Mosaic Core Series, Image Sensors, Camera

Results:
16
Manufacturer
Series
Frames per Second
Active Pixel Array
Operating Temperature
Type
Qualification
Package / Case
Voltage - Supply
Pixel Size
Grade
Supplier Device Package
Results remaining16
Applied Filters:
Mosaic Core
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ImageProduct DetailPriceAvailabilityECAD ModelTypePixel SizePackage / CaseSupplier Device PackageOperating TemperatureVoltage - SupplyGradeSeriesActive Pixel ArrayFrames per SecondQualification
S306SP
THERMAL IMAGING KIT 320X240, 35D
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
320H x 240V
9
-
S209SP
S209SP, STARTER KIT, 200X150, 16
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
200H x 150V
9
-
S304SP
THERMAL CORE STARTER KIT
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
320H x 240V
9
-
S309SP
THERMAL CORE STARTER KIT
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
320H x 240V
9
-
S204SP
THERMAL IMAGE KIT 200X150 35DEG
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
200H x 150V
9
-
S206SP
THERMAL IMAGING KIT 200X150, 21D
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
200H x 150V
9
-
S202SP
S202SP, STARTER KIT, 200X150, 61
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
200H x 150V
9
-
S302NP
S302NP, STARTER KIT, 320X240, 10
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
320H x 240V
9
-
S314SPX
S314SPX, STARTER KIT, 320X240, 5
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
320H x 240V
27
-
S319SPX
THERMAL IMAGING KIT 320X240, 24D
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
320H x 240V
27
-
S216SPX
THERMAL IMAGING KIT 200X150, 21D
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
200H x 150V
32
-
S212SPX
S212SPX, STARTER KIT, 200X150, 6
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
200H x 150V
32
-
S214SPX
S214SPX, STARTER KIT, 200X150, 3
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
200H x 150V
32
-
S219SPX
S219SPX, STARTER KIT, 206X156, 1
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Quantity
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PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
200H x 150V
32
-
S312NPX
S312NPX, STARTER KIT, 320X240, 1
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
320H x 240V
27
-
S316SPX
THERMAL IMAGING KIT 320X240, 35D
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Thermal
12µm x 12µm
Module
Module
-10°C ~ 60°C
3.3V ~ 5V
-
Mosaic Core
320H x 240V
27
-

About  Image Sensors, Camera

The products in the image sensor and camera family encompass component or module-level devices that are employed for electronically capturing visual information in the visible and/or infrared spectrums. These devices typically comprise an array of photosensitive elements that are linked to a shared control and interface mechanism. The range of available products includes those tailored for common still image and video capture, as well as more specialized applications such as thermal and spatial imaging. Image sensors are fundamental components within this family of products, serving as the primary means of converting light into electronic signals. These sensors can be categorized based on their technology, including CCD (Charge-Coupled Device) and CMOS (Complementary Metal-Oxide-Semiconductor) sensors, each with its own distinct advantages and characteristics. Camera modules, on the other hand, are pre-assembled units that integrate essential components such as the image sensor, lens, and supporting electronics. These modules are designed to be easily incorporated into various devices and applications, offering features such as color filtering, resolution, shutter type, frames per second (FPS), and lens mount options to cater to diverse requirements. Furthermore, specialized imaging products cater to specific applications, such as thermal imaging sensors that capture infrared radiation to create thermal images, and spatial imaging sensors used for depth perception and 3D mapping. The versatility of these products makes them suitable for integration into a wide array of devices and systems, including smartphones, digital cameras, security cameras, automotive imaging systems, and industrial imaging equipment. They enable functions such as photography, video recording, thermal imaging, depth sensing, and various forms of visual data capture and analysis. In summary, the products in the image sensor and camera family encompass a range of component or module-level devices used for capturing visual information in the visible and/or infrared spectrums. These products include image sensors, camera modules, and specialized imaging devices, catering to diverse applications such as still image and video capture, thermal imaging, and spatial imaging. They find widespread use in consumer electronics, security systems, automotive applications, and industrial imaging, enabling a variety of visual data capture and analysis capabilities.