
IGBT
3 Phase
25-PowerDIP Module (0.993", 25.23mm)
-
STGIB20M60TS-L
SLLIMM 2ND SERIES IPM, 3-PHASE I
1+
$15.2113
5+
$14.3662
10+
$13.5211
Quantity
13,020 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1500Vrms
25 A
-
600 V
SLLIMM™
IGBT
3 Phase Inverter
26-PowerDIP Module (1.146", 29.10mm)
-
STGIPS20K60
IGBT IPM MODULE 17A 600V 25SDIP
1+
$10.1408
5+
$9.5775
10+
$9.0141
Quantity
12,560 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
2500VDC
17 A
-
600 V
SLLIMM™
IGBT
3 Phase
25-PowerDIP Module (0.993", 25.23mm)
-
STGIB10CH60TS-L
SLLIMM(TM) - 2ND SERIES IPM, 3-P
1+
$7.6056
5+
$7.1831
10+
$6.7606
Quantity
12,496 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1500Vrms
15 A
-
600 V
SLLIMM™
IGBT
3 Phase Inverter
26-PowerDIP Module (1.134", 28.80mm)
-
STGIB15CH60TS-L
SLLIMM(TM) - 2ND SERIES IPM, 3-P
1+
$10.1408
5+
$9.5775
10+
$9.0141
Quantity
11,622 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1500Vrms
20 A
-
600 V
SLLIMM™
IGBT
3 Phase Inverter
26-PowerDIP Module (1.134", 28.80mm)
-
STGIF7CH60TS-L
SLLIMM 2ND SERIES IPM, 3-PHASE I
1+
$10.6479
5+
$10.0563
10+
$9.4648
Quantity
8,432 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1500Vrms
10 A
-
600 V
SLLIMM™
IGBT
3 Phase
26-PowerDIP Module (1.134", 28.80mm)
-
STGIPL14K60
IGBT IPM MODULE 14A 600V 38SDIP
1+
$47.9155
5+
$45.2535
10+
$42.5915
Quantity
7,885 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
2500VDC
14 A
-
600 V
SLLIMM™
IGBT
3 Phase
38-PowerDIP Module (1.146", 29.10mm)
-
STGIPS14K60
IGBT IPM MODULE 12A 600V 25SDIP
1+
$55.7746
5+
$52.6761
10+
$49.5775
Quantity
7,464 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
2500VDC
12 A
-
600 V
SLLIMM™
IGBT
3 Phase
25-PowerDIP Module (0.993", 25.23mm)
-
STGIPS10K60T
MOD IPM 600V 10A 25-SDIP
1+
$76.0563
5+
$71.8310
10+
$67.6056
Quantity
5,369 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
10 A
-
600 V
SLLIMM™
IGBT
3 Phase
25-PowerDIP Module (0.993", 25.23mm)
-
STGIPN3H60A
IGBT IPM MODULE 3A 600V NDIP-26L
1+
$6.3380
5+
$5.9859
10+
$5.6338
Quantity
5,078 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1000VDC
3 A
-
600 V
SLLIMM™
IGBT
3 Phase
26-PowerDIP Module (0.846", 21.48mm)
-
STGIB30M60TS-L
SLLIMM(TM) - 2ND SERIES IPM, 3-P
1+
$29.1549
5+
$27.5352
10+
$25.9155
Quantity
3,312 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1500Vrms
35 A
-
600 V
SLLIMM™
IGBT
3 Phase Inverter
26-PowerDIP Module (1.146", 29.10mm)
-
STGIPS14K60T
MOD IPM 600V 14A 25-SDIP
1+
$50.7042
5+
$47.8873
10+
$45.0704
Quantity
1,607 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
14 A
-
600 V
SLLIMM™
IGBT
3 Phase
25-PowerDIP Module (0.993", 25.23mm)
-
STIPN1M50-H
SLLIMM-NANO SMALL LOW-LOSS INTEL
1+
$7.6056
5+
$7.1831
10+
$6.7606
Quantity
1,441 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1000Vrms
1 A
-
500 V
SLLIMM™
MOSFET
3 Phase Inverter
26-PowerDIP Module (0.846", 21.48mm)
-
STGIB10CH60TS-LZ
SLLIMM 2ND SERIES IPM, 3-PHASE I
1+
$7.8592
5+
$7.4225
10+
$6.9859
Quantity
936 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1500Vrms
15 A
-
600 V
SLLIMM™
IGBT
3 Phase Inverter
26-PowerDIP Module (1.146", 29.10mm)
-
STGIPS10K60T-H
MOD IGBT SLLIMM 10A 600V 25SDIP
1+
$91.2676
5+
$86.1972
10+
$81.1268
Quantity
627 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
10 A
-
600 V
SLLIMM™
IGBT
3 Phase
25-PowerDIP Module (0.993", 25.23mm)
-
STGIPN3H60AT
IGBT BIPO 600V 3A DIP
1+
$11.4085
5+
$10.7746
10+
$10.1408
Quantity
460 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1000Vrms
3 A
-
600 V
SLLIMM™
IGBT
3 Phase Inverter
26-PowerDIP Module (0.846", 21.48mm)
-
STIPNS2M50T-H
SLLIMM-NANO SMALL LOW-LOSS INTEL
1+
$88.7324
5+
$83.8028
10+
$78.8732
Quantity
361 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Surface Mount
1000Vrms
2 A
-
500 V
SLLIMM™
MOSFET
3 Phase Inverter
26-PowerSMD Module, Gull Wing
-
STGIPQ5C60T-HZS
PWR MODULE 600V 5A 26DIP
1+
$30.4225
5+
$28.7324
10+
$27.0423
Quantity
300 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1500Vrms
5 A
-
600 V
SLLIMM™
IGBT
3 Phase Inverter
26-PowerDIP Module (0.846", 21.48mm)
-
STGIPS30C60
IGBT IPM MODULE 30A 600V SDIP-25
1+
$38.2817
5+
$36.1549
10+
$34.0282
Quantity
232 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
2500VDC
30 A
-
600 V
SLLIMM™
IGBT
3 Phase
25-PowerDIP Module (0.993", 25.23mm)
-

About  Power Driver Modules

Power driver modules play a crucial role in power electronics systems by providing a physical enclosure for power components, typically insulated-gate bipolar transistors (IGBTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs). These modules are designed to accommodate power semiconductors in various configurations, such as half bridge or one-, two-, or three-phase setups. The power semiconductors, or dies, are securely attached to a substrate within the module using soldering or sintering techniques. The substrate not only ensures mechanical support but also establishes electrical and thermal connections between the power semiconductors and the external system. It also provides electrical insulation where necessary to prevent unwanted electrical interactions. Power driver modules offer several advantages over individual power components. They enable higher power density, allowing for more efficient use of limited space in electronic systems. Additionally, they enhance reliability by providing a compact and protected environment for the power semiconductors, shielding them from environmental factors that could affect their performance. Another benefit of power modules is their improved cooling capability. The design of these modules often includes provisions for efficient heat dissipation, such as integrated heat sinks or thermal conductive materials. This helps to mitigate thermal issues associated with high-power operations, ensuring optimal performance and longevity of the power electronics system. In summary, power driver modules serve as physical enclosures for power components, facilitating the integration of IGBTs and MOSFETs in various configurations. These modules offer higher power density, improved reliability, and enhanced cooling capabilities compared to individual power components. By providing electrical and thermal connectivity while ensuring insulation, power modules contribute to the efficient and reliable operation of power electronics systems.