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i.MX8Q Series, Microprocessors
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i.MX8Q
Select | Image | Product Detail | Price | Availability | ECAD Model | Mounting Type | Ethernet | Operating Temperature | Voltage - I/O | Grade | Core Processor | Number of Cores/Bus Width | Speed | RAM Controllers | Graphics Acceleration | SATA | Package / Case | Supplier Device Package | Security Features | Display & Interface Controllers | Co-Processors/DSP | USB | Qualification | Series | Additional Interfaces |
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 | Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | -40°C ~ 125°C (TJ) | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | -40°C ~ 125°C (TJ) | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | -40°C ~ 125°C (TJ) | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | - | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | - | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | -40°C ~ 125°C (TJ) | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 417-BFBGA | 417-FBGA (17x17) | - | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | - | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 417-BFBGA | 417-FBGA (17x17) | - | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | - | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | -40°C ~ 125°C (TJ) | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 417-BFBGA | 417-FBGA (17x17) | - | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | - | ||
| Contact us | Contact us | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | - | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | - |
About Microprocessors
Microprocessors are specialized microprocessors designed for integration into embedded systems, which are dedicated computer systems tailored to perform specific tasks within devices or machinery. These microprocessors are optimized for low power consumption, real-time processing, and seamless integration with other components. Their functionality lies in providing computational power and control capabilities within the embedded system, often featuring customized peripherals, interfaces, or instruction sets to meet the specific requirements of the application.
They find applications in a wide array of fields, including automotive electronics (engine control units, infotainment systems), industrial automation (programmable logic controllers, robotic control), medical devices (patient monitoring systems, implantable devices), consumer electronics (smartphones, wearables), and home automation. Embedded microprocessors support the diverse computing needs of these industries, offering tailored performance and functionality to drive the operations of modern embedded systems.
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