PFC SPM® 3 Series, Power Driver Modules

Results:
11
Manufacturer
Series
Current
Configuration
Type
Qualification
Package / Case
Voltage
Voltage - Isolation
Grade
Mounting Type
Results remaining11
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PFC SPM® 3
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeCurrentGradeVoltage - IsolationVoltageSeriesTypeConfigurationPackage / CaseQualification
FPDB40PH60B
MODULE SPM 600V 40A SPMGC
1+
$58.3099
5+
$55.0704
10+
$51.8310
Quantity
6,580 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
40 A
-
2500Vrms
600 V
PFC SPM® 3
IGBT
2 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FPDB60PH60B
MODULE SPM 600V 60A SPMHC
1+
$152.1127
5+
$143.6620
10+
$135.2113
Quantity
3,120 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
60 A
-
2500Vrms
600 V
PFC SPM® 3
IGBT
2 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FPAB30BH60B
MODULE SPM 600V 30A 27PWRDIP
1+
$38.0282
5+
$35.9155
10+
$33.8028
Quantity
200 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
30 A
-
2500Vrms
600 V
PFC SPM® 3
IGBT
1 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FPAB30BH60
AC MOTOR CONTROLLER, 30A, HYBRID
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
25 A
-
2500Vrms
600 V
PFC SPM® 3
IGBT
1 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FPDB30PH60
AC MOTOR CONTROLLER, HYBRID
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
-
2500Vrms
600 V
PFC SPM® 3
IGBT
2 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FPDB50PH60
AC MOTOR CONTROLLER, HYBRID
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
30 A
-
2500Vrms
600 V
PFC SPM® 3
IGBT
2 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FPDB30PH60
MODULE SPM 600V 20A SPMGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
-
2500Vrms
600 V
PFC SPM® 3
IGBT
2 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FPDB50PH60
MODULE SPM 600V 30A SPMHA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
30 A
-
2500Vrms
600 V
PFC SPM® 3
IGBT
2 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FPAB20BH60B-F166
MODULE SPM 600V 20A SPMIC
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
-
2500Vrms
600 V
PFC SPM® 3
IGBT
1 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FPAB30BH60
MODULE SPM FOR FRONT END SPM27-I
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
25 A
-
2500Vrms
600 V
PFC SPM® 3
IGBT
1 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FPAB20BH60B
MODULE SPM 600V 20A SPMIC
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
-
2500Vrms
600 V
PFC SPM® 3
IGBT
1 Phase
27-PowerDIP Module (1.205", 30.60mm)
-

About  Power Driver Modules

Power driver modules play a crucial role in power electronics systems by providing a physical enclosure for power components, typically insulated-gate bipolar transistors (IGBTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs). These modules are designed to accommodate power semiconductors in various configurations, such as half bridge or one-, two-, or three-phase setups. The power semiconductors, or dies, are securely attached to a substrate within the module using soldering or sintering techniques. The substrate not only ensures mechanical support but also establishes electrical and thermal connections between the power semiconductors and the external system. It also provides electrical insulation where necessary to prevent unwanted electrical interactions. Power driver modules offer several advantages over individual power components. They enable higher power density, allowing for more efficient use of limited space in electronic systems. Additionally, they enhance reliability by providing a compact and protected environment for the power semiconductors, shielding them from environmental factors that could affect their performance. Another benefit of power modules is their improved cooling capability. The design of these modules often includes provisions for efficient heat dissipation, such as integrated heat sinks or thermal conductive materials. This helps to mitigate thermal issues associated with high-power operations, ensuring optimal performance and longevity of the power electronics system. In summary, power driver modules serve as physical enclosures for power components, facilitating the integration of IGBTs and MOSFETs in various configurations. These modules offer higher power density, improved reliability, and enhanced cooling capabilities compared to individual power components. By providing electrical and thermal connectivity while ensuring insulation, power modules contribute to the efficient and reliable operation of power electronics systems.