CameraChip™, OmniBSI+™ Series, Image Sensors, Camera

Results:
11
Manufacturer
Series
Active Pixel Array
Operating Temperature
Frames per Second
Type
Package / Case
Voltage - Supply
Pixel Size
Supplier Device Package
Qualification
Grade
Results remaining11
Applied Filters:
CameraChip™, OmniBSI+™
Select
ImageProduct DetailPriceAvailabilityECAD ModelFrames per SecondTypePackage / CaseSupplier Device PackageVoltage - SupplyGradePixel SizeActive Pixel ArrayOperating TemperatureQualificationSeries
OV07695-A17A
IC IMAGE SENSOR VGA 17-CSP3
1+
$2.5352
5+
$2.3944
10+
$2.2535
Quantity
526 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
30
CMOS
Module
Module
2.8V
-
1.75µm x 1.75µm
656H x 496V
-30°C ~ 70°C (TJ)
-
CameraChip™, OmniBSI+™
OV06946-A04A
1+
$57.0423
5+
$53.8732
10+
$50.7042
Quantity
50 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
30
CMOS
BGA - Module
Module
3.3V
-
1.75µm x 1.75µm
400H x 400V
-20°C ~ 70°C (TJ)
-
CameraChip™, OmniBSI+™
OV05648-G04A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
15
CMOS with Processor
Module
Module
2.8V
-
1.4µm x 1.4µm
2592H x 1944V
-30°C ~ 70°C (TJ)
-
CameraChip™, OmniBSI+™
OV05656-A66A
IC IMAGE SENSOR 5MP 56-CSP3
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
Module
Module
2.8V
-
1.75µm x 1.75µm
2592H x 1944V
-
-
CameraChip™, OmniBSI+™
OV05658-A66A
IC IMAGE SENSOR 5MP 56-CSP3
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
Module
Module
2.8V
-
1.75µm x 1.75µm
2592H x 1944V
-30°C ~ 70°C (TJ)
-
CameraChip™, OmniBSI+™
OV05648-A53A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
16
CMOS with Processor
BGA - Module
Module
2.8V
-
1.4µm x 1.4µm
2592H x 1944V
-30°C ~ 70°C (TJ)
-
CameraChip™, OmniBSI+™
OVM9724-EAAR-AA0A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
Module
-
2.8V
-
1.4µm x 1.4µm
1280H x 720V
-30°C ~ 70°C (TJ)
-
CameraChip™, OmniBSI+™
OV02722-A50A
IC IMAGE SENSOR 1080P 50-CSP3
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
Module
Module
2.8V
-
1.4µm x 1.4µm
1932H x 1092V
-20°C ~ 70°C (TJ)
-
CameraChip™, OmniBSI+™
OV02722-G04A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
Module
Module
2.8V
-
1.4µm x 1.4µm
1932H x 1092V
-20°C ~ 70°C (TJ)
-
CameraChip™, OmniBSI+™
OV05656-G04A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
Module
Module
2.8V
-
1.75µm x 1.75µm
2592H x 1944V
-
-
CameraChip™, OmniBSI+™
OVM9724-EAAR-AA01
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
Module
-
2.8V
-
1.4µm x 1.4µm
1280H x 720V
-30°C ~ 70°C (TJ)
-
CameraChip™, OmniBSI+™

About  Image Sensors, Camera

The products in the image sensor and camera family encompass component or module-level devices that are employed for electronically capturing visual information in the visible and/or infrared spectrums. These devices typically comprise an array of photosensitive elements that are linked to a shared control and interface mechanism. The range of available products includes those tailored for common still image and video capture, as well as more specialized applications such as thermal and spatial imaging. Image sensors are fundamental components within this family of products, serving as the primary means of converting light into electronic signals. These sensors can be categorized based on their technology, including CCD (Charge-Coupled Device) and CMOS (Complementary Metal-Oxide-Semiconductor) sensors, each with its own distinct advantages and characteristics. Camera modules, on the other hand, are pre-assembled units that integrate essential components such as the image sensor, lens, and supporting electronics. These modules are designed to be easily incorporated into various devices and applications, offering features such as color filtering, resolution, shutter type, frames per second (FPS), and lens mount options to cater to diverse requirements. Furthermore, specialized imaging products cater to specific applications, such as thermal imaging sensors that capture infrared radiation to create thermal images, and spatial imaging sensors used for depth perception and 3D mapping. The versatility of these products makes them suitable for integration into a wide array of devices and systems, including smartphones, digital cameras, security cameras, automotive imaging systems, and industrial imaging equipment. They enable functions such as photography, video recording, thermal imaging, depth sensing, and various forms of visual data capture and analysis. In summary, the products in the image sensor and camera family encompass a range of component or module-level devices used for capturing visual information in the visible and/or infrared spectrums. These products include image sensors, camera modules, and specialized imaging devices, catering to diverse applications such as still image and video capture, thermal imaging, and spatial imaging. They find widespread use in consumer electronics, security systems, automotive applications, and industrial imaging, enabling a variety of visual data capture and analysis capabilities.