Modems - ICs and Modules

Results:
407
Manufacturer
Series
Supplier Device Package
Package / Case
Data Format
Voltage - Supply
Baud Rates
Mounting Type
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesMounting TypeSupplier Device PackagePackage / CaseData FormatBaud RatesVoltage - Supply
PMB9647VV2.0
COSIC MODEM KDECT
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
PMB9607VV1.1FL
COSICPLUS KDECT -MODEM DECT/ CAT
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
PSB8301VV1.1
XWAY WAV300 WI-FI CHIPSET
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
USR81-11
CONEXANT USR81 USB MODEM IC
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
USR80-11
CONEXANT USR80 K56 HCF MODEM IC
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
CX81801-32
MODEM, CMOS, PQFP128
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
28-CTLGA (11x6.4)
28-VFCLGA
V.21, V.22, V.22B, V.23, V.32, V.32B, V.34, V.90, Bell 103, Bell 212
56k
3V ~ 3.6V
PMB9643VV2.0
COSIC -MODEM DECT/ CAT-IQ
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
USR80-12
CONEXANT USR80 K56 HCF MODEM IC
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
AD1801JST-REEL
SINGLE-CHIP FAX/DATA/VOICE MODEM
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Quantity
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PCB Symbol, Footprint & 3D Model
AD1801
Surface Mount
128-TQFP (14x20)
128-LQFP
V.34
-
4.75V ~ 5.25V
PMB9603VV1.1FL
COSICPLUS -MODEM DECT/ CAT-IQ
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
SL2434SU
IC MODEM V.34 33.6KBPS
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Quantity
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PCB Symbol, Footprint & 3D Model
SL
Socket
-
-
V.34
-
-
PMB9610WV1.0FL
COSICULC: DECT BASE STATION
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
R6785-23
CONEXANT R6785 ACFL MODEM IC
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
R6764-41
CONEXANT R6764 ACF2 MODEM IC
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
R6758-16
CONEXANT R6758 FAX 9600 IC
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
R6790-22
CONEXANT R6790 ACF2 MODEM IC
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
R6764-39
CONEXANT R6764 ACF2 MODEM IC
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Quantity
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PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
SI2435-D2-FT
IC ISOMODEM SYSTEM-SIDE 24TSSOP
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Quantity
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PCB Symbol, Footprint & 3D Model
-
Surface Mount
24-TSSOP
24-TSSOP (0.173", 4.40mm Width)
V.34
-
3V ~ 3.6V
SI2456-FT
IC ISOMODEM SYSTEM-SIDE 24TSSOP
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Quantity
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PCB Symbol, Footprint & 3D Model
ISOmodem®
Surface Mount
24-TSSOP
24-TSSOP (0.173", 4.40mm Width)
V.21, V.22, V.23, V.32, V.34, V.90, Bell 103, Bell 212A
56k
3V ~ 3.6V
SI2493-C-FSR
IC ISOMODEM SYSTEM-SIDE 16SOIC
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Quantity
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PCB Symbol, Footprint & 3D Model
ISOmodem®
Surface Mount
16-SOIC
16-SOIC (0.154", 3.90mm Width)
V.21, V.22, V.23, V.29, V.32, V.34, V.90, V.92, Bell 103, Bell 212A
-
3V ~ 3.6V

About  Modems - ICs and Modules

Interface Modem ICs and Modules are devices used for modulating or demodulating signals transmitted over telephone or cable lines. These devices allow computers to communicate with one another by converting digital data into analog signals that can be transmitted through these communication channels. Modem ICs and Modules support various data formats such as ASK (Amplitude Shift Keying), FSK (Frequency Shift Keying), Bell 202, HART, and various V-series standards including V.21, V.22, V.23, V.32, V.34, V.90, and V.92. They also offer selectable baud rates, which determine the speed at which data is transmitted, with options including 300, 1.2k, 1.8k, 2.4k, 4.8k, 9.6k, 14.4k, 19.2k, 20k, 33.6k, 38.4k, 56k, and 200k. These devices come in different mounting types, including socket, surface mount, or through-hole, providing flexibility for integration into various electronic systems. They are commonly used in applications where communication over telephone or cable lines is required, such as dial-up internet access, fax machines, and telecommunication equipment. In summary, Interface Modem ICs and Modules are devices that facilitate communication between computers over telephone or cable lines. They support various data formats and baud rates, and are available in different mounting types for easy integration into electronic systems requiring such communication capabilities.