CameraChip™, OmniBSI-2™ Series, Image Sensors, Camera

Results:
12
Manufacturer
Series
Voltage - Supply
Package / Case
Pixel Size
Active Pixel Array
Operating Temperature
Frames per Second
Supplier Device Package
Type
Qualification
Grade
Results remaining12
Applied Filters:
CameraChip™, OmniBSI-2™
Select
ImageProduct DetailPriceAvailabilityECAD ModelFrames per SecondPixel SizePackage / CaseSupplier Device PackageVoltage - SupplyGradeOperating TemperatureTypeQualificationSeriesActive Pixel Array
OV04688-G04A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
2µm x 2µm
Module
Module
2.8V
-
-30°C ~ 85°C (TJ)
CMOS with Processor
-
CameraChip™, OmniBSI-2™
2688H x 1520V
OV04686-H67A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
2µm x 2µm
Module
-
2.6V ~ 3V
-
-30°C ~ 85°C
CMOS
-
CameraChip™, OmniBSI-2™
2688H x 1520V
OV02724-G04A
IC IMAGE SENSOR 1080P RW
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
60
1.34µm x 1.34µm
Module
Module
2.8V
-
-30°C ~ 85°C (TJ)
CMOS with Processor
-
CameraChip™, OmniBSI-2™
1952H x 1096V
OV05680-G04A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
1.75µm x 1.75µm
Module
Module
2.8V
-
-30°C ~ 70°C (TJ)
CMOS with Processor
-
CameraChip™, OmniBSI-2™
2592H x 1944V
OV05680-G04A-2A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
1.75µm x 1.75µm
Module
Module
2.8V
-
-30°C ~ 70°C (TJ)
CMOS with Processor
-
CameraChip™, OmniBSI-2™
2592H x 1944V
OV04682-G04A
IC SENSOR 4MP 1/3" RW WAFER
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
2µm x 2µm
BGA - Module
Module
2.8V
-
-30°C ~ 85°C (TJ)
CMOS with Processor
-
CameraChip™, OmniBSI-2™
2688H x 1520V
OV04685-H67A
IC SENSOR 4MP 1/3" SEC 67CSP5
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
2µm x 2µm
Die
Die
2.8V
-
-30°C ~ 85°C (TJ)
CMOS with Processor
-
CameraChip™, OmniBSI-2™
2688H x 1520V
OV02718-H77A-2A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
2.8µm x 2.8µm
Module
-
1.7V ~ 3.47V
-
-30°C ~ 85°C
CMOS
-
CameraChip™, OmniBSI-2™
1920H x 1080V
OV02718-H77A-PA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
2.8µm x 2.8µm
Module
-
1.7V ~ 3.47V
-
-30°C ~ 85°C
CMOS
-
CameraChip™, OmniBSI-2™
1920H x 1080V
OV02718-H77T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
2.8µm x 2.8µm
Module
Module
1.7V ~ 3.47V
-
-30°C ~ 85°C
CMOS
-
CameraChip™, OmniBSI-2™
1920H x 1080V
OV02718-H77T-2A
HD CAMERA CHIP SENSOR 77-CSP5
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
2.8µm x 2.8µm
Module
-
1.7V ~ 1.9V
-
-30°C ~ 85°C (TJ)
CMOS with Processor
-
CameraChip™, OmniBSI-2™
1920H x 1080V
OV04689-H67A-2A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
2µm x 2µm
-
-
1.1V ~ 1.3V
-
-30°C ~ 85°C (TJ)
CMOS with Processor
-
CameraChip™, OmniBSI-2™
2688H x 1520V

About  Image Sensors, Camera

The products in the image sensor and camera family encompass component or module-level devices that are employed for electronically capturing visual information in the visible and/or infrared spectrums. These devices typically comprise an array of photosensitive elements that are linked to a shared control and interface mechanism. The range of available products includes those tailored for common still image and video capture, as well as more specialized applications such as thermal and spatial imaging. Image sensors are fundamental components within this family of products, serving as the primary means of converting light into electronic signals. These sensors can be categorized based on their technology, including CCD (Charge-Coupled Device) and CMOS (Complementary Metal-Oxide-Semiconductor) sensors, each with its own distinct advantages and characteristics. Camera modules, on the other hand, are pre-assembled units that integrate essential components such as the image sensor, lens, and supporting electronics. These modules are designed to be easily incorporated into various devices and applications, offering features such as color filtering, resolution, shutter type, frames per second (FPS), and lens mount options to cater to diverse requirements. Furthermore, specialized imaging products cater to specific applications, such as thermal imaging sensors that capture infrared radiation to create thermal images, and spatial imaging sensors used for depth perception and 3D mapping. The versatility of these products makes them suitable for integration into a wide array of devices and systems, including smartphones, digital cameras, security cameras, automotive imaging systems, and industrial imaging equipment. They enable functions such as photography, video recording, thermal imaging, depth sensing, and various forms of visual data capture and analysis. In summary, the products in the image sensor and camera family encompass a range of component or module-level devices used for capturing visual information in the visible and/or infrared spectrums. These products include image sensors, camera modules, and specialized imaging devices, catering to diverse applications such as still image and video capture, thermal imaging, and spatial imaging. They find widespread use in consumer electronics, security systems, automotive applications, and industrial imaging, enabling a variety of visual data capture and analysis capabilities.