Motion SPM® 3 Series, Power Driver Modules

Results:
47
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Results remaining47
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Motion SPM® 3
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeCurrentVoltage - IsolationVoltageSeriesTypeConfigurationPackage / Case
FSBB20CH60F
AC MOTOR CONTROLLER, 40A, HYBRID
1+
$15.7183
5+
$14.8451
10+
$13.9718
Quantity
341 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBS3CH60L
MODULE SPM 600V 3A SPM27-BB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
3 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FNB35060T
PWR DRVR MOD 600V 50A 27PWRDIP
1+
$36.0000
5+
$34.0000
10+
$32.0000
Quantity
12,016 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
50 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase Inverter
27-PowerDIP Module (1.205", 30.60mm)
FSBB15CH60D
MODULE SPM 600KV 15A 27PWRDIP
1+
$15.7183
5+
$14.8451
10+
$13.9718
Quantity
9,325 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
15 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase Inverter
27-PowerDIP Module (1.205", 30.60mm)
FSBS5CH60
SMART POWER MODULE 5A SPM27-BA
1+
$10.1408
5+
$9.5775
10+
$9.0141
Quantity
7,490 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
5 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBS5CH60
AC MOTOR CONTROLLER, 5A, HYBRID
1+
$10.1408
5+
$9.5775
10+
$9.0141
Quantity
7,490 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
5 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBB30CH60C
MODULE SPM 600KV 30A 27PWRDIP
1+
$21.5493
5+
$20.3521
10+
$19.1549
Quantity
5,600 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
30 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBB10CH120D
MODULE SPM 1.2V 10A 27PWRDIP
1+
$30.4225
5+
$28.7324
10+
$27.0423
Quantity
3,784 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
10 A
2500Vrms
1.2 kV
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBB30CH60
SMART POWER MODULE 30A SPM27-EA
1+
$20.2817
5+
$19.1549
10+
$18.0282
Quantity
3,655 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
30 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBF10CH60BT
MODULE SPM 600V 10A 3PH SPM27-JA
1+
$16.4789
5+
$15.5634
10+
$14.6479
Quantity
3,120 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
10 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBB15CH60C
MODULE SPM 600V 15A 27PWRDIP
1+
$20.2817
5+
$19.1549
10+
$18.0282
Quantity
2,892 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
15 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBB15CH60F
MODULE SPM 600V SPM27-CA
1+
$10.1408
5+
$9.5775
10+
$9.0141
Quantity
2,190 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
15 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBB15CH60F
AC MOTOR CONTROLLER, 15A, HYBRID
1+
$10.1408
5+
$9.5775
10+
$9.0141
Quantity
2,190 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
15 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBB10CH120DF
MODULE SPM 1.2KV 10A SPMMC
1+
$55.7746
5+
$52.6761
10+
$49.5775
Quantity
1,762 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
10 A
2500Vrms
1.2 kV
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBB20CH60D
MODULE SPM 600V 20A SPMCC
1+
$22.9437
5+
$21.6690
10+
$20.3944
Quantity
1,200 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase Inverter
27-PowerDIP Module (1.205", 30.60mm)
FSBB30CH60DF
MODULE SPM 600V 30A SPMPA
1+
$59.5775
5+
$56.2676
10+
$52.9577
Quantity
1,200 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
30 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase Inverter
27-PowerDIP Module (1.205", 30.60mm)
FSBB15CH60
SMART POWER MODULE 15A SPM27-CA
1+
$45.6338
5+
$43.0986
10+
$40.5634
Quantity
900 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
15 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBB15CH60
AC MOTOR CONTROLLER, 30A, HYBRID
1+
$45.6338
5+
$43.0986
10+
$40.5634
Quantity
900 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
15 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBB20CH60
SMART POWER MODULE 20A SPM27-CA
1+
$20.2817
5+
$19.1549
10+
$18.0282
Quantity
670 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)
FSBB20CH60C
MODULE SPM 600V 20A 27PWRDIP
1+
$17.7465
5+
$16.7606
10+
$15.7746
Quantity
440 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
2500Vrms
600 V
Motion SPM® 3
IGBT
3 Phase
27-PowerDIP Module (1.205", 30.60mm)

About  Power Driver Modules

Power driver modules play a crucial role in power electronics systems by providing a physical enclosure for power components, typically insulated-gate bipolar transistors (IGBTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs). These modules are designed to accommodate power semiconductors in various configurations, such as half bridge or one-, two-, or three-phase setups. The power semiconductors, or dies, are securely attached to a substrate within the module using soldering or sintering techniques. The substrate not only ensures mechanical support but also establishes electrical and thermal connections between the power semiconductors and the external system. It also provides electrical insulation where necessary to prevent unwanted electrical interactions. Power driver modules offer several advantages over individual power components. They enable higher power density, allowing for more efficient use of limited space in electronic systems. Additionally, they enhance reliability by providing a compact and protected environment for the power semiconductors, shielding them from environmental factors that could affect their performance. Another benefit of power modules is their improved cooling capability. The design of these modules often includes provisions for efficient heat dissipation, such as integrated heat sinks or thermal conductive materials. This helps to mitigate thermal issues associated with high-power operations, ensuring optimal performance and longevity of the power electronics system. In summary, power driver modules serve as physical enclosures for power components, facilitating the integration of IGBTs and MOSFETs in various configurations. These modules offer higher power density, improved reliability, and enhanced cooling capabilities compared to individual power components. By providing electrical and thermal connectivity while ensuring insulation, power modules contribute to the efficient and reliable operation of power electronics systems.