Motion-SPM® Series, Power Driver Modules

Results:
20
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Results remaining20
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Motion-SPM®
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeVoltage - IsolationCurrentGradeVoltageTypeSeriesConfigurationPackage / CaseQualification
FSB50550AB
FET 3PH 500V 2A MODULE
1+
$6.3380
5+
$5.9859
10+
$5.6338
Quantity
15,197 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1500Vrms
2 A
-
500 V
MOSFET
Motion-SPM®
3 Phase
23-PowerDIP Module (0.644", 16.35mm)
-
FSB50825AB
FET 250V 3.6A 23PWRDIP MOD
1+
$7.6056
5+
$7.1831
10+
$6.7606
Quantity
720 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1500Vrms
3.6 A
-
250 V
MOSFET
Motion-SPM®
3 Phase
23-PowerDIP Module (0.644", 16.35mm)
-
FSB50825AB
AC MOTOR CONTROLLER, 9A, HYBRID
1+
$7.6056
5+
$7.1831
10+
$6.7606
Quantity
720 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
1500Vrms
3.6 A
-
250 V
MOSFET
Motion-SPM®
3 Phase
23-PowerDIP Module (0.644", 16.35mm)
-
FSBS10CH60
SMART POWER MODULE 10A SPM27-BA
1+
$15.2113
5+
$14.3662
10+
$13.5211
Quantity
9 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
10 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FSBF3CH60B
AC MOTOR CONTROLLER, 6A
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
3 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FSBF15CH60CT
MODULE SPM MOTION CTRL SPM27-JA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-
-
-
-
-
Motion-SPM®
-
27-PowerDIP Module (1.205", 30.60mm)
-
FNE41060
MODULE SPM 600V 10A 26PWRDIP
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-
-
-
-
-
Motion-SPM®
-
26-PowerDIP Module (1.024", 26.00mm)
-
FSBB30CH60B
AC MOTOR CONTROLLER, 60A, HYBRID
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
30 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FSBF15CH60CT
AC MOTOR CONTROLLER, 30A, HYBRID
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-
-
-
-
-
Motion-SPM®
-
27-PowerDIP Module (1.205", 30.60mm)
-
FSBB20CH60SL
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
20 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FSBF15CH60BTH
AC MOTOR CONTROLLER, 60A, HYBRID
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
15 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FSBS10CH60T
SMART POWER MODULE 27PIN SPM27-B
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
10 A
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBF15CH60BTL
MODULE SPM 600V 15A SPM27-JB
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
15 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FSBF3CH60B
MODULE SPM 600V 3A 3PH SPM27-JA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
3 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FSBB30CH60B
MODULE SPM 600V 30A 3PH SPM27-EC
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
30 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FSBB20CH60BT
MODULE SPM 600V 20A 3PH SPM27CC
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
20 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FSBB20CH60B
MODULE SPM 600V 20A 3PH SPM27CC
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
20 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FSBB15CH60BT
MODULE SPM 600V 15A 3PH SPM27CC
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
15 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FSBB15CH60B
MODULE SPM 600V 15A 3PH SPM27CC
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
2500Vrms
15 A
-
600 V
IGBT
Motion-SPM®
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
-
FNE41060
AC MOTOR CONTROLLER, 15A, HYBRID
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
-
-
-
-
-
Motion-SPM®
-
26-PowerDIP Module (1.024", 26.00mm)
-

Power Driver Modules

Power driver modules play a crucial role in power electronics systems by providing a physical enclosure for power components, typically insulated-gate bipolar transistors (IGBTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs). These modules are designed to accommodate power semiconductors in various configurations, such as half bridge or one-, two-, or three-phase setups. The power semiconductors, or dies, are securely attached to a substrate within the module using soldering or sintering techniques. The substrate not only ensures mechanical support but also establishes electrical and thermal connections between the power semiconductors and the external system. It also provides electrical insulation where necessary to prevent unwanted electrical interactions. Power driver modules offer several advantages over individual power components. They enable higher power density, allowing for more efficient use of limited space in electronic systems. Additionally, they enhance reliability by providing a compact and protected environment for the power semiconductors, shielding them from environmental factors that could affect their performance. Another benefit of power modules is their improved cooling capability. The design of these modules often includes provisions for efficient heat dissipation, such as integrated heat sinks or thermal conductive materials. This helps to mitigate thermal issues associated with high-power operations, ensuring optimal performance and longevity of the power electronics system. In summary, power driver modules serve as physical enclosures for power components, facilitating the integration of IGBTs and MOSFETs in various configurations. These modules offer higher power density, improved reliability, and enhanced cooling capabilities compared to individual power components. By providing electrical and thermal connectivity while ensuring insulation, power modules contribute to the efficient and reliable operation of power electronics systems.