BeStar Technologies, Inc.

BeStar Technologies, Inc.

Established in 2002, BeStar Electronics Co., Ltd is a global technology enterprise based in Jiangsu, China. The company specializes in the development, production, and sales of electro-acoustic products, including loudspeakers, piezo buzzers, and magnetic buzzers. BeStar Technologies Inc. has been serving North American customers since 2004, as part of BeStar's commitment to supporting global clientele. Leveraging advanced technology and professional expertise, the company has built an extensive portfolio of high-performance acoustic products.

Microphones

Results:
18
Series
S/N Ratio
Sensitivity
Size / Dimension
Frequency Range
Height (Max)
Voltage Range
Current - Supply
Termination
Voltage - Rated
Impedance
Shape
Type
Output Type
Ratings
Port Location
Direction
Results remaining18
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BeStar Technologies, Inc.
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ImageProduct DetailPriceAvailabilityECAD ModelVoltage - RatedCurrent - SupplyOutput TypeTerminationImpedanceRatingsSeriesHeight (Max)TypeDirectionFrequency RangeSensitivityS/N RatioVoltage RangePort LocationShapeSize / Dimension
SPM04C-38/1186
MIC PIEZO MEMS ANLG OMNI -38DB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
150 mA
Analog
Solder Pads
-
IP68 - Dust Tight, Waterproof
SPM
0.039" (1.00mm)
Piezo MEMS
Omnidirectional
250 Hz ~ 10 kHz
-38dB ±3dB
60dB
1.6 V ~ 3.6 V
Top
Rectangle
0.144" L x 0.112" W (3.66mm x 2.85mm)
SMO04C-38/1316
MIC MEMS ANALOG OMNI -38DB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.2 mA
Analog
Solder Pads
-
-
SMO
0.043" (1.10mm)
MEMS (Silicon)
Omnidirectional
100 Hz ~ 10 kHz
-38dB ±1dB
63dB
1.6 V ~ 3.6 V
Top
Rectangle
0.148" L x 0.116" W (3.76mm x 2.95mm)
SMO05A-42/1316
MIC MEMS ANALOG OMNI -42DB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
200 µA
Analog
Solder Pads
300 Ohms
-
-
0.043" (1.10mm)
MEMS (Silicon)
Omnidirectional
100 Hz ~ 10 kHz
-42dB ±3dB
55dB
1.5 V ~ 3.6 V
Top
Rectangular
0.148" L x 0.088" W (3.76mm x 2.24mm)
SDMO07D-36/1363
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Quantity
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PCB Symbol, Footprint & 3D Model
1.8 V
-
Analog
Solder Pads
-
-
-
0.047" (1.20mm)
MEMS (Silicon)
Omnidirectional
-
-36dB ±3dB
68dB
1.62 V ~ 3.6 V
Top
Rectangular
0.157" L x 0.118" W (4.00mm x 3.00mm)
BCM4013OSBC-42
MIC COND ANLG OMNI -42DB 0.157"D
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Quantity
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PCB Symbol, Footprint & 3D Model
2 V
0.5 mA
Analog
Solder Pads
2.2 kOhms
-
BCM
0.051" (1.30mm)
Electret Condenser
Omnidirectional
50 Hz ~ 12 kHz
-42dB ±3dB
58dB
1 V ~ 12 V
Top
Circular
0.157" Dia (4.00mm)
SMO08C-38/1317
MIC MEMS ANALOG OMNI -38DB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
0.2 mA
Analog
Solder Pads
300 Ohms
-
SMO
0.039" (0.98mm)
MEMS (Silicon)
Omnidirectional
-
-38dB ±1dB
65dB
105 V ~ 3.6 V
Top
Rectangle
0.122" L x 0.104" W (3.10mm x 2.65mm)
SMO04A-42/1316
MIC MEMS ANALOG OMNI -42DB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
200 µA
Analog
Solder Pads
300 Ohms
-
-
0.043" (1.10mm)
MEMS (Silicon)
Omnidirectional
100 Hz ~ 10 kHz
-42dB ±1dB
59dB
1.6 V ~ 3.6 V
Top
Rectangular
0.148" L x 0.116" W (3.76mm x 2.95mm)
BCM4013OLFC-42-JST-ZHR-2
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Quantity
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PCB Symbol, Footprint & 3D Model
2 V
0.5 mA
Analog
Wire Leads with Connector
-
-
BCM
0.051" (1.30mm)
Electret Condenser
Omnidirectional
50 Hz ~ 16 kHz
-42dB ±3dB
58dB
1 V ~ 10 V
Top
Circular
0.157" Dia (4.00mm)
HBO0302C-58/1248
MIC COND ANLG OMNI -38DB 0.118"D
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Quantity
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PCB Symbol, Footprint & 3D Model
2 V
0.5 mA
Analog
Wire Leads
-
-
HBO
0.059" (1.50mm)
Electret Condenser
Omnidirectional
20 Hz ~ 20 kHz
-38dB ±3dB
65dB
1 V ~ 10 V
Top
Circular
0.118" Dia (3.00mm)
BCM9750ULF-47J50
MIC COND ANLG OMNI -47DB 0.382"D
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Quantity
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PCB Symbol, Footprint & 3D Model
2 V
0.5 mA
Analog
Wire Leads with Connector
-
-
BCM
0.205" (5.20mm)
Electret Condenser
Omnidirectional
100 Hz ~ 10 kHz
-47dB ±3dB
58dB
1 V ~ 10 V
Top
Circular
0.382" Dia (9.70mm)
HBO0803A-48/1341
MIC COND ANLG OMNI -28DB 0.315"D
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Quantity
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PCB Symbol, Footprint & 3D Model
3 V
500 µA
Analog
-
2.2 kOhms
-
-
-
Electret Condenser
Omnidirectional
20 Hz ~ 10 kHz
-28dB ±3dB
78dB
1 V ~ 10 V
Top
Circular
0.315" Dia (8.00mm)
HBO0303C-60
MIC COND ANLG OMNI -40DB 0.118"D
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Quantity
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PCB Symbol, Footprint & 3D Model
3 V
500 µA
Analog
-
2.2 kOhms
-
-
-
Electret Condenser
Omnidirectional
20 Hz ~ 10 kHz
-40dB ±3dB
64dB
1 V ~ 10 V
-
Circular
0.118" Dia (3.00mm)
SMO07C-38/1348
MIC MEMS ANALOG OMNI -38DB
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Quantity
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PCB Symbol, Footprint & 3D Model
-
250 µA
Analog
Solder Pads
400 Ohms
-
-
0.047" (1.20mm)
MEMS (Silicon)
Omnidirectional
100 Hz ~ 10 kHz
-38dB ±1dB
70dB
1.9 V ~ 3 V
Top
Rectangular
0.118" L x 0.157" W (3.00mm x 4.00mm)
SDMO07C-26/1281
MIC MEMS DIG OMNI 0.157LX0.118"W
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Quantity
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PCB Symbol, Footprint & 3D Model
-
-
Digital
Solder Pads
-
-
0.039" (1.00mm)
MEMS (Silicon)
Omnidirectional
-
-
65dB
-
Top
Rectangle
0.157" L x 0.118" W (4.00mm x 3.00mm)
HBO0603H-50/1340
MIC COND ANLG OMNI -30DB 0.236"D
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Quantity
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PCB Symbol, Footprint & 3D Model
3 V
500 µA
Analog
-
2.2 kOhms
-
-
-
Electret Condenser
Omnidirectional
20 Hz ~ 10 kHz
-30dB ±3dB
76dB
1 V ~ 10 V
Top
Circular
0.236" Dia (6.00mm)
HBO0603B-52/1338
MIC COND ANLG OMNI -32DB 0.236"D
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Quantity
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PCB Symbol, Footprint & 3D Model
3 V
500 µA
Analog
PC Pins
2.2 kOhms
-
-
-
Electret Condenser
Omnidirectional
20 Hz ~ 10 kHz
-32dB ±3dB
74dB
1 V ~ 10 V
-
Circular
0.236" Dia (6.00mm)
HBO0403D-57/1335
MIC COND ANLG OMNI -37DB 0.157"D
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Quantity
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PCB Symbol, Footprint & 3D Model
3 V
500 µA
Analog
PC Pins
2.2 kOhms
-
-
-
Electret Condenser
Omnidirectional
20 Hz ~ 10 kHz
-37dB ±3dB
68dB
1 V ~ 10 V
-
Circular
0.157" Dia (4.00mm)
HBO1003D-46/1342
MIC COND ANLG OMNI -26DB 0.382"D
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Quantity
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PCB Symbol, Footprint & 3D Model
3 V
500 µA
Analog
-
2.2 kOhms
-
-
-
Electret Condenser
Omnidirectional
20 Hz ~ 10 kHz
-26dB ±3dB
80dB
1 V ~ 10 V
Top
Circular
0.382" Dia (9.70mm)

About  Microphones

Microphones are electronic devices that convert sound waves into electrical signals. This conversion allows for various applications, including storing, transmitting, and rebroadcasting audio. Microphones come in a wide range of designs to suit different needs. There are large boom-style microphones, commonly used in professional recording studios and broadcasting settings, known for their high-quality audio capture. On the other hand, there are smaller and more popular MEMS (MicroElectroMechanical System) microphones, often found in consumer electronics like smartphones and wearable devices due to their compact size and efficiency. These microphones are differentiated by several factors. Impedance refers to the electrical resistance of the microphone's output signal and impacts its compatibility with different audio systems. Voltage rating determines the maximum voltage that can be applied to the microphone without causing damage. Sensitivity refers to the microphone's ability to capture sound accurately and is usually measured in decibels per Pascal (dB/Pa). The frequency range indicates the range of frequencies the microphone can effectively capture, ensuring accurate reproduction of different audio sources. Port location refers to the placement of the microphone's input or output ports, which can affect its suitability for specific applications. Overall size and mounting type play a role in determining the microphone's physical form, making it suitable for different setups and installations. Additionally, microphones offer various output interfaces to connect with audio systems. Analog output interfaces provide a continuous electrical signal that corresponds to the captured sound. I2S (Inter-IC Sound), PDM (Pulse-Density Modulation), and TDM (Time-Division Multiplexing) are digital output interfaces that allow for efficient transmission of audio data between microphones and other devices. By considering these factors, individuals and professionals can choose the right microphone to meet their specific requirements, ensuring optimal sound capture and quality in various applications.