Infineon Technologies

Infineon Technologies

Infineon Technologies is a global leader in semiconductor solutions, offering a comprehensive portfolio of products and services for various industries. With a strong focus on innovation and sustainability, Infineon provides advanced semiconductor solutions that power electronic devices, enabling applications in areas such as automotive, industrial, renewable energy, and digital security. The company's product range includes microcontrollers, power management ICs, sensors, RF components, and automotive solutions. Infineon's cutting-edge technologies are designed to enhance energy efficiency, improve performance, and ensure the highest level of reliability. As a trusted partner, Infineon collaborates closely with customers to develop tailored solutions that address their specific needs and help them stay ahead in a rapidly changing market. With a commitment to environmental responsibility, the company strives to reduce its environmental footprint through sustainable practices and offers eco-friendly solutions. Infineon's dedication to quality, innovation, and customer satisfaction has solidified its position as a leading player in the semiconductor industry.

Microphones

Results:
18
Series
Current - Supply
S/N Ratio
Sensitivity
Frequency Range
Height (Max)
Size / Dimension
Voltage - Rated
Voltage Range
Output Type
Direction
Ratings
Port Location
Shape
Termination
Type
Impedance
Results remaining18
Applied Filters:
Infineon Technologies
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ImageProduct DetailPriceAvailabilityECAD ModelSeriesVoltage - RatedShapeTerminationImpedanceRatingsCurrent - SupplyHeight (Max)Size / DimensionTypeOutput TypeDirectionFrequency RangeSensitivityS/N RatioVoltage RangePort Location
IM69D120V01XTSA1
MICROPHONE MEMS DIGITAL PDM OMNI
1+
$2.7887
5+
$2.6338
10+
$2.4789
Quantity
19,080 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
-
Rectangular
Solder Pads
-
-
1.3 mA
0.051" (1.30mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Digital, PDM
Omnidirectional
20 Hz ~ 20 kHz
-26dB ±1dB
-
1.62 V ~ 3.6 V
Bottom
IM69D130V01XTSA1
MICROPHONE MEMS DIGITAL PDM OMNI
1+
$2.5352
5+
$2.3944
10+
$2.2535
Quantity
8,500 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
-
-
Rectangular
Solder Pads
-
-
1.3 mA
0.051" (1.30mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Digital, PDM
Omnidirectional
20 Hz ~ 20 kHz
-36dB ±1dB @ 94dB SPL
69dB
1.62 V ~ 3.6 V
Bottom
IM73A135V01XTSA1
MICROPHONES_DIFFERENTIAT PG-LLGA
1+
$2.9662
5+
$2.8014
10+
$2.6366
Quantity
7,826 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
XENSIV™
2.75 V
Rectangular
Solder Pads
-
-
170 µA
0.039" (1.00mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Analog
Noise Cancelling
28 Hz ~ 1 kHz
-38dB
73dB
1.52 V ~ 3 V
Top
IM72D128V01XTMA1
1+
$3.0676
5+
$2.8972
10+
$2.7268
Quantity
3,056 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
XENSIV™
1.8 V
Rectangular
Solder Pads
-
IP67 - Dust Tight, Waterproof
1 mA
0.051" (1.30mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Digital, PDM
Omnidirectional
20 Hz ~ 19 kHz
-36dB ±1dB @ 94dB SPL
71.5dB
1.62 V ~ 3.6 V
Top
IM67D130AXTSA2
IC MEMS DGTL XENSIV LLGA-5
1+
$2.2817
5+
$2.1549
10+
$2.0282
Quantity
694 Available
Can ship immediately
Ships from: HK
PCB Symbol, Footprint & 3D Model
Automotive, AEC-Q103, XENSIV™
-
Rectangular
Solder Pads
-
-
980 µA
0.051" (1.30mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Digital, PDM
Noise Cancelling
20 kHz ~ 20 kHz
-36dB ±1dB @ 94dB SPL
67dB
1.62 V ~ 3.6 V
Bottom
IM66D120AXTMA1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
IM66D130AXTMA1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
IM69D130V11XTSA2
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
XENSIV™
-
Rectangular
Solder Pads
-
-
980 µA
0.047" (1.20mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Digital, PDM
Noise Cancelling
-
-36dB ±1dB @ 94dB SPL
69dB
1.62 V ~ 3.6 V
Bottom
IM68A130AXTMA1
AEC-Q103 QUALIFIED HIGH PERFORMA
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Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Automotive, AEC-Q103, XENSIV™
2.6 V
Rectangular
Solder Pads
400 Ohms
-
135 µA
0.038" (0.98mm)
0.132" L x 0.098" W (3.35mm x 2.50mm)
MEMS (Silicon)
Analog
Noise Cancelling
10 Hz ~ 17 kHz
-38dB
68dB
2.4 V ~ 3.6 V
Bottom
IM70A135V01XTMA1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Rectangular
Solder Pads
-
IP57 - Dust Protected, Waterproof
170 µA
0.039" (1.00mm)
0.138" L x 0.104" W (3.50mm x 2.65mm)
MEMS (Silicon)
Analog
Noise Cancelling
-
-38dB
70dB
1.52 V ~ 3 V
Bottom
IM68A130V01XTMA1
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Rectangular
Solder Pads
-
-
110 µA
0.039" (0.98mm)
0.132" L x 0.098" W (3.35mm x 2.50mm)
MEMS (Silicon)
Analog
Noise Cancelling
-
-38dB @ 130dB SPL
68dB
2.4 V ~ 3.6 V
Top
IM70D122V01XTMA1
MIC MEMS DIGITAL PDM -26DB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Rectangular
Solder Pads
-
IP57 - Dust Protected, Waterproof
980 µA
0.039" (1.00mm)
0.138" L x 0.104" W (3.50mm x 2.65mm)
MEMS (Silicon)
Digital, PDM
-
-
-26dB ±1dB
70dB
1.62 V ~ 3.6 V
Bottom
IM69D128SV01XTMA1
MIC MEMS DIGITAL PDM NC -37DB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Rectangular
Solder Pads
-
IP57 - Dust Protected, Waterproof
520 µA
0.039" (1.00mm)
0.138" L x 0.104" W (3.50mm x 2.65mm)
MEMS (Silicon)
Digital, PDM
Noise Cancelling
-
-37dB ±1dB @ 128dB SPL
69dB
1.62 V ~ 3.6 V
Bottom
IM67D130AXTSA1
MIC MEMS DIGITAL PDM NC -36DB
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
Automotive, AEC-Q103, XENSIV™
-
Rectangular
Solder Pads
-
-
980 µA
-
-
MEMS (Silicon)
Digital, PDM
Noise Cancelling
-
-36dB
67dB
1.62 V ~ 3.6 V
Bottom
IM73D122V01XTMA1
MICROPHONES_DIFFERENTIAT PG-LLGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
XENSIV™
1.8 V
Rectangular
Solder Pads
-
IP57 - Dust Protected, Waterproof
1.12 mA
0.051" (1.30mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Digital, PDM
Omnidirectional
20 Hz ~ 19 kHz
-26dB ±1dB @ 94dB SPL
73dB
1.62 V ~ 3.6 V
Top
IM69D127V11XTMA1
MICROPHONES_DIFFERENTIAT PG-TLGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
-
-
Rectangular
-
-
-
-
0.039" (1.00mm)
0.142" L x 0.098" W (3.60mm x 2.50mm)
MEMS (Silicon)
Digital, PDM
Noise Cancelling
20 Hz ~ 20 kHz
-
69dB
-
Bottom
IM67D120AXTSA1
INTEGRATED PRESSURE SENS PG-LLGA
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
XENSIV™
-
Rectangular
Solder Pads
-
-
1.3 mA
0.051" (1.30mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Digital, PDM
Omnidirectional
20 Hz ~ 20 kHz
-26dB ±1dB @ 94dB SPL
67dB
1.62 V ~ 3.6 V
Bottom
IM72D128V01XTSA1
IP57 DUST AND WATER RESISTANT DI
Contact us
Quantity
Contact us
PCB Symbol, Footprint & 3D Model
XENSIV™
-
Rectangular
Solder Pads
-
IP57 - Dust Protected, Waterproof
980 µA
0.047" (1.20mm)
0.157" L x 0.118" W (4.00mm x 3.00mm)
MEMS (Silicon)
Digital, PDM
Noise Cancelling
-
-36dB ±1dB @ 94dB SPL
72dB
1.62 V ~ 3.6 V
Bottom

Microphones

Microphones are electronic devices that convert sound waves into electrical signals. This conversion allows for various applications, including storing, transmitting, and rebroadcasting audio. Microphones come in a wide range of designs to suit different needs. There are large boom-style microphones, commonly used in professional recording studios and broadcasting settings, known for their high-quality audio capture. On the other hand, there are smaller and more popular MEMS (MicroElectroMechanical System) microphones, often found in consumer electronics like smartphones and wearable devices due to their compact size and efficiency. These microphones are differentiated by several factors. Impedance refers to the electrical resistance of the microphone's output signal and impacts its compatibility with different audio systems. Voltage rating determines the maximum voltage that can be applied to the microphone without causing damage. Sensitivity refers to the microphone's ability to capture sound accurately and is usually measured in decibels per Pascal (dB/Pa). The frequency range indicates the range of frequencies the microphone can effectively capture, ensuring accurate reproduction of different audio sources. Port location refers to the placement of the microphone's input or output ports, which can affect its suitability for specific applications. Overall size and mounting type play a role in determining the microphone's physical form, making it suitable for different setups and installations. Additionally, microphones offer various output interfaces to connect with audio systems. Analog output interfaces provide a continuous electrical signal that corresponds to the captured sound. I2S (Inter-IC Sound), PDM (Pulse-Density Modulation), and TDM (Time-Division Multiplexing) are digital output interfaces that allow for efficient transmission of audio data between microphones and other devices. By considering these factors, individuals and professionals can choose the right microphone to meet their specific requirements, ensuring optimal sound capture and quality in various applications.