Motion SPM® 2 Series, Power Driver Modules

Results:
20
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Results remaining20
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Motion SPM® 2
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ImageProduct DetailPriceAvailabilityECAD ModelMounting TypeCurrentVoltage - IsolationVoltageSeriesTypeConfigurationPackage / Case
FSAM20SH60A
AC MOTOR CONTROLLER, 40A, HYBRID
1+
$291.5493
5+
$275.3521
10+
$259.1549
Quantity
6 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FNA23512A
MODULE SPM 1.2V 35A 34PWRDIP
1+
$109.0141
5+
$102.9577
10+
$96.9014
Quantity
1,984 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
35 A
2500Vrms
1.2 kV
Motion SPM® 2
IGBT
3 Phase
34-PowerDIP Module (1.480", 37.60mm)
FNA25012A
IPM SPM34 1200V 50A
1+
$177.4648
5+
$167.6056
10+
$157.7465
Quantity
359 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
50 A
2500Vrms
1.2 kV
Motion SPM® 2
IGBT
3 Phase Inverter
34-PowerDIP Module (1.480", 37.60mm)
FNA25060
MOD SPM 600V 50A SPMCA-A34
1+
$81.1268
5+
$76.6197
10+
$72.1127
Quantity
54 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
50 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
34-PowerDIP Module (1.480", 37.60mm)
FSAM30SH60A
SMART POWER MODULE 30A SPM32-AA
1+
$15.2113
5+
$14.3662
10+
$13.5211
Quantity
43 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
30 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FNA22512A
MODULE SPM 1.2KV 25A 34PWRDIP
1+
$139.4366
5+
$131.6901
10+
$123.9437
Quantity
19 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
25 A
2500Vrms
1.2 kV
Motion SPM® 2
IGBT
3 Phase
34-PowerDIP Module (1.480", 37.60mm)
FSAM10SH60A
SMART POWER MODULE 10A SPM32-AA
1+
$63.3803
5+
$59.8592
10+
$56.3380
Quantity
8 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
10 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FSAM20SH60A
SMART POWER MODULE 20A SPM32-AA
1+
$291.5493
5+
$275.3521
10+
$259.1549
Quantity
6 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FNA23060
MODULE SPM 600V 30A 34PWRDIP
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
30 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase Inverter
34-PowerDIP Module (1.480", 37.60mm)
FSAM15SH60A
SMART POWER MODULE 15A SPM32-AA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
15 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FSAM15SM60A
SMART POWER MODULE 15A SPM32AA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
15 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FSAM20SM60A
SMART POWER MODULE 20A SPM32-AA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FSAM30SM60A
SMART POWER MODULE 30A SPM32-AA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
30 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FSAM30SM60A
AC MOTOR CONTROLLER, 60A, HYBRID
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
30 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FSAM75SM60A
MODULE SPM 600V 75A S32DA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
75 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FSAM15SM60A
AC MOTOR CONTROLLER, 30A, HYBRID
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
15 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FSAM15SH60A
AC MOTOR CONTROLLER, 30A, HYBRID
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
15 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FSAM20SM60A
AC MOTOR CONTROLLER, 40A, HYBRID
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
20 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
32-PowerDIP Module (1.370", 34.80mm)
FNA27560
MODULE SPM 600V 75A 34PWRDIP
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
75 A
2500Vrms
600 V
Motion SPM® 2
IGBT
3 Phase
34-PowerDIP Module (1.480", 37.60mm)
FNA21012A
MODULE SPM 1.2V 10A 34PWRDIP
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Through Hole
10 A
2500Vrms
1.2 kV
Motion SPM® 2
IGBT
3 Phase
34-PowerDIP Module (1.480", 37.60mm)

About  Power Driver Modules

Power driver modules play a crucial role in power electronics systems by providing a physical enclosure for power components, typically insulated-gate bipolar transistors (IGBTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs). These modules are designed to accommodate power semiconductors in various configurations, such as half bridge or one-, two-, or three-phase setups. The power semiconductors, or dies, are securely attached to a substrate within the module using soldering or sintering techniques. The substrate not only ensures mechanical support but also establishes electrical and thermal connections between the power semiconductors and the external system. It also provides electrical insulation where necessary to prevent unwanted electrical interactions. Power driver modules offer several advantages over individual power components. They enable higher power density, allowing for more efficient use of limited space in electronic systems. Additionally, they enhance reliability by providing a compact and protected environment for the power semiconductors, shielding them from environmental factors that could affect their performance. Another benefit of power modules is their improved cooling capability. The design of these modules often includes provisions for efficient heat dissipation, such as integrated heat sinks or thermal conductive materials. This helps to mitigate thermal issues associated with high-power operations, ensuring optimal performance and longevity of the power electronics system. In summary, power driver modules serve as physical enclosures for power components, facilitating the integration of IGBTs and MOSFETs in various configurations. These modules offer higher power density, improved reliability, and enhanced cooling capabilities compared to individual power components. By providing electrical and thermal connectivity while ensuring insulation, power modules contribute to the efficient and reliable operation of power electronics systems.