Mira220 Series, Image Sensors, Camera

Results:
17
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Series
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Operating Temperature
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Frames per Second
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Results remaining17
Applied Filters:
Mira220
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ImageProduct DetailPriceAvailabilityECAD ModelFrames per SecondTypeOperating TemperaturePackage / CaseSupplier Device PackageGradeSeriesPixel SizeActive Pixel ArrayVoltage - SupplyQualification
MIRA220 2QM1WP FT SE
2.2 MP NIR ENHANCED GLOBAL SHUTT
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Quantity
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PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220 2QM1WA FT SE
2.2 MP NIR ENHANCED GLOBAL SHUTT
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Quantity
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PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QC1D0 RW
RGB BARE DIE- MIRA220 COLOR NIR
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Quantity
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PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220 2QM1WO FT SE
2.2 MP NIR ENHANCED GLOBAL SHUTT
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Quantity
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PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220_SB
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Quantity
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PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220 2QMD0RW FT SE
2.2 MP NIR ENHANCED GLOBAL SHUTT
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QI1D0 RW
RGBIR BARE DIE- MIRA220 COLOR NI
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Quantity
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PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QC1WP 500U FT SE
RGB CSP AR COATING WITH PROTECTI
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Quantity
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PCB Symbol, Footprint & 3D Model
90
-
-
-
-
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QI1WP 500U FT SE
RGBIR CSP PLAIN WITH PROTECTIVE
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Quantity
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PCB Symbol, Footprint & 3D Model
90
-
-
-
-
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QC1WA 500U FT SE
RGB CSP AR COATING WITH PROTECTI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
-
-
-
-
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QI1WA 500U FT SE
RGBIR CSP AR COATING WITH PROTEC
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
-
-
-
-
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QI1WO FT SE
RGBIR CSP PLAIN NO PROTECTIVE FI
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Quantity
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PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QC1WO FT SE
RGB CSP PLAIN NO PROTECTIVE FILM
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QI1WP FT SE
RGBIR CSP PLAIN WITH PROTECTIVE
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QC1WP FT SE
RGB CSP PLAIN WITH PROTECTIVE FI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QI1WA FT SE
RGBIR CSP AR COATING WITH PROTEC
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-
MIRA220-2QC1WA FT SE
RGB CSP AR COATING WITH PROTECTI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
90
-
-
Die
Die
-
Mira220
2.79µm x 2.79µm
1600H x 1400V
-
-

About  Image Sensors, Camera

The products in the image sensor and camera family encompass component or module-level devices that are employed for electronically capturing visual information in the visible and/or infrared spectrums. These devices typically comprise an array of photosensitive elements that are linked to a shared control and interface mechanism. The range of available products includes those tailored for common still image and video capture, as well as more specialized applications such as thermal and spatial imaging. Image sensors are fundamental components within this family of products, serving as the primary means of converting light into electronic signals. These sensors can be categorized based on their technology, including CCD (Charge-Coupled Device) and CMOS (Complementary Metal-Oxide-Semiconductor) sensors, each with its own distinct advantages and characteristics. Camera modules, on the other hand, are pre-assembled units that integrate essential components such as the image sensor, lens, and supporting electronics. These modules are designed to be easily incorporated into various devices and applications, offering features such as color filtering, resolution, shutter type, frames per second (FPS), and lens mount options to cater to diverse requirements. Furthermore, specialized imaging products cater to specific applications, such as thermal imaging sensors that capture infrared radiation to create thermal images, and spatial imaging sensors used for depth perception and 3D mapping. The versatility of these products makes them suitable for integration into a wide array of devices and systems, including smartphones, digital cameras, security cameras, automotive imaging systems, and industrial imaging equipment. They enable functions such as photography, video recording, thermal imaging, depth sensing, and various forms of visual data capture and analysis. In summary, the products in the image sensor and camera family encompass a range of component or module-level devices used for capturing visual information in the visible and/or infrared spectrums. These products include image sensors, camera modules, and specialized imaging devices, catering to diverse applications such as still image and video capture, thermal imaging, and spatial imaging. They find widespread use in consumer electronics, security systems, automotive applications, and industrial imaging, enabling a variety of visual data capture and analysis capabilities.