CameraChip™ Series, Image Sensors, Camera

Results:
17
Manufacturer
Series
Voltage - Supply
Package / Case
Supplier Device Package
Operating Temperature
Frames per Second
Active Pixel Array
Pixel Size
Type
Qualification
Grade
Results remaining17
Applied Filters:
CameraChip™
Select
ImageProduct DetailPriceAvailabilityECAD ModelFrames per SecondTypePackage / CaseSupplier Device PackageOperating TemperatureGradePixel SizeVoltage - SupplyQualificationSeriesActive Pixel Array
OV02685-H53A
1+
$12.6761
5+
$11.9718
10+
$11.2676
Quantity
616 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
30
CMOS
Module
-
-30°C ~ 85°C
-
1.75µm x 1.75µm
-
-
CameraChip™
1616H x 1216V
OV07251-A35A-1F
IC SENSOR VGA 1/7.5" B&W 35CSP3
1+
$3.0423
5+
$2.8732
10+
$2.7042
Quantity
119 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
100
CMOS
35-VFBGA, CSPBGA
35-CSP3 (3.91x3.41)
-30°C ~ 70°C
-
3µm x 3µm
2.8V
-
CameraChip™
640H x 480V
OV02680-GA5A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
Die
Wafer
-30°C ~ 85°C (TJ)
-
1.75µm x 1.75µm
1.5326V ~ 1.6274V
-
CameraChip™
1616H x 1216V
OV9732-H35A
CAMERA CHIP SENSOR 720P 35CSP
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
35-BGA, CSPBGA
35-CSP (4.7x2.99)
-30°C ~ 70°C (TJ)
-
3µm x 3µm
1.7V ~ 1.9V
-
CameraChip™
1280H x 720V
OV02718-H77A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
77-BGA, CSPBGA
77-CSP (6.54x5.73)
-30°C ~ 85°C (TJ)
-
2.8µm x 2.8µm
1.7V ~ 1.9V
-
CameraChip™
1920H x 1080V
OV02680-H47H
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
47-BGA, CSPBGA
47-CSP5 (4.18x3.48)
-30°C ~ 85°C (TJ)
-
1.75µm x 1.75µm
1.5326V ~ 1.6274V
-
CameraChip™
1616H x 1216V
OV02718-H77A-1C
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
77-BGA, CSPBGA
77-CSP (6.54x5.73)
-30°C ~ 85°C (TJ)
-
2.8µm x 2.8µm
1.7V ~ 1.9V
-
CameraChip™
1920H x 1080V
OV07725-V28T
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
60
CMOS with Processor
Module
-
-20°C ~ 70°C (TA)
-
6µm x 6µm
1.62V ~ 1.98V
-
CameraChip™
640H x 480V
OV02686-H38A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
15
CMOS
Module
-
-30°C ~ 85°C
-
1.75µm x 1.75µm
1.8V, 2.8V
-
CameraChip™
1616H x 1216V
OV02680-H47A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS
Module
-
-30°C ~ 85°C
-
1.75µm x 1.75µm
1.5V ~ 3.1V
-
CameraChip™
1616H x 1216V
OV07251-EAAA-AA0A
LOW POWER CAMERACHIP SENSOR
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
100
CMOS
Module
Module
-
-
3µm x 3µm
2.8V
-
CameraChip™
640H x 480V
OV09760-G04A
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
Module
Module
-
-
6µm x 6µm
2.8V
-
CameraChip™
768H x 576V
OV07725-V28A
IC IMAGE SENSOR VGA 28-CSP2
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
60
CMOS
Module
Module
-20°C ~ 70°C (TA)
-
6µm x 6µm
3.3V
-
CameraChip™
640H x 480V
OV02718-H77A-2B
HD CAMERACHIP SENSOR 1080P 77CSP
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
30
CMOS with Processor
77-BGA, CSPBGA
77-CSP (6.54x5.73)
-30°C ~ 85°C (TJ)
-
2.8µm x 2.8µm
1.7V ~ 1.9V
-
CameraChip™
1920H x 1080V
OV07251-A35A-1G
IC SENSOR VGA 1/7.5" B&W 35CSP3
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
100
CMOS
BGA - Module
Module
-
-
3µm x 3µm
2.8V
-
CameraChip™
640H x 480V
OV07251-G04A-1F
IC SENSOR VGA 1/7.5" BW WAFER
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
100
CMOS
Module
Module
-
-
3µm x 3µm
2.8V
-
CameraChip™
640H x 480V
OV07251-G04A-1G
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
120
CMOS
Module
-
-30°C ~ 70°C
-
3µm x 3µm
1.8V, 2.8V
-
CameraChip™
640H x 480V

About  Image Sensors, Camera

The products in the image sensor and camera family encompass component or module-level devices that are employed for electronically capturing visual information in the visible and/or infrared spectrums. These devices typically comprise an array of photosensitive elements that are linked to a shared control and interface mechanism. The range of available products includes those tailored for common still image and video capture, as well as more specialized applications such as thermal and spatial imaging. Image sensors are fundamental components within this family of products, serving as the primary means of converting light into electronic signals. These sensors can be categorized based on their technology, including CCD (Charge-Coupled Device) and CMOS (Complementary Metal-Oxide-Semiconductor) sensors, each with its own distinct advantages and characteristics. Camera modules, on the other hand, are pre-assembled units that integrate essential components such as the image sensor, lens, and supporting electronics. These modules are designed to be easily incorporated into various devices and applications, offering features such as color filtering, resolution, shutter type, frames per second (FPS), and lens mount options to cater to diverse requirements. Furthermore, specialized imaging products cater to specific applications, such as thermal imaging sensors that capture infrared radiation to create thermal images, and spatial imaging sensors used for depth perception and 3D mapping. The versatility of these products makes them suitable for integration into a wide array of devices and systems, including smartphones, digital cameras, security cameras, automotive imaging systems, and industrial imaging equipment. They enable functions such as photography, video recording, thermal imaging, depth sensing, and various forms of visual data capture and analysis. In summary, the products in the image sensor and camera family encompass a range of component or module-level devices used for capturing visual information in the visible and/or infrared spectrums. These products include image sensors, camera modules, and specialized imaging devices, catering to diverse applications such as still image and video capture, thermal imaging, and spatial imaging. They find widespread use in consumer electronics, security systems, automotive applications, and industrial imaging, enabling a variety of visual data capture and analysis capabilities.